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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 童世煌(Shih-Huang Tung) | |
| dc.contributor.author | Chia-Ju Chang | en |
| dc.contributor.author | 張加儒 | zh_TW |
| dc.date.accessioned | 2021-06-17T05:04:34Z | - |
| dc.date.available | 2023-07-26 | |
| dc.date.copyright | 2018-07-26 | |
| dc.date.issued | 2018 | |
| dc.date.submitted | 2018-07-23 | |
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/71316 | - |
| dc.description.abstract | 環氧樹脂擁有優越的機械韌性、化學抵抗性，廣泛使用於工業塗層、黏著劑、封裝材料及複合材料等。現今許多硬化劑在室溫下即可與環氧樹脂快速反應，所以環氧樹脂與硬化劑一般分開存放，需要時再行混合，以避免不必要的固化反應，然而此方法有著保存及加工較為複雜的問題。本研究以不同有機溶劑系統，環氧樹脂硬化劑採用2-苯基咪唑與高分子聚己內酯，並以不同界面活性劑，在均質機高速攪拌下製備有機相/水相乳化液，藉由溶劑揮發法製備包覆環氧樹脂硬化劑之微膠囊。此微膠囊與環氧樹脂混合後可於室溫下長期存放，需要時再行加溫固化。我們探討不同溶劑、攪拌速度、界面活性劑種類、界面活性劑濃度、有機相與水相比例、硬化劑與高分子比例等製備條件與微膠囊形成之關係，並利用FT-IR、TGA、DSC分析物性、SEM觀測樣品之形貌及測試使用微膠囊交聯固化後成品之機械性質。研究發現採用無毒性溶劑乙酸乙酯作為有機相所製備之微膠囊在室溫與環氧樹脂混合後可保存7天以上不反應，經加熱至50℃可使外層保護之高分子熔融軟化，釋放出內含之硬化劑與環氧樹脂反應，形成交聯固化之成品，達成室溫下可長期存放，低溫即可交聯固化之目的。經過TGA鑑定以無毒性溶劑乙酸乙酯所製備之微膠囊環氧樹脂硬化劑含量為43 wt%，多於使用二氯甲烷所製備的30 wt%。測試機械性質後發現使用乙酸乙酯所製備之微膠囊與環氧樹脂固化反應後，相較於使用純硬化劑之表現，在韌性表現可提升46%。 | zh_TW |
| dc.description.abstract | Although epoxy resins have excellent mechanical and chemical properties, epoxy resins and curing agent are generally stored in two pots to prevent unnecessary curing reaction at room temperature. To solve this problem, we developed a one pot system which can be stored for a long time at room temperature by a simple, nontoxic processing. This involves the encapsulation of the curing agent, 2-phenylimidazole (2PhI), in polycaprolactone (PCL) microcapsules fabricated by oil-in-water emulsion and solvent evaporation method with different organic solvents and surfactants. The encapsulated curing agents can greatly extend the storage time when the microcapsules and epoxy are mixed at room temperature, and the curing reaction can be triggered at elevated temperature. The effect of solvent, rotation speed during the microcapsule formation, surfactant, the concentration of surfactant, the ratio of oil phase and water phase, and the ratio of 2PhI and PCL were investigated. We use SEM to observe the morphology, DSC to examine the curing behavior, TGA to measure the amount the curing agents, FT-IR to confirm the interaction between PVA and PCL, and test the mechanical properties of final curing epoxy specimen. The microcapsules fabricated by nontoxic solvent, ethyl acetate, contain 43 wt% curing agent and can be stored with epoxy for more than 7 days at room temperature without significant reaction while the curing reaction can be triggered upon heating to 50 ˚C. The toughness of cured specimens prepared with the microcapsules is 46% better than that with the pure curing agent. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-17T05:04:34Z (GMT). No. of bitstreams: 1 ntu-107-R05549006-1.pdf: 5393008 bytes, checksum: 2acb667e2db7160628ab10d94f634526 (MD5) Previous issue date: 2018 | en |
