請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/76564
完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 陳炳煇(Ping-Hei Chen) | |
dc.contributor.author | Wei-Kong Sheng | en |
dc.contributor.author | 盛維康 | zh_TW |
dc.date.accessioned | 2021-07-10T21:33:00Z | - |
dc.date.available | 2021-07-10T21:33:00Z | - |
dc.date.copyright | 2017-08-29 | |
dc.date.issued | 2017 | |
dc.date.submitted | 2017-07-25 | |
dc.identifier.citation | [1] R. S. Gaugler, “Heat transfer device,” U. S. Patent 2350348A, December 21, 1942.
[2] T. P. Cotter, “Theory of heat pipes”, Los Alamos Scientific Laboratory, Los Alamos, USA, Tech. Rep. AD-A956 146, 1965. [3] S. H. Moon, G. Hwang, H. G. Yun, T. G. Choy, and Y. I. Kang, “Improving thermal performance of miniature heat pipe for notebook PC cooling,” Microelectronics Reliability, vol. 42, pp. 135-140, 2002. [4] V. G. Pastukhov, Y. F. Maidanik, C. V. Vershinin, and M. A. Korukov, “Miniature loop heat pipes for electronics cooling,” Applied Thermal Engineering, vol. 23, pp. 1125-1135, 2003. [5] J. C. S. Chang, C. H. Wang, J. K. Liu, Y. Feng, Y. Wang, and C. Y. Huang, “A study of composite wick heat pipes for notebook cooling,” in 8th International Heat Pipe Symposium, pp. 24-27, 2006. [6] L. L. Vasiliev, “Micro and miniature heat pipes–electronic component coolers,” Applied Thermal Engineering, vol. 28, pp. 266-273, 2008. [7] J. H. Liou, C. W. Chang, C. Chao, and S. C. Wong, “Visualization and thermal resistance measurement for the sintered mesh-wick evaporator in operating flat-plate heat pipes,” International Journal of Heat and Mass Transfer, vol. 53, pp. 1498-1506, 2010. [8] S. C. Wong, J. H. Liou, and C. W. Chang, “Evaporation resistance measurement with visualization for sintered copper-powder evaporator in operating flat-plate heat pipes,” International Journal of Heat and Mass Transfer, vol. 53, pp. 3792-3798, 2010. [9] K. T. Lin and S. C. Wong, “Performance degradation of flattened heat pipes,” Applied Thermal Engineering, vol. 50, pp. 46-54, 2013. [10] Y. Li, J. He, H. He, Y. Yan, Z. Zeng, and B. Li, “Investigation of ultra-thin flattened heat pipes with sintered wick structure,” Applied Thermal Engineering, vol. 86, pp. 106-118, 2015. [11] X. Wei and K. Sikka, “Modeling of vapor chamber as heat spreading devices,” in 10th Intersociety Conference on Phenomena in Electronics Systems, pp. 578-585, 2006. [12] S. S. Hsieh, R. Y. Lee, J. C. Shyu, and S. W. Chen, “Thermal performance of flat vapor chamber heat spreader,” Energy Conversion and Management, vol. 49, pp. 1774-1784, 2008. [13] J. C. Wang, R. T. Wang, T. L. Chang, and D. S. Hwang, “Development of 30 watt hight-power LEDs vapor chamber-based plate,” International Journal of Heat and Mass Transfer, vol. 53, pp. 3990-4001, 2010. [14] T. L. Phan, Y. Saito, and M. Mochizuki, “Integrated vapor chamber heat spreader for high power processors,” in 2014 International Conference on Electronics Packaging, pp. 424-428, 2014. [15] J. B. Boreyko and C. H. Chen, “Vapor chambers with jumping-drop liquid return from superhydrophobic condensers,” International Journal of Heat and Mass Transfer, vol. 61, pp. 409-418, 2013. [16] C. Neinhuis and W. Barthlott, “Characterization and distribution of water-repellent, self-cleaning plant surfaces,” Annals of Botany, vol. 79, pp. 667-677, 1997. [17] Y. W. Lu and S. G. Kandlikar, “Nanoscale surface modification techniques for pool boiling enhancement: A critical review and future directions,” Heat Transfer Engineering, vol. 32, pp. 827-842, 2011. [18] C. K. Kang, S. M. Lee, I. D. Jung, P. G. Jung, S. J. Hwang, and J. S. Ko, “The fabrication of patternable silicon nanotips using deep reactive ion etching,” Journal of Micromechanics and Microengineering, vol. 18, no. 075007, 2008. [19] C. W. J. Berendsen, M. Skeren, D. Najdek, and