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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 湯明哲 | zh_TW |
dc.contributor.advisor | Ming-Je Tang | en |
dc.contributor.author | 陳沛銘 | zh_TW |
dc.contributor.author | Pei-Ming Chen | en |
dc.date.accessioned | 2023-08-15T17:05:11Z | - |
dc.date.available | 2023-11-09 | - |
dc.date.copyright | 2023-08-15 | - |
dc.date.issued | 2023 | - |
dc.date.submitted | 2023-07-31 | - |
dc.identifier.citation | 中文部分
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/88618 | - |
dc.description.abstract | 隨著5G、AI與物聯網等科技發展,帶動全球利基型DRAM的需求上升。DRAM產業具有資本密集、高進入與退出障礙、價格彈性低、投資遞延等特性,使廠商易於陷入價格競爭中。而利基型DRAM 廠商不僅面對產業價格波動及景氣循環的風險,還須面對產品製程演進緩慢與市場規模小的雙重挑戰。
本研究試圖從目前台灣DRAM產業現況歸納出產業供需波動的關鍵因素,並藉由產品生命週期、五力分析、價值網、競爭策略、商業模式等分析,探討全球利基型DRAM的產業與競爭分析,提供廠商未來發展的可行策略,主要研究發現如下。 第一,本研究透過長期供需波動,描繪出DRAM產業的蛛網模型,並提出DRAM產業蛛網現象的主要原因,在於投資遞延所導致的產品生產周期較長,當新應用或既有應用升級時,或當廠商一窩蜂擴廠增加產能時,都會加劇價格與產量波動的蛛網現象。 第二,以五力分析檢視DRAM產業競爭狀況,發現現有廠商之競爭、供應商議價能力為二大威脅來源,買方議價能力次之,而潛在競爭者進入門檻高,以至於短期間威脅性低。 第三,以價值網模型分析DRAM廠商之間的合作關係,由於DRAM產品需仰賴系統主晶片才得以發揮功能,故最主要的互補者為主晶片商。DRAM 廠商應加入相同目標市場的主晶片商所建立之平台,擴大在生態系統中的影響力。 第四,以產品生命週期分析DRAM產品不同製程、不同類別的技術推進,發現相較於過去,現今DRAM產業在新製程推進的難度以及所需投資金額更高,而單一世代在市場存在的時間也更長。 第五,探討目前市場前五大自有晶圓廠DRAM廠商所採取的競爭策略,結果發現DRAM廠商,例如華邦電子,採取集中化策略,鎖定利基型DRAM產品市場,提供符合市場所需產品及技術,即使產品已進入衰退期,但整體需求量仍遠大於案例公司所能供給的量。並以華邦電子為例,討論利基型DRAM廠商如何建構可行的商業模式。 最後,建議利基型DRAM廠商未來應:(1)透過與主晶片進行SIP(System In Package)/MCP(Multi-Chip Package)或是提供客製化規格產品的方式,持續深化與主晶片廠商、客戶的關係;(2)提供長生命週期的產品,減低主晶片廠商與客戶需重新進行產品設計的困擾; (3)掌握上游原物料供貨情況,確保供應鏈來源無虞穩定,以維持DRAM市場的穩定,滿足下游客戶的需求;(4)關注各類應用市場的發展,了解市場未來可能需要的記憶體類型、製程及各種先進封裝技術,持續投入研發資源,以提升效能、降低成本,使利基型DRAM市場能穩定長久的發展。 | zh_TW |
dc.description.abstract | With the development of technologies such as 5G, AI and Internet of Things, the global demand for specialty DRAM has been rising. The DRAM industry is characterized by capital-intensity, high entry and exit barriers, low product differentiation, low price elasticity, and deferred investment, making price competition prevalent among competitors. Specialty DRAM firms thus face not only risks of price fluctuations and industry cycles, but also challenges of slower product process evolution and smaller market size.
This research aims to examine the key factors underlying the supply and demand fluctuations of the DRAM industry, and analyzes its industrial characteristics such as product life cycle, five forces structure, and value net. In addition, this research examines the competitive strategy and business model of Taiwanese DRAM firms. The findings of the study provide suggestions of future development to DRAM firms. The main research findings are as follows. 1. This study describes the Cobweb Model of the DRAM industry through long-term supply and demand fluctuations, and proposes that the main reason for cobweb phenomenon in the industry is the longer production cycle caused by deferred investment. When new applications or existing applications are upgraded, or when manufacturers rush to increase production capacity, it will exacerbate the cobweb phenomenon of price and quantity fluctuations. 2. By using the five force analysis to examine the competition in the DRAM industry, this research identifies the major threats within the industry: intensive competition among existing firms, strong bargaining power of suppliers, and bargaining power of buyers. The threat of potential competitors is low in short-term due to high entry barriers. 3. The value network model is used to analyze coopetition among DRAM firms. Because DRAM products rely on the main chip of the system to function, the most important complementor is the main chip manufacturer. Therefore, DRAM firms should join the platforms established by the main chip manufacturers in the same target market in order to expand their influence in the ecosystem. 