| dc.description.tableofcontents | 口試委員會審訂書 I
誌謝 II 摘要 III Abstract IV 目錄 V 圖目錄 VIII 表目錄 XI 第一章 緒論 1 1.1 前言與實驗動機 1 第二章 文獻回顧 3 2.1 環氧樹脂及環氧樹脂硬化劑 3 2.1.1 環氧樹脂之簡介 3 2.1.2 環氧樹脂硬化劑之簡介 7 2.1.3 環氧樹脂之應用 12 2.1.4 含環氧樹脂硬化劑之微膠囊 15 2.2 微膠囊化技術 16 2.2.1 微膠囊化技術之簡介 16 2.2.2 微膠囊化技術之發展 24 2.2.3 微膠囊化技術之應用 25 第三章 實驗方法與儀器 27 3.1 實驗藥品 27 3.1.1 高分子 27 3.1.2 環氧樹脂 27 3.1.3 環氧樹脂硬化劑 28 3.1.4 界面活性劑 28 3.1.5 溶劑 30 3.2 實驗步驟 31 3.2.1 微膠囊製備實驗步驟 31 3.2.2 實驗樣品名稱對照 33 3.3 實驗儀器與原理 35 3.3.1 場發射掃描式電子顯微鏡 (Field-Emission Scanning Electron Microscope, FE-SEM) 35 3.3.2 白金濺鍍機 (Sputter) 37 3.3.3 示差掃描熱量分析儀 (Differential Scanning Calorimetry, DSC) 37 3.3.4 傅立葉轉換紅外線光譜儀 (Fourier-transform infrared spectroscopy, FTIR) 38 3.3.5 熱重分析儀 (Thermogravimetric analysis, TGA) 38 3.3.6 萬能材料試驗機 (Universal Testing Machine) 39 3.3.7 蕭氏硬度試驗計 (Shore durometer) 39 3.3.8 衝擊試驗機 (Universal Impact Tester) 40 3.3.9 接觸角量測儀 (Contact Angle Analyzer) 42 第四章 結果與討論 43 4.1 製備含環氧樹脂硬化劑之微膠囊實驗參數 43 4.1.1 不同溶劑之影響 43 4.1.2 不同均質機轉速之影響 47 4.1.3 不同界面活性劑之影響 50 4.1.4 不同界面活性劑濃度之影響 55 4.1.5 不同有機相/水相比例之影響 57 4.1.6 不同硬化劑/高分子比例之影響 59 4.2 含環氧樹脂硬化劑之微膠囊性質鑑定與比較 61 4.2.1 含環氧樹脂硬化劑之微膠囊結構分析 61 4.2.2 含環氧樹脂硬化劑之微膠囊含量分析 68 4.2.3 含環氧樹脂硬化劑之微膠囊保存時間測試 71 4.2.4 含環氧樹脂硬化劑之微膠囊機械性質 75 第五章 結論 83 第六章 參考文獻 84 | |
| dc.language.iso | zh-TW | |
| dc.subject | 微膠囊化技術 | zh_TW |
| dc.subject | 硬化劑 | zh_TW |
| dc.subject | 環氧樹脂 | zh_TW |
| dc.subject | 溶劑揮發法 | zh_TW |
| dc.subject | 有機相/水相乳化液 | zh_TW |
| dc.subject | Epoxy | en |
| dc.subject | Curing agents | en |
| dc.subject | Microencapsulation | en |
| dc.subject | Oil-in-water emulsion | en |
| dc.subject | Solvent evaporation method | en |
| dc.title | 以有機相/水相乳化液及溶劑揮發法製備含環氧樹脂硬化劑之微膠囊 | zh_TW |
| dc.title | Microencapsulation of epoxy curing agent by oil-in-water emulsion and solvent evaporation method | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 106-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 李冠明(Kwang-Ming Lee),賴偉淇(Wei-Chi Lai),鄭智洋(Chih-Yang Cheng) | |
| dc.subject.keyword | 環氧樹脂,硬化劑,微膠囊化技術,有機相/水相乳化液,溶劑揮發法, | zh_TW |
| dc.subject.keyword | Epoxy,Curing agents,Microencapsulation,Oil-in-water emulsion,Solvent evaporation method, | en |
| dc.relation.page | 93 | |
| dc.identifier.doi | 10.6342/NTU201700731 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2018-07-23 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 高分子科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 高分子科學與工程學研究所 | |
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