請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/92973完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 陳忠仁 | zh_TW |
| dc.contributor.advisor | Chung-Jen Chen | en |
| dc.contributor.author | 范文轅 | zh_TW |
| dc.contributor.author | Wen-Yuan Fan | en |
| dc.date.accessioned | 2024-07-10T16:07:08Z | - |
| dc.date.available | 2024-07-11 | - |
| dc.date.copyright | 2024-07-10 | - |
| dc.date.issued | 2024 | - |
| dc.date.submitted | 2024-07-04 | - |
| dc.identifier.citation | 1. Ansoff, H. I., (1957). "Strategies for Diversification", Harvard Business Review, Sep-Dec, pp.113-124.
2. Ansoff, H. I., (1965). Corporate Strategy, New York: McGraw-Hill Press. 3. Argote, L. (2012). Organizational Learning: Creating, Retaining and Transferring Knowledge. New York: Springer Science & Business Media. 4. Porter, M. E. (1979). How Competitive Forces Shape Strategy. Harvard Business Review, March–April, 57(2): 137–145. 5. Porter, M. E. (2008). The five competitive forces that shape strategy. Harvard business review, 86(1), 78-93. 6. Porter, M. E. (1985). The Competitive Advantage: Creating and Sustaining Superior Performance. New York: Free Press. 7. Porter, M. E. (1980). Competitive Strategy: Techniques for Analyzing Industries and Competitors. New York: Free Press. 8. Prahalad, C.K. and Hamel, G. (1990). The Core Competence of the Corporation. Harvard Business Review, 79-91. 9. Teece, D. J., Pisano, G., & Shuen, A. (1997). Dynamic Capabilities and Strategic Management. Strategic Management Journal, 18(7), 509-533. tw/BCG%E7%9F%A9%E9%99%A3 10. Yole,Wireless Connectivity RF Front-End Technologies for Consumer Market 2021,https://www.yolegroup.com/product/report/wireless-connectivity-rf-front-end-technologies-for-consumer-market-2021/。 11. Zion Research,Gallium Arsenide (GaAs) Radio Frequency (RF) Semiconductor Industry Perspective:,https://www.zionmarketresearch.com/report/gallium-arsenide-gaas-radio-frequency-rf-semiconductor-market。 12. PIC magazine, Next stop for InP: consumer applications, https://picmagazine.net/article/115516/Next_stop_for_InP_consumer_applications. 13. Extraplote, Gallium Arsenide (GaAs) RF Devices Market Report 2022-2030, https://www.extrapolate.com/semiconductor-electronics/gallium-arsenide-gaas-rf-devices-market/25710. 14. Yole 2021, Wireless Connectivity RF Front-End Technologies for Consumer Market 2021, https://www.yolegroup.com/product/report/wireless-connectivity-rf-front-end-technologies-for-consumer-market-2021. 15. CCS Insight, Mobile Phone Demand Set to Face Further Challenges in 2023, https://www.ccsinsight.com/company-news/mobile-phone-demand-set-to-face-further-challenges-in-2023. 16. Yole2022, RF front-end: at the heart of the turmoil, https://www.yolegroup.com/press-release/rf-front-end-at-the-heart-of-the-turmoil/ 17. Yole,VCSEL market overview, https://medias.yolegroup.com/uploads/2021/07/YINTR21171-VCSELs-Technology-and-Market-Trends-2021. 18. Microwave journal 2023, RF GaN Market, https://www.microwavejournal.com/articles/40629-rf-gan-market-broadens-its-appeal-with-an-appetite-for-gan-on-silicon. 19. Yole, RF GaN: telecom infrastructure takes the lead, https://www.yolegroup.com/press-release/rf-gan-telecom-infrastructure-takes-the-lead. 20. Yole 2022, InP Wafer, Epiwafer and Device Market 2021, https://www.yolegroup.com/media-gallery/inp-wafer-epiwafer-and-device-market-2021-photonics-and-rf-applications-2020-2026-inp-photonics-bare-die-market-forecast-split-by-application. 21. 維基百科,BCG矩陣,https://zh.wikipedia.org/zh-。 22. 陳忠仁,策略管理:競爭優勢與經營發展,華泰文化,台北,2022。 