F. Cerny, “Superhydrophobic surface structures in thermoplastic polymers by interference lithography and thermal imprinting,” Applied Surface Science, vol. 255, pp. 9305-9310, 2009. [20] Y. L. Yang, C. C. Hsu, T. L. Chang, L. S. Kuo, and P. H. Chen, “Study on wetting properties of periodical nanopatterns by a combinative technique of photolithography and laser interference lithography,” Applied Surface Science, vol. 256, pp. 3683-3687, 2010. [21] M. Li, J. Zhai, H. Liu, Y. L. Song, L. Jiang, and D. B. Zhu, “Electrochemical deposition of conductive superhydrophobic zinc oxide thin films,” The Journal of Physical Chemistry B, vol. 170, pp. 9954-9957, 2003. [22] A. I. Hochbaum et al., “Enhanced thermoelectric performance of rough silicon nanowires,” Nature, vol. 451, pp. 163-167, 2008. [23] K. Q. Peng, Y. Xu, Y. Wu, Y. J. Yan, S. T. Lee, and J. Zhu, “Aligned single-crystalline Si nanowire arrays for photovoltaic applications,” Small, vol. 1, pp. 1062-1067, 2005. [24] I. Woodward, W. C. E. Schofield, V. Roucoules, and J. P. S. Badyal, “Super-hydrophobic surfaces produced by plasma fluorination of polybutadiene films,” Langmuir, vol. 19, pp. 3432-3438, 2003. [25] M. Y. Tsai, C. C. Hsu, P. H. Chen, C. S. Lin, and A. Chen, “Surface modification on a glass surface with a combination technique of sol-gel and air brushing processes,” Applied Surface Science, vol. 257, pp. 8640-8646, 2011. [26] P. H. Chen, C. C. Hsu, P. S. Lee, and C. S. Lin, “Fabrication of semi-transparent super-hydrophobic surface based om silica hierarchical structures,” Mechanical Science and Technology, vol. 25, pp. 43-47, 2011. [27] J. Bravo, L. Zhai, Z. Z. Wu, R. E. Cohen, and M. F. Rubner, “Transparent superhydrophobic films based on silica nanoparticles,” Langmuir, vol. 23, pp. 7293-7298, 2007. [28] C. H. Wu, Y. S. Huang, L. S. Kuo, and P. H. Chen, “The effects of boundary wettability on turbulent natural convection heat transfer in a rectangular enclosure,” International Journal of Heat and Mass Transfer, vol. 63, pp. 249-254, 2013. [29] Y. Lu, R. Ganguli, C. A. Drewien, M. T. Anderson, C. J. Brinker, W. Gong, Y. Guo, H. Soyez, B. Dunn, M. H. Huang, and J. I. Zink, “Continuous formation of supported cubic and hexagonal mesoporous films by sol-gel dip-coating,” Nature, vol. 389, pp. 364-368, 1997. [30] Y. Natsume and H. Sakata, “Zinc oxide films prepared by sol-gel spin-coating,” Thin Solid Films, vol. 372, pp. 30-36, 2000. [31] C. Kim, J. Lee, S. Kim, J. Yoon, “TiO2 sol-gel spray method for carbon electrode fabrication to enhance desalination efficiency of capacitive deionization,” Desalination, vol. 342, pp. 70-74, 2013. [32] C. J. Brinker, G. C. Frye, A. J. Hurd, and C. S. Ashley, “Fundamentals of sol-gel dip coating,” Thin Solid Films, vol. 201, pp. 97-108, 1991. [33] Y. Nam and Y. S. Ju, “Comparative study of copper oxidation schemes and their effect on surface wettability,” in 2008 International Mechanical Engineering Congress and Exposition, pp. 1833-1838, 2008. [34] D. Ishii, H. Horiguchi, Y. Hirai, H. Yabu, Y. Matsuo, K. Ijiro, K. Tsujii, T. Shimozawa, T. Hariyama, and M. Shimomura, “Water transport mechanism through open capillaries analyzed by direct surface modifications on biological surfaces,” Scientific Reports, vol. 3, no. 3024, 2013. [35] E. W. Washburn, “The dynamics of capillary flow,” Physical Review, vol. 17, pp. 273-283, 1921. [36] F. Caupin, M. W. Cole, S. Balibar, and J. Treiner, “Absolute limit for the capillary rise of a fluid,” Europhysics Letters, vol. 82, no. 56004, 2008. [37] D. Erickson, D. Li, and C. B. Park, “Numerical simulations of capillary-driven flows in non-uniform cross-sectional capillaries,” Journal of Colloid Interface Science, vol. 250, pp. 422-430, 2002. [38] W. W. Liou, Y. Peng, and P. E. Parker, “Analytical modeling of capillary flow