請用此 Handle URI 來引用此文件：
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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 曹承礎(Seng-Cho Chou) | |
| dc.contributor.author | Tao-Ann Shu | en |
| dc.contributor.author | 束道安 | zh_TW |
| dc.date.accessioned | 2022-11-24T09:25:38Z | - |
| dc.date.available | 2022-11-24T09:25:38Z | - |
| dc.date.copyright | 2022-02-16 | |
| dc.date.issued | 2022 | |
| dc.date.submitted | 2022-02-09 | |
| dc.identifier.citation | Bozman, J. (2022, January 12). Guide to managing edge computing’s explosive data growth. eWeek. Retrieved from https://www.eweek.com/cloud/managing-edge-computing/ Chen, A. (2021, July). Taiwanese IPC revenue for 1H21 reaches NT$115.1 billion thanks to global 5G rollout and transport infrastructure demand. TrendForce. Retrieved from https://www.trendforce.com/presscenter/news/20210719-10863.html Di Paolo, M. (2017, July 21). NAND flashes its storage superiority in automotive designs. Electronic Design. Retrieved from https://www.electronicdesign.com/markets/automotive/article/21805326/nand-flashes-its-storage-superiority-in-automotive-designs Johnson, B., Gupta, G., Wang, S. (2021, December 23). Forecast: semiconductor capital spending, wafer fab equipment and capacity, worldwide, 4Q21 update. Gartner. Retrieved from https://www.gartner.com/en/documents/4009666-forecast-semiconductor-capital-spending-wafer-fab-equipment-and-capacity-worldwide-4q21-update Lee, B., Reilly, N., Norwood, A., Erensen, J., Unsworth, J., Yamaji, M., Mahon, T., Sheng, R., Verma, A., Ray, B., Priestley, A., Gupta, J., Chauhan, K., Rajput, R., Singh, N., Yin, S. (2021, December 23). Semiconductor Forecast Database, Worldwide, 4Q21 Update. Gartner. Retrieved from https://www.gartner.com/en/documents/4009835/semiconductor-forecast-database-worldwide-4q21-update Lee, J. Saini, M. (2021, December 30). Samsung, Micron warn Xian lockdown may disrupt memory chip manufacturing. Reuters. Retrieved from https://www.reuters.com/world/china/micron-warns-dram-chip-delays-due-chinas-xian-lockdown-2021-12-29/ Lewis, L., Davies, C., Jung-a, S. (2022, January 5). Investors gear up for ‘gold rush’ in metaverse hardware. Financial Times. Retrieved from https://www.ft.com/content/182bb2a7-b4e4-4d0d-8178-4cd9b4c225c4 Norwood, A., Lee, B., Reilly, N., Teng, A., Erensen, J., Unsworth, J., Yamaji, M., Sheng, R., Verma, A., Ray, B., Priesley, A., Brocklehurst, G., Gupta, J., Chauhan, K., Rajput, R., Singh, N. (2021, March 31). Market share: semiconductors by end market, worldwide, 2020. Gartner. Retrieved from https://www.gartner.com/en/documents/4000050/market-share-semiconductors-by-end-market-worldwide-2020 Potier, H. (2020, July 8). Traditional industries move to transform. Orange Business Services. Retrieved from https://www.orange-business.com/en/blogs/traditional-industries-move-transform Transcend Information. (2021). Annual report. Transcend Information. Retrieved from https://us.transcend-info.com/Abouts/dwFile/109%E5%B9%B4%E8%82%A1%E6%9D%B1%E6%9C%83%E5%B9%B4%E5%A0%B1_En.pdf Unsworth, J. Norwood, A. (2021, September 23). Emerging technologies: critical insights for emerging memory. Gartner. Retrieved from https://www.gartner.com/en/documents/4006099/emerging-technologies-critical-insights-for-emerging-memory Unsworth, J. (2021, December 23). Forecast: NAND flash market statistics, supply and demand, worldwide, 2018-2025, 4Q21 update. Gartner. Retrieved from https://www.gartner.com/en/documents/4009836/forecast-nand-flash-market-statistics-supply-and-demand-worldwide-2018-2025-4q21-update Unsworth, J. (2019, March 5). Determining the data center opportunity created for 3D XPoint persistent memory. Gartner. Retrieved from