23. LED inside,iPhone X 臉部解鎖的關鍵元件:VCSEL,https://www.ledinside.com.tw/news/20180117-34941.html. 24. 張翼,何旻穎,GaN半導體產業趨勢,https://www.pida.org.tw/main/article_show/0239。 25. Next Forum,在化合物半導體領域 台灣是否仍有一席之地?,https://edge.aif.tw/hhri-0915-yole/。 26. 穩懋半導體官方網站及年報,https://www.winfoundry.com/zh-TW/。 27. 宏捷科技官方網站及年報,https://www.awsc.com.tw/。 28. 環宇通訊半導體官方網站及年報,https://gcsincorp.com/tc/about/company_profile.php。 29. 三安光電半導體官方網站與年報,https://www.sanan-e.com/。 30. 王英裕,無線通訊IC製程技術探微,https://www.ctimes.com.tw/DispArt-tw.asp?O=HJM959BDTS8AR-STDD. | - |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/92973 | - |
| dc.description.abstract | 蘋果電腦公司在2007年發表第一部具備觸控功能的智慧型手機,就此開始智慧型手機以及攜帶型裝置蓬勃發展,無線通訊的需求大增,讓砷化鎵的射頻晶片使用量爆炸性成長,近幾年來,5G、雲端儲存以及高效能運算等新科技領域嶄露頭角,自動駕駛車的嶄新概念被提出來,健康議題讓各類型的生物感測器受到重視,新的科技伴隨著人的生活,無所不在,於是,除了矽晶片,化合物半導體的應用更是遍地開花,氮化鎵除了能夠做出發光二極體外,其耐高溫耐壓以及功率密度極高的特性更是高頻率基地台的重要角色,無線通訊的連結仍要透過長距離光纖,使得磷化銦的高速傳輸元件更為重要。另外生物感測涵蓋了臉部辨識,血氧心律等感測器的晶片需求被世人發現,無人自駕車的雷射光達大舉革命車用電子領域,化合物半導的市場邁入全新的領域。本研究以個案分析法,化合物半導體晶圓代工產業代表性公司「穩懋報導體」為例,探討其晶圓代工環境及產業關鍵因素、主要與次要競爭者、產品事業組合、公司層級策略、事業競爭策略。本文透過相關文獻與資料的蒐集與延伸討論,分析化合物半導體晶圓代工的產業現況、競爭態勢與未來趨勢,利用五力分析、BCG 矩陣等分析工具,得出以下結論,在砷化鎵射頻無線晶片穩定成長下,穩懋透過有機成長並搭配積極的多角化發展涵蓋化合物半導體的新機會,包含氮化鎵射頻領域、面射型雷射以及磷化銦的光電相關元件。穩懋亦向前布局上游的磊晶片自主能力,並且部分向後整合晶片測試與挑揀的製程,達到垂直整合。而明星產業面射型雷射則需要調整策略為廣泛的差異化服務,與競爭對手達到差異化,氮化鎵與磷化銦的事業則已經看到機會,待需求爆發,穩懋的技術能力已經完備,準備挑戰下一個成長高峰。 | zh_TW |
| dc.description.abstract | "Apple Computer Inc. introduced the first touchscreen smartphone in 2007, marking the beginning of the rapid development of smartphones and portable devices. The demand for wireless communication surged, leading to explosive growth in the use of gallium arsenide (GaAs) radio frequency (RF) chips. In recent years, emerging technologies such as 5G, cloud computing, and high-performance computing have gained prominence. Concepts like autonomous driving have revolutionized the automotive electronics field, and health-related issues have underscored the importance of various types of biosensors.
New technologies have become ubiquitous in people’s lives, and their applications extend beyond silicon chips. Compound semiconductors have flourished, with gallium nitride (GaN) playing a crucial role not only in light-emitting diodes (LEDs) but also due to its high-temperature resistance, high electric-field, and exceptionally high power density, making it essential for high-frequency base stations. Additionally, long-distance optical fibers remain crucial for wireless communication, emphasizing the significance of indium phosphide (InP) high-speed transmission components. Biological sensing encompasses various sensors, including facial recognition and blood oxygen monitoring. The LiDAR in autonomous vehicles has significantly transformed the automotive sector. The compound semiconductor market is raising. This study employs a case analysis approach, focusing on Win Semiconductors, a representative company in the compound semiconductor wafer foundry industry. We explore WIN Semi’s wafer foundry environment, key industry factors, primary and secondary competitors, product portfolio, corporate-level strategies, and business competitive strategies. By collecting and analyzing relevant literature and data, we assess the current state, competitive landscape, and future trends of compound semiconductor wafer foundry services. Utilizing tools such as Porter’s Five Forces analysis and the BCG matrix, we draw the following conclusions: Stable growth in GaAs RF Chips: Given the stable growth in GaAs RF wireless chips, WIN Semi leverages organic growth and proactive