in tubes of non-uniform cross section,” Journal of Colloid Interface Science, vol. 6, pp. 389-399, 2009. [39] L. L. Handy, “Determination of effective capillary pressures for porous media from imbibition data,” Petroleum Transactions of AIME, vol. 219, pp. 75-80, 1960. [40] S. Ma, N. R. Morrow, and X. Zhang, “Generalized scaling of spontaneous imbibition data for strongly water-wet systems,” Journal of Petroleum Science and Engineering, vol. 18, pp. 165-178, 1997. [41] N. R. Morrow and G. Mason, “Recovery of oil by spontaneous imbibition,” Current Opinion in Colloid and Interface Science, vol. 6, pp. 321-337, 2001. [42] N. Fries and M. Dreyer, “Dimensionless scaling methods for capillary rise,” Journal of Colloid Interface Science, vol. 338, pp. 514-518, 2009. [43] S. F. Nia and K. Jessen, “Theoretical analysis of capillary rise in porous media,” Transport in Porous Media, vol. 110, pp. 141-155, 2015. [44] C. Cleveland, S. Moghaddam, and M. E. Orazen, “Nanometer-scale corrosion of copper in de-aerated deionized water,” Journal of The Electrochemial Society, vol. 161, pp. 107-114, 2014. [45] J. Jurin, “Disquisitio physicae de tubulis capillaribus,” Commentarii Academiae Scientiarum Imperialis Petropolitana, pp. 281-292, 1728. [46] Y. Tang, D. Deng, L. Lu, M. Pan, and Q. Wang, “Experimental investigation on capillary force of composite wick structure by IR thermal imaging camera,” Experimental Thermal and Fluid Science, vol. 34, pp. 190-196, 2010. [47] C. C. Hsu, C. H. Wu, W. K. Sheng, M. Chen, L. S. Kuo, and P. H. Chen, “Improvement of water wetting capability of copper wire braids by surface modification approaches,” International Communication in Heat and Mass Transfer, vol. 77, pp. 155-158, 2016. [48] W. J. O'Brien, R. G. Craig, F. A. Peyton, “Capillary penetration between dissimilar solids,” Journal of Colloid Interface Science, vol. 26, pp. 500-508, 1968. [49] J. W. Bullard and E. J. Garboczi, “Capillary rise between planar surfaces,” Physical Review E, vol. 79, no. 011604, 2009. [50] W. K. Sheng, H. T. Lin, C. H. Wu, L. S. Kuo, and P. H. Chen, “A hybrid surface modification method on copper wire braids for enhancing thermal performance of ultra-thin heat pipes,” IOP Conference Series: Materials Science and Engineering, vol. 175, no. 1, 2017. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/76564 | - |
dc.description.abstract | 本研究之主旨為透過銅金屬表面改質,提升熱導管與均熱板內導水微結構的毛細力。改質方法分為三種:第一種是藉由溶膠凝膠法配合浸塗法,將二氧化矽奈米粒子均勻塗覆於銅表面上;第二種是使用氧化腐蝕法,將銅表面轉為二氧化銅結構;第三種則是結合前兩種方法的混合改質法,在氧化腐蝕後的表面再行塗佈二氧化矽粒子。實驗分則為三個部份:第一部份為兩平行銅板間平均吸水高度;第二部份為多層編織銅線上的毛細吸水平均爬升速率及吸水淨重;第三部份則為水平靜置之均熱板半成品在單層或雙層平面網狀微結構下水的擴散速率。
第一個實驗結果顯示氧化腐蝕法擁有極高的平均吸水高度,相較於未改質試片在不同間距下提升了42.9%至50.9%不等的靜態吸水高度;第二個實驗顯示二氧化矽奈米粒子的表面改質較氧化腐蝕法之改質表面擁有較高之水爬升速率,但吸水淨重結果則是後者較重,混合改質法則發現爬升速率與吸水淨重皆介於兩者之間;第三個實驗顯示氧化腐蝕法仍較其他兩種方法來得更優異,但與僅經過初步酸洗還原處理的對照組比較後,並無太大優勢。 最後,在結論中將實驗結果與類似之既有物理模型進行比較。除了整理出一個合理的物理詮釋,亦嘗試推論並預測一個更佳的編織方法和改質參數優化。 | zh_TW |
dc.description.abstract | This study is aimed at applying surface modification on copper to enhance the capillary force of wick structures inside heat pipes and vapor chambers. There are three types of surface modifications: first be the sol-gel method with silicon dioxide (SiO2) nanoparticles being dip coated; second be the hot alkali solution method which oxidize the copper metal into copper oxide (CuO) fine structure; the last one be the hybrid method of the two mentioned above as copper oxide fine structure being covered by SiO2 particles via dip coating method. Experiments of the comparison among the modification methods can be set apart into three sections, which are water static height between two parallel plates, average water rising speed and water net weight on braided copper wire and the last, two dimensional water diffusion rate on semi-finished vapor chamber with one or two meshed-wick layers.
