應用於6G通訊D-頻段於玻璃基板之水平極化一維端射韋瓦第陣列天線封裝

Abstract

本篇論文研究內容分為三部分，第一部分利用Corning Eagle XG (EXG)玻璃基板製程設計操作在次太赫茲頻段的微帶線、接地共平面波導與開槽型接地共平面波導，適當的開槽設計可以有效減少傳輸線整體損耗，接地共平面波導開槽後在150GHz減少約37%的損耗，在300GHz減少約36%的損耗。接著設計DC-300GHz頻段的覆晶轉接以應用在未來天線陣列晶片整合封裝，模擬結果在全頻段的S11皆小於-10dB，S21最低為-0.9dB。最後比較三種覆晶轉接特性且歸納出轉接結合開槽型接地共平面波導能改善150-300GHz的不匹配，並減少1.4dB/mm的損耗。 第二部分說明140GHz天線陣列晶片整合封裝的疊構，接著以TSRI的RO4003C兩層板設計11GHz本地振盪器傳輸線並透過BGA錫球進行垂直訊號轉接。接著量測兩種組裝方式的特性，S11在11GHz達到匹配但整體頻寬與損耗較差，未來在更高頻的應用上需解決兩端阻抗不連續及組裝的問題。 第三部分利用EXG玻璃基板製程與TSRI石英IPD基板製程設計水平極化一維端射韋瓦第天線陣列。1x4天線陣列波束掃描範圍在EXG玻璃基板達到-52°~53°，在石英IPD基板達到-72°~72°。接著石英IPD基板天線經由下針量測驗證出天線單元在140GHz的S11為-13.5dB，頻寬從111-162GHz為51GHz；1x4天線陣列在140GHz的S11為-10.6dB，頻寬從110-170GHz為60GHz達到全頻段匹配。二維場型量測受限於暗室是設計用來量測broadside天線輻射特性，在φ=0°與θ=-90°方向的端射增益較低，因此改以θ=-70°即南緯20°方向做比較，天線單元在140GHz最大增益為7.9dBi，θ=-70°平面半功率波束寬度為130°；1x4天線陣列在140GHz最大增益為11.3dBi，θ=-70°平面半功率波束寬度為26°。

This thesis is divided into three parts. The first part involves the design of sub-THz band microstrip line, grounded coplanar waveguide (GCPW) and slotted GCPW on Corning Eagle XG (EXG) glass substrate. Proper slot design could effectively reduce transmission line loss. Slotted GCPW reduces loss by approximately 37% at 150GHz and 36% at 300GHz. Next, a flip-chip transition operating at DC-300GHz is designed for integrating antenna array with chip in the same package. Simulation shows that S11 in entire band is less than -10dB, and at 300GHz has the largest S21 which is -0.9dB. Finally, the properties of three types of flip-chip transition are compared, concluding that flip-chip combined with slotted GCPW could improve the mismatch in 150-300GHz and reduce loss by 1.4dB/mm. The second part introduces the stack of 140GHz antenna array with chip in package, then uses TSRI RO4003C 2-L PCB to design 11GHz LO vertical signal transition between substrates with BGA balls. Measurements of two assembly methods show that S11 reaches matching at 11GHz but the overall bandwidth and loss is improvable. To solve this problem, we need to solve the impedance discontinuity at both sides of substrate and use stable assembly method for further higher frequency applications. The third part involves the design of horizontally-polarized one-dimensional end-fire Vivaldi antenna array using EXG glass and quartz IPD substrate. Beam steering range of 1x4 array on EXG glass reaches -52°~53° while quartz IPD substrate reaches -72°~72°. Next, quartz IPD antenna performance are measured. For S11 at 140GHz, element antenna reaches -13.5dB and bandwidth covering 111-162GHz; 1x4 array reaches -10.6dB and bandwidth covering 110-170GHz. For 2D radiation pattern, since the chamber is built for measuring broadside antenna radiation, antenna end-fire gain at φ=0° and θ=-90° direction is degraded. Instead, x-y cut at θ=-70° is used to compare with simulation results. At 140GHz element has peak gain 7.9dBi and HPBW 130°; 1x4 array has peak gain 11.3dBi and HPBW 26°.