diversification to seize new opportunities in compound semiconductors. These opportunities include GaN RF applications, edge-emitting lasers, and optoelectronic components based on InP. Vertical Integration and Technological Competence: WIN Semi strategically positions itself upstream by enhancing its epitaxial wafer capabilities. Additionally, partial backward integration into chip testing and sorting processes achieves vertical integration. Differentiation Strategy for VCSELs: The star industry of VCSELs requires an adjustment in strategy to provide extensive differentiation services, aligning with competitors’ differentiation approaches. Anticipating Demand Surge: Opportunities in GaN and InP businesses are already visible, awaiting demand surges. WIN Semi’s technological capabilities are well-prepared to ride the next revenue wave." | en |
| dc.description.provenance | Submitted by admin ntu (admin@lib.ntu.edu.tw) on 2024-07-10T16:07:07Z No. of bitstreams: 0 | en |
| dc.description.provenance | Made available in DSpace on 2024-07-10T16:07:08Z (GMT). No. of bitstreams: 0 | en |
| dc.description.tableofcontents | 致謝 i
中文摘要 ii Abstract iii 目次 v 圖目次 viii 表目次 x 第一章 緒論 1 1.1 研究動機 1 1.2 研究問題與目的 2 1.3 研究方法及限制 2 第二章 文獻探討 3 2.1 產業五力分析 3 2.2 資源基礎理論 6 2.3 事業組合分析 8 2.4競爭策略分析 10 第三章 產業分析 12 3.1 產品範圍 12 3.1.1砷化鎵射頻元件(GaAs RF devices) 12 3.1.2氮化鎵射頻元件(GaN RF devices) 13 3.1.3面射型雷射(VCSEL) 13 3.1.4磷化銦光電元件(InP photonics devices) 13 3.2 化合物半導體晶圓產業現況 14 3.3 砷化鎵射頻元件(GaAs RF Devices) 16 3.3.1產業概況 16 3.3.2產業技術與市場分析 17 3.3.3 砷化鎵射頻元件主要競爭者分析 20 3.3.4 五力分析與產業關鍵因素 27 3.4 面射型雷射(VCSEL) 30 3.4.1產業概況市場分析 30 3.4.2主要競爭者分析 32 3.4.3 五力分析與產業關鍵因素 34 3.5 氮化鎵射頻元件(GaN RF device) 37 3.5.1產業概況市場分析 37 3.5.2主要競爭者分析 39 3.5.3 五力分析與產業關鍵因素 41 3.6 磷化銦光電元件(InP Photonics devices) 45 3.6.1產業概況與市場分析 45 3.6.2主要競爭者分析 46 3.6.3 五力分析與產業關鍵因素 49 第四章 個案公司分析 53 4.1 公司介紹 53 4.1.1 公司發展歷史 53 4.1.2 營收與獲利能力 55 4.1.3 主要產品與營收來源 58 4.1.4 組織架構 61 4.2 企業資源、能力與活動 62 4.2.1 穩懋的有形資源 62 4.2.2 穩懋的無形資源 63 4.2.3 穩懋策略與活動系統圖 64 4.2.4 穩懋資源能力對應產業關鍵指標 65 4.2.5 穩懋資源能力對應競爭對手分析 67 4.3 財務分析 69 4.3.1 短期償債能力 69 4.3.2 長期償債能力 70 4.3.3資產管理與周轉率 71 4.3.4獲利能力 73 4.4 事業組合分析 73 4.5 成長策略與作法 78 4.6 事業策略與作法 79 第五章 結論與建議 83 5.1 研究結論 83 5.1.1 化合物半導體產業環境及產業關鍵因素結論 83 5.1.2 穩懋的事業組合以及成長策略結論 85 5.1.3 穩懋的競爭策略結論 86 5.2 研究建議 87 5.2.1 研究建議 87 參考文獻 88 | - |
| dc.language.iso | zh_TW | - |
| dc.subject | 化合物半導體 | zh_TW |
| dc.subject | 代工 | zh_TW |
| dc.subject | 五力分析 | zh_TW |
| dc.subject | 競爭策略 | zh_TW |
| dc.subject | 晶片 | zh_TW |
| dc.subject | five forces analysis | en |
| dc.subject | Compound semiconductor | en |
| dc.subject | chip | en |
| dc.subject | competitive strategy | en |
| dc.subject | foundry | en |
| dc.title | 再創高峰:化合物半導體晶圓代工公司之經營發展策略分析: 以穩懋半導體為例 | zh_TW |
| dc.title | The Corporate Strategy Analysis of Compound Semiconductor Foundry: A Case Study of Win Semiconductors Corporation | en |
| dc.type | Thesis | - |
| dc.date.schoolyear | 112-2 | - |
| dc.description.degree | 碩士 | - |
| dc.contributor.oralexamcommittee | 詹文男;陳建錦 | zh_TW |
| dc.contributor.oralexamcommittee | Wen-Nang Tsan;Chien-Chin Chen | en |
| dc.subject.keyword | 化合物半導體,代工,五力分析,競爭策略,晶片, | zh_TW |
| dc.subject.keyword | Compound semiconductor,foundry,five forces analysis,competitive strategy,chip, | en |
| dc.relation.page | 90 | - |
| dc.identifier.doi | 10.6342/NTU202401497 | - |
| dc.rights.note | 未授權 | - |
| dc.date.accepted | 2024-07-05 | - |
| dc.contributor.author-college | 進修推廣學院 | - |
| dc.contributor.author-dept | 事業經營碩士在職學位學程 | - |
| 顯示於系所單位: | 事業經營碩士在職學位學程 | |
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