4. Based on theory of product life cycle, this research then analyzes the advancement of different processes and different types of technologies of DRAM products. It is found that the DRAM industry is increasingly difficult to advance in new processes due to the requirement of high investment. Thus a single generation of DRAM technology can sustain in the market for a longer period of time. 5. By examining the competitive strategies adopted by the worldwide top five DRAM firms with own-fab, it is found that DRAM firm, such as Winbond Electronics Corp., adopts a focus strategy to concentrate on the specialty DRAM market in order to provide products that meet the market needs. Historical data shows that even during the recession period, the overall demand of specialty DRAM is still far larger than the supply provided by the case company. It also discusses the feasible business models for specialty DRAM firms by taking Winbond Electronics Corp. as an example. Several suggestions stand out: (a) DRAM firms should continue to strengthen the relationship with main chip manufacturers and customers by SIP(System In Package)/MCP(Multi-Chip Package) with main chip or developing customized product; (b) DRAM firms should provide long life products to reduce the re-design effort of main chip manufacturers and customers; (c) DRAM firms should have better control over the supply of raw materials in order to maintain the stability of the DRAM market and to meet the needs of customers; (d) DRAM firms should be aware of the development of markets of various applications, and understand various types of memory, advanced process and advanced package technologies that the market may need in the future, and continue to invest in research and development for enhancing performance and reducing costs of DRAM to make specialty DRAM market grow stably for a long time. | en |
dc.description.provenance | Submitted by admin ntu (admin@lib.ntu.edu.tw) on 2023-08-15T17:05:11Z No. of bitstreams: 0 | en |
dc.description.provenance | Made available in DSpace on 2023-08-15T17:05:11Z (GMT). No. of bitstreams: 0 | en |
dc.description.tableofcontents | 目錄
謝辭 I 中文摘要 II Abstract IV 目錄VI 表目錄VIII 圖目錄IX 第一章 緒論 1 1.1研究背景與動機 1 1.2研究目的 2 1.3研究流程 3 第二章 文獻探討 5 2.1蛛網理論 5 2.2需求的價格彈性 7 2.3產品生命週期 9 2.4五力分析模型 11 2.5價值網與競合 13 2.6競爭策略 15 2.7商業模式 17 第三章 DRAM產業分析 21 3.1 DRAM結構及業界標準 21 3.2全球DRAM產業概況 24 3.3 DRAM之類別及應用 27 3.4 DRAM產業特性 28 3.5 DRAM市場供需分析 32 3.6利基型DRAM市場特性 35 第四章 利基型DRAM廠商發展策略 38 4.1 五力分析 38 4.2價值網分析 40 4.3 DRAM產品生命週期 43 4.4市場區隔與競爭策略 46 4.5利基型DRAM廠商的競爭策略 51 第五章 結論與建議 58 5.1結論 58 5.2 對DRAM廠商之實務建議 62 5.3未來研究建議 63 參考文獻 65 表目錄 表 1 2019~2022 IC Market Forecast 1 表2全球DRAM需求量 2 表3價格彈性與消費者支出的影響 8 表4 DDR與LPDDR特性比較表 24 表5各產品年出貨量 37 表6各產品系統的DRAM使用量 37 圖目錄 圖1研究流程圖 4 圖2收斂型的蛛網模型 6 圖3發散型的蛛網模型 6 圖4封閉型的蛛網模型 6 圖5產品生命週期 10 圖6五力分析架構圖 11 圖7價值網模型 13 圖8一般性競爭策略 17 圖9商業模式九宮格圖 19 圖10商業模式的四個組成要素 20 圖11記憶體種類 21 圖12 DRAM 儲存單元結構示意圖 22 圖13 SDRAM、DDR SDRAM、Low-Power DRAM 發展進程 23 圖14全世界DRAM營收 25 圖15五大DRAM廠市佔率分佈 25 圖16 DRAM Segment Demand 26 圖17 DRAM Segment Market Share 26 圖18各DRAM廠商歷年資本支出 29 圖19全球DRAM營收、價格、資本投資之成長率與供給需求比 32 圖20 DRAM價格成長率與供需比 33 圖21 DRAM 產業蛛網模型 34 圖22 DRAM供給與需求之循環示意圖 35 圖23 DRAM產業的五種力量 40 圖24 DRAM廠商與主晶片廠商之競合關係 42 圖25 DRAM製程演進 44 圖26 DRAM各類別市佔率 44 圖27 DDR/DDR2/DDR3/DDR4/DDR5 生命週期 45 圖28 DDR/DDR2/DDR3/DDR4 出貨累積 46 圖29五大DRAM廠商之策略 50 圖30 DRAM廠商於產品生命週期各階段出貨量 51 圖31利基型DRAM廠商的商業模式,以華邦電子為例 52 圖32 2020~2026全球DRAM需求量 58 圖33 DRAM市場趨勢 59 圖34使用記憶體IC的各應用市場之比例 59 | - |
dc.language.iso | zh_TW | - |
dc.title | 全球利基型動態記憶體之產業與競爭分析 | zh_TW |
dc.title | Analysis of Industry and Competition of Global Specialty DRAM | en |
dc.type | Thesis | - |
dc.date.schoolyear | 111-2 | - |
dc.description.degree | 碩士 | - |
dc.contributor.coadvisor | 郭佳瑋 | zh_TW |
dc.contributor.coadvisor | Chia-Wei Kuo | en |
dc.contributor.oralexamcommittee | 管中閔;陳家麟;吳政衞 | zh_TW |
dc.contributor.oralexamcommittee | Chung-Ming Kuan;Chialin Chen;Cheng-Wei Wu | en |
dc.subject.keyword | 利基型記憶體,蛛網理論,產品生命週期,五力分析,價值網,競合,競爭策略,商業模式, | zh_TW |
dc.subject.keyword | Specialty DRAM,Cobweb Theory,Product Life Cycle,Five competitive forces,Value Net,Coopetition,Competitive Strategy,Business Model, | en |
dc.relation.page | 67 | - |
dc.identifier.doi | 10.6342/NTU202302344 | - |
dc.rights.note | 同意授權(全球公開) | - |
dc.date.accepted | 2023-08-02 | - |
dc.contributor.author-college | 管理學院 | - |
dc.contributor.author-dept | 碩士在職專班商學組 | - |
顯示於系所單位: | 商學組 |
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