https://www.gartner.com/en/documents/3903669/determining-the-data-center-opportunity-created-for-3d-x “Industrial PC Market with COVID-19 Impact Analysis by Type (Panel, Rack Mount, Box, Embedded, and DIN Rail), Specification, Sales Channel (Direct, Indirect), Industry (Process, Discrete), and Region - Global Forecast to 2026.” Markets and Markets, Nov. 2021, https://www.researchandmarkets.com/reports/5008077/industrial-pc-market-with-covid-19-impact?utm_source=GNOM utm_medium=PressRelease utm_code=fqjnqg utm_campaign=1637236+-+Global+Industrial+PC+Markets+Report+2021-2026+-+Growing+Deployment+of+Smart+Manufacturing+Solutions+%26+Increasing+Awareness+of+Benefits+of+Effective+It+Infrastructure utm_exec=chdo54prd | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/81679 | - |
| dc.description.provenance | Made available in DSpace on 2022-11-24T09:25:38Z (GMT). No. of bitstreams: 1 U0001-0702202217333300.pdf: 1500592 bytes, checksum: 3af962275461279950b8c873dbe22ebd (MD5) Previous issue date: 2022 | en |
| dc.description.tableofcontents | Table of Contents Abstract ii Table of Contents iv List of Tables and Figures vi List of Abbreviations vii 1. Purpose 1 2. Introduction 2 2.1 Industry Background 2 2.2 Company Background 3 2.3 Shifting into the Embedded Market 7 2.4 Embedded Market Growing Pains 9 2.4 PEST Analysis 10 3. External Factors Analysis 13 3.1 Market and Customers 13 3.1.1 Current Status 13 3.1.3 Key Takeaways for Transcend Information 17 3.2 Suppliers 18 3.2.1 Current Status 18 3.2.2 Key Takeaways for Transcend Information 22 3.3 Competitors 23 3.3.1 Current Status 23 3.3.2 Key Takeaways for Transcend Information 24 3.4 Porter’s Five Forces Analysis 24 3.4.1 Rivalry Among Existing Competitors 25 3.4.2 The Threat of New Entrants 25 3.4.3 The Threat of Substitute Products 25 3.4.4 The Bargaining Power of Buyers 26 3.4.5 The Bargaining Power of Suppliers 26 4. Internal Factors Analysis 28 4.1 Organization 28 4.1.1 Current Status 28 4.1.2 Key Takeaways for Transcend Information 30 4.2 Products and Business Model 31 4.2.1 Embedded DRAM 31 4.2.2 Embedded NAND Flash Modules 33 4.2.3 Embedded Software Solutions 34 4.2.4 Key Takeaways for Transcend Information 36 4.3 Financials 37 4.3.1 Current Status 37 4.3.2 Key Takeaways for Transcend Information 42 5. Recommendation: High Level Strategic Plan 43 5.1 Overall Summary 43 5.2 SWOT and TOWS Analysis 45 5.3 Transcend Information’s Short-Term Strategic Plan (1-2 Years) 49 5.4 Transcend Information’s Mid-Term Strategic Plan (3-5 Years) 49 5.5 Transcend Information’s Long-Term Strategic Plan (5-10 Years) 49 References 51 | |
| dc.language.iso | en | |
| dc.subject | 快閃記憶體 | zh_TW |
| dc.subject | 記憶體 | zh_TW |
| dc.subject | 工控 | zh_TW |
| dc.subject | DRAM | en |
| dc.subject | memory | en |
| dc.subject | embedded | en |
| dc.subject | NAND | en |
| dc.title | 創見資訊工控事業企畫書 | zh_TW |
| dc.title | Transcend Information: A Strategic Plan for Balanced and Sustainable Growth of its Embedded Business | en |
| dc.date.schoolyear | 110-1 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 陳建錦(Yu-Chiang Frank Wang),盧信銘(Cheng-Ming Huang),(Su-Ling Yeh),(Tsung-Ren Huang) | |
| dc.subject.keyword | 記憶體,工控,快閃記憶體, | zh_TW |
| dc.subject.keyword | DRAM,NAND,embedded,memory, | en |
| dc.relation.page | 53 | |
| dc.identifier.doi | 10.6342/NTU202200338 | |
| dc.rights.note | 未授權 | |
| dc.date.accepted | 2022-02-11 | |
| dc.contributor.author-college | 管理學院 | zh_TW |
| dc.contributor.author-dept | 企業管理碩士專班 | zh_TW |
| 顯示於系所單位： | 管理學院企業管理專班(Global MBA) | |
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| 檔案 | 大小 | 格式 | |
|---|---|---|---|
| U0001-0702202217333300.pdf 未授權公開取用 | 1.47 MB | Adobe PDF |
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