The results show that CuO method enhanced static water height between two parallel plates by 42.9% to 50.9%. On braided copper wires, SiO2 method dominates in water rising speed while CuO method performs better at net water weight. The hybrid method performs in between under the two prospects. CuO method performs much better than other two methods involving dip-coating in horizontal water diffusion rate. However, it is only slightly superior to the acid-reduction-only sample. In the conclusion, a brief comparison of the results to their existing theoretical counterparts is made. Besides physical interpretation, prediction for finer tuning on modification parameters and suggestion on braiding pattern are both included. | en |
dc.description.provenance | Made available in DSpace on 2021-07-10T21:33:00Z (GMT). No. of bitstreams: 1 ntu-106-R03522325-1.pdf: 4759894 bytes, checksum: 24b0c262b4df8beaefd6bb308521eb02 (MD5) Previous issue date: 2017 | en |
dc.description.tableofcontents | Chapter 1 Introduction 1
1.1 Preface 1 1.2 Literature Review 2 1.2.1 Heat pipe and Vapor chamber 2 1.2.2 Copper surface modification 3 1.2.3 Capillarity 4 1.3 Objective 5 Chapter 2 Theory 10 2.1 Working principle of heat pipes and vapor chambers 10 2.1.1 Limitations to heat pipes and vapor chambers 11 2.2 Surface modification 12 2.2.1 Wettability and contact angle 12 2.2.2 Sol-gel 13 2.2.3 Hot alkali solution oxidation 15 2.3 Capillary rise 16 2.3.1 Single tube model 16 2.3.2 Imbibition through porous media 18 Chapter 3 Experiments 26 3.1 Chemicals and equipment 26 3.1.1 Chemicals 26 3.1.2 Equipment 27 3.2 Preparation 28 3.2.1 Dip-coating solution 28 3.2.2 Oxidation solution 28 3.2.3 Copper samples 29 3.3 Procedure 30 3.3.1 Exp.1: Static water height between two parallel plates 30 3.3.2 Exp.2: Observations of water on braided copper wire 30 3.3.3 Exp.3: Tests on semi-finished vapor chambers 31 Chapter 4 Results and Discussion 42 4.1 Scanning electron microscopy (SEM) results 42 4.1.1 Cleansing of black impurity on oxidized surface 42 4.1.2 Attempt on lower temperature for solution oxidation 43 4.1.3 Comparison of surface morphology 43 4.1.4 Hybrid treatment on braided copper wire 44 4.2 Theoretical predictions and experimental data 45 4.2.1 Exp.1: Static water height between two parallel plates 45 4.2.2 Exp.2: Observations of water on braided copper wire 46 4.2.3 Exp.3: Tests on semi-finished vapor chambers 48 Chapter 5 Conclusion and Future Prospect 61 5.1 Conclusion 61 5.2 Future prospect 62 Reference 65 | |
dc.language.iso | en | |
dc.title | 銅表面改質於熱導管與均熱板內微結構之毛細力提升 | zh_TW |
dc.title | Copper Surface Modification on Wick Structures in Heat Pipes and Vapor Chambers: An Improvement on Capillarity | en |
dc.type | Thesis | |
dc.date.schoolyear | 105-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 李達生,許進吉 | |
dc.subject.keyword | 表面改質,熱導管,均熱板,溶膠凝膠法,毛細力, | zh_TW |
dc.subject.keyword | surface modification,heat pipe,vapor chamber,sol-gel method,capillarity, | en |
dc.relation.page | 70 | |
dc.identifier.doi | 10.6342/NTU201701656 | |
dc.rights.note | 未授權 | |
dc.date.accepted | 2017-07-26 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-106-R03522325-1.pdf 目前未授權公開取用 | 4.65 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。