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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/80505完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 藍崇文(CHUNG-WEN LAN) | |
| dc.contributor.author | NAI-WEI YANG | en |
| dc.contributor.author | 楊乃維 | zh_TW |
| dc.date.accessioned | 2022-11-24T03:08:06Z | - |
| dc.date.available | 2021-11-04 | |
| dc.date.available | 2022-11-24T03:08:06Z | - |
| dc.date.copyright | 2021-11-04 | |
| dc.date.issued | 1995 | |
| dc.date.submitted | 2021-10-28 | |
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/80505 | - |
| dc.description.abstract | 為了發展便宜的矽負極材料和解決其在鋰電池充放電過程中體積膨脹 300%的問題，吾人決定以低成本的切割矽做為原料，先反應成中間產物矽化鎂，再除鎂形成多孔矽，最後再利用金屬催化蝕刻多孔矽以製備成奈米矽。 矽化鎂方面，吾人成功以氣相鎂化方式，在高壓釜中將切割矽反應成粒徑大小相同的 1 微米矽化鎂。多孔矽部分則是利用小粒徑的矽化鎂和 CO2/N2混氣經過氣相反應，接著透過酸洗除去副產物形成孔洞，成功得到比表面積高達 500 m2 g-1的多孔矽。奈米矽則是利用銅金屬催化蝕刻，蝕刻多孔矽，最佳條件能得到平均粒徑 50nm 的奈米矽。 此製程的優勢在於，一為切割矽是低成本高品質的原料來源，二為吾人將切割矽製備成多孔矽後，較易於加工成更小粒徑的奈米矽，可以省去大量的成本和時間， 有助於推廣鋰電池矽負極材料的發展。 | zh_TW |
| dc.description.provenance | Made available in DSpace on 2022-11-24T03:08:06Z (GMT). No. of bitstreams: 1 U0001-2710202111542000.pdf: 4116932 bytes, checksum: 0e8e247dbea2a9d8f9e6239fa095c04b (MD5) Previous issue date: 1995 | en |
| dc.description.tableofcontents | 致謝 I 中文摘要 II ABSTRACT III 目錄 IV 圖目錄 V 表目錄 VIII 第一章 緒論 1 1-1 研究背景 1 1-2 研究動機 2 第二章 文獻回顧 3 2-1矽化鎂合成 3 2-2多孔矽合成 5 2-3鍍碳 7 第三章 實驗方法及實驗器材 9 3-1實驗藥品 9 3-2實驗設備與器材 12 3-3實驗設計 15 第四章 研究結果及討論 19 4-1合成矽化鎂探討 19 4-2合成多孔矽探討 27 4-3合成奈米矽探討 31 4-4電池表現 40 第五章 結論 43 參考文獻 45 | |
| dc.language.iso | zh-TW | |
| dc.subject | 奈米矽 | zh_TW |
| dc.subject | 切割矽 | zh_TW |
| dc.subject | 矽化鎂 | zh_TW |
| dc.subject | 多孔矽 | zh_TW |
| dc.subject | 金屬催化蝕刻 | zh_TW |
| dc.subject | kerf loss silicon | en |
| dc.subject | nano silicon | en |
| dc.subject | metal assisted chemical etching | en |
| dc.subject | porous silicon | en |
| dc.subject | magnesium silicide | en |
| dc.title | 從切割矽製備多孔/奈米矽及其鋰電池應用之研究 | zh_TW |
| dc.title | Preparation of Porous/Nano Silicon from Kerf Loss Waste for Lithium-ion Batteries Application | en |
| dc.date.schoolyear | 109-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 何國川(Hsin-Tsai Liu),王丞浩(Chih-Yang Tseng) | |
| dc.subject.keyword | 切割矽,矽化鎂,多孔矽,金屬催化蝕刻,奈米矽, | zh_TW |
| dc.subject.keyword | kerf loss silicon,magnesium silicide,porous silicon,metal assisted chemical etching,nano silicon, | en |
| dc.relation.page | 49 | |
| dc.identifier.doi | 10.6342/NTU202104323 | |
| dc.rights.note | 同意授權(限校園內公開) | |
| dc.date.accepted | 2021-10-29 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 化學工程學研究所 | zh_TW |
| 顯示於系所單位： | 化學工程學系 | |
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