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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 陳士元(Shih-Yuan Chen) | |
| dc.contributor.author | Ling-Yun Kung | en |
| dc.contributor.author | 孔令昀 | zh_TW |
| dc.date.accessioned | 2022-11-25T03:06:50Z | - |
| dc.date.available | 2024-12-31 | |
| dc.date.copyright | 2021-11-02 | |
| dc.date.issued | 2021 | |
| dc.date.submitted | 2021-10-27 | |
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/81929 | - |
| dc.description.abstract | 本論文提出應用於太赫茲成像系統之多層鄰近探針饋入之E形貼片天線陣列及其去耦合結構。 此成像系統由16×16貼片天線陣列當接收端，其中2×2天線陣列為子陣列，由一六端口晶片饋入。此成像系統之天線設計於日月光公司所提供之IC載板十層板製程。為實現太赫茲成像系統的天線陣列，採用以蜿蜒式鄰近探針饋入的E形貼片天線作為陣列天線單元。因E形貼片天線易於與多層板整合，且兩個位於金屬貼片上的槽孔所帶來之寬頻特性而擇之。蜿蜒式探針相較於傳統L形探針支援更寬的頻段範圍，且因具有錯位的盲孔，其輻射特性在H平面具有更小的正交極化。IC載板的一至四層為太赫茲成像系統的天線部分，而天線的饋入電路則由特殊設計之多層類同軸通孔結構貫穿四至十層。所設計之饋入電路目的為保持良好的阻抗匹配，最小化會降低天線性能的傳輸損耗，同時最小化設計總面積以供數位控制線及配電網路得以在適當面積下設計。 在此太赫茲成像系統每一子陣列中，單一時間僅有一單元天線被激發，並將訊號經由通孔設計傳輸至IC端，因此，天線單元之間的耦合度將影響接收訊號之完整性。為保持訊號品質使其完整傳遞，本論文提出一去耦合金屬帶狀結構。利用此設計於天線單元之間的帶狀結構，產生與原天線之間耦合電流方向相反之電流並使兩者相抵銷，進而提升天線之間的隔離度。受限於IC載板製程的時程較長，本論文提出之去耦合結構僅設計於24GHz，以利實作驗證。 | zh_TW |
| dc.description.provenance | Made available in DSpace on 2022-11-25T03:06:50Z (GMT). No. of bitstreams: 1 U0001-1509202121364600.pdf: 7558923 bytes, checksum: 7b6e750527a085cd77607d912eaf2c43 (MD5) Previous issue date: 2021 | en |
| dc.description.tableofcontents | 口試委員會審定書 i 致謝 v 中文摘要 vi Abstract vii Contents ix List of Figures xi List of Tables xx 1 Introduction 1 1.1 Background . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 Literature Survey . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.3 Contributions and Thesis Structure . . . . . . . . . . . . . . . . . . . . . 3 2 Intended Application of Proposed Antenna Structure: Terahertz Imaging System 4 2.1 Terahertz Imaging System Architecture . . . . . . . . . . . . . . . . . . 4 2.2 Receiving Sub-System . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2.1 Mother Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2.2 Chips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2.3 Daughter Board . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Wide-Band E-Shaped Patch Antenna Using Proximity Meandering-Probe Feed 9 3.1 Design of Wide-band E-Shaped Patch Antenna Using L-Probe Feed . . . 9 3.1.1 E-Shaped Patch Antenna . . . . . . . . . . . . . . . . . . . . . . 10 3.1.2 Feeding of E-Shaped Patch Antenna . . . . . . . . . . . . . . . . 11 3.1.3 E-Shaped Patch Antenna Using L-Probe . . . . . . . . . . . . . . 12 3.2 E-Shaped Patch Antenna in Terahertz Imaging System . . . . . . . . . . 14 3.2.1 Implementation of E-Shaped Patch Antenna in Terahertz Imaging System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.2.2 Antenna Feeding Network . . . . . . . . . . . . . . . . . . . . . 21 3.2.3 Proposed Antenna Array . . . . . . . . . . . . . . . . . . . . . . 35 3.3 Measurement Test Kit and Environment Setup . . . . . . . . . . . . . . . 39 4 Decoupling Design of the Proposed Antenna Array at 24 GHz 46 4.1 Review of Decoupling Techniques . . . . . . . . . . . . . . . . . . . . . 47 4.2 Decoupling Structure and Design . . . . . . . . . . . . . . . . . . . . . . 48 4.2.1 1×2 antenna array . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.2.2 2×2 antenna array . . . . . . . . . . . . . . . . . . . . . . . . . 58 4.2.3 Implementation of Decoupling Structure In 150-GHz Antenna . . 61 4.3 Measurement Setup and Results . . . . . . . . . . . . . . . . . . . . . . 62 4.3.1 Transmission Line Design For Measurement . . . . . . . . . . . 63 4.3.2 Effect of antenna ground plane size . . . . . . . . . . . . . . . . 67 4.3.3 Measurement Results and Discussion . . . . . . . . . . . . . . . 69 5 Conclusion 83 References 85 | |
| dc.language.iso | en | |
| dc.subject | E 形貼片天線 | zh_TW |
| dc.subject | 蜿蜒式鄰近探針饋入 | zh_TW |
| dc.subject | IC 載板 | zh_TW |
| dc.subject | 去耦合元件 | zh_TW |
| dc.subject | 太赫茲成像系統 | zh_TW |
| dc.subject | decoupling structure | en |
| dc.subject | terahertz imaging system | en |
| dc.subject | IC substrate | en |
| dc.subject | E-shaped patch antenna | en |
| dc.subject | meandering-probe | en |
| dc.title | 應用於太赫茲成像系統之多層鄰近探針饋入之E形貼片天線陣列及其去耦合結構 | zh_TW |
| dc.title | Multi-Layered Proximity Probe-Fed E-Shaped Patch Antenna Array for Terahertz Imaging System and Its Decoupling Structure | en |
| dc.date.schoolyear | 109-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.author-orcid | 0000-0001-6973-4166 | |
| dc.contributor.oralexamcommittee | 馬自莊(Hsin-Tsai Liu),蔡作敏(Chih-Yang Tseng),陳念偉 | |
| dc.subject.keyword | 太赫茲成像系統,IC 載板,E 形貼片天線,蜿蜒式鄰近探針饋入,去耦合元件, | zh_TW |
| dc.subject.keyword | terahertz imaging system,IC substrate,E-shaped patch antenna,meandering-probe,decoupling structure, | en |
| dc.relation.page | 90 | |
| dc.identifier.doi | 10.6342/NTU202103200 | |
| dc.rights.note | 同意授權(全球公開) | |
| dc.date.accepted | 2021-10-28 | |
| dc.contributor.author-college | 電機資訊學院 | zh_TW |
| dc.contributor.author-dept | 電信工程學研究所 | zh_TW |
| dc.date.embargo-lift | 2024-12-31 | - |
| 顯示於系所單位： | 電信工程學研究所 | |
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| U0001-1509202121364600.pdf | 7.38 MB | Adobe PDF | 檢視/開啟 |
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