類載板製造作業生產改進之研究

Abstract

由於電子產品日新月累，價格戰及技術戰改變了供應鏈的結構，中國兼具產業分布成本和市場優勢，已經成為全球最重要印刷電路板生產基地。印刷電路板產值成長與全球經濟成長率間呈現高度正向相關，因此，全球經濟情勢的變化將直接影響整體產業的成長。 類載板(SLP)是下一代PCB硬板，可將線寬/線距從HDI的40/40微米縮短到30/30微米。從製程上來看，類載板更接近用於半導體封裝的IC載板，但尚未到達IC載板的規格，而其用途仍是搭載各種主被動元器件，因此仍屬於PCB的範疇。 我們將從其導入背景、製造工藝和潛在供應商三個維度進行解讀。為什麽要導入類載板：極細化線路疊加SIP封裝需求，高密度仍是主線智慧手機、平板電腦和可穿戴設備等電子產品向小型化和多功能化方向發展，要搭載的元器件數量大大增多然而留給線路板的空間卻越來越有限。 近年來由於半導體製程的提升愈發困難，SOC發展遭遇技術瓶頸，SIP成為電子產業新的技術潮流，部分領先公司在產品中大量使用了SIP封裝。構成SIP技術的要素是封裝載體與組裝工藝，對於SIP而言，由於系統級封裝內部走線的密度非常高，普通的PCB板難以承載， 而類載板更加契合密度要求，適合作為SIP的封裝載體。 本論文以作業管理理論為主要研究方法。探討在面對工廠由傳統PCB板轉型高端類載板產品，面臨的挑戰，運用供應商管理，製程程序管理，品質管理，訂單產能管理及現場管理，等方面展開研究及對策改善，達成工廠轉型，獲得公司、股東、客戶、員工的認同。

Due to the rapidly changing needs on electronic products, particularly consumer electronics, the competitions on pricing and technologies have changed the structure of the supply chain. With the advantages on industry clustering and market size, China has become the most important PCB manufacturing base in the world. The growth of PCB production is positively correlated to the growth of global economy. Hence, changes affecting the global economy will also directly affect the PCB industry. Substrate-Like-PCB (SLP) is the next generation PCB. It can reduce the line width/space from 40/40um to 30/30um. From manufacturing process’ point of view, SLP is similar to IC substrates used in the semiconductor packaging and assembly. However, the technical specifications of SLP are still below that of IC substrates. SLP plays the role of carrying and connecting all the active and passive components like a PCB, and therefore categorized as a brand new type of PCB. We will introduce from the background of SLP development to its manufacturing process and its potential suppliers. Why SLP? More and more components are packed into smart phones, tablets and wearable to allow better capabilities and functions. However, the sizes of these consumer electronics are limited. The ability to make finer lines on PCB to connect all the components becomes very critical. In recent years, due to the increasing difficulties in the upgrading of semiconductor manufacturing processes, SOC development encountered technical bottlenecks. SIP has then become a new assembly trend in the electronics industry. Some leading companies use a lot of SIP assembly in their products. The elements that make up SIP technology are assembly carrier and assembly process. For SIP, because the layout density of system-level package is very high, standard PCB is difficult to meet the requirement. SLP is more compatible with the density requirements, and hence suitable as the assembly carrier of SIP. This thesis is focusing on the theory of manufacturing management and explores the challenges faced during the transition from traditional PCB manufacturing to SLP and high end substrates. Study and improve the use of supplier management, process management, quality management, order/capacity management and on-site management to achieve factory transformation, management objective and overall recognition from shareholders, customers and employees.