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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 彭隆瀚 | |
dc.contributor.author | Jun-Wei Peng | en |
dc.contributor.author | 彭峻威 | zh_TW |
dc.date.accessioned | 2021-06-17T02:24:22Z | - |
dc.date.available | 2020-08-24 | |
dc.date.copyright | 2017-08-24 | |
dc.date.issued | 2017 | |
dc.date.submitted | 2017-08-19 | |
dc.identifier.citation | http://www.lightemittingdiodes.org/
李明道, 新式非揮發性記憶體之發展與挑戰, 奈米通訊, 21卷, No. 3, 國家奈米元件實驗室. http://www.nichia.co.jp/en/about_nichia/index.html Tutorial: Defects in semiconductors—Combining experiment and theory Audrius Al-kauskas, Matthew D. McCluskey, and Chris G. Van de Walle J. Appl. Phys. 119, 181101 (2016) Bias tuning charge-releasing leading to negative differential resistance in amorphous gallium oxide/Nb:SrTiO3 heterostructure P. C. Wang, P. G. Li, , Y. S. Zhi, D. Y. Guo, Q. Pan, J. M. Zhan, H. Liu, J. Q. Shen, and W. H. Tang A. Appl. Phys. Lett. 107, 262110 (2015) R. L. Puurunen, J. Appl. Phys. 97, 121301 (2005). Solid State Technology, March 1, 2007 http://www.itrc.narlabs.org.tw/Publication/Newsletter/no128/p10.php H. Kim, A. J. Kellock, and S. M. Rossnagel, “J. Appl. Phys.” 92, 7080 (2002). Plasma-assisted atomic layer deposition of metal oxides and nitrides / by Stephan Bastiaan Simon Heil. – Eindhoven : Technische Universiteit Eindhoven, 2007.- Pro-efschrift. S. B. S. Heil, J. L. van Hemmen, C. J. Hodson, N. Singh, J. H. Klootwijk, F. Roozeboom, M. C. M. van de Sanden, and W. M. M. Kessels, J. Vac. Sci. Technol. A 25, 1357 (2007). 李柏廷, “電漿輔助型原子層沉積之發光二極體特性研究”, 國立台灣大學光電工程學研究所碩士論文(2014). R. Al-Gaashani, S.Radiman, A.R.Daud, N.Tabet, Y.Al-Douri, “XPS and optical studies of different morphologies of ZnO nanostructures prepared by microwave methods”, Ceramics International 39 (2013) 2283–2292 Seokhoon Kim, Sanghyun Woo, Hyungchul Kim, Hyeongtag Jeon, “Atomic Layer Deposition of HfO2 Thin Films on Ultrathin SiO2 Formed by Remote Plasma Oxida-tion” Journal of the Korean Physical Society, Vol. 52, No. 4, April 2008, pp. 1103_1108 Jaehyoung Koo, Seokhoon Kim, Sangmin Jeon, Hyeongtag Jeon, Yangdo Kim and Youngdo Won, “Characteristics of Al2O3 Thin Films Deposited Using Dimethylalu-minum Isopropoxide and Trimethylaluminum Precursors by the Plasma-Enhanced Atomic-Layer Deposition Method” Journal of the Korean Physical Society, Vol. 48, No. 1, January 2006, pp. 131_136 John F. Moulder, William F. Stickle, Peter E. Sobol, Kenneth D. Bomben, 'Hand-book of X-ray photoelectron spectroscopy: A Reference Book of Standard Spectra for Identification and Interpretation of XPS Data', Physical Electronics, 1995. “Structural and Electrical Characterization of GaN Thin Film on Si(100)” American Journal of Analytical Chemistry,2011, 2, 984-988 “XPS analysis of aluminum nitride films deposited by plasma sourcemolecular beam epitaxy” (www.interscience.com) DOI 10.1002/sia.2874 蘇水祥, “矽晶圓清洗製程”,電子工程學系/所,義守大學. https://en.wikipedia.org/wiki/Transparent_conducting_film 王崧豊, “銦鎵系氧化物相變化記憶體與薄膜電晶體元件之研製”, 國立台灣大學光電工程學研究所博士論文(2010). https://zh.wikipedia.org/wiki/CIE1931 Computation of correlated color temperature and distribution temperature A.R. Roberson http://www.innolux.com/Pages/TW/Technology/TFT_LCD_TW.html | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/68534 | - |
dc.description.abstract | 本論文利用原子層沉積系統製作結合發出寬頻白光以及電阻型記憶特性的元件,內容分三部分,第一部分闡述寬頻白光及電阻型記憶操作的原理,第二部分為元件之製作及材料分析,包含了電漿輔助型原子層沉積系統的原理與操作、沉積材料成長速率之校正、X射線光電子能譜特性分析,元件完整的製程以及利用HRTEM觀察元件橫截面,第三部分為元件之量測及計算,包含電激發光光譜、色座標及相關色溫計算、電壓-電流特性、直流電壓掃描分析、單點脈衝電阻切換、穩定度分析。
吾人用電漿輔助型原子層沉積系統沉積了AlON/GaON夾層結構 (厚度為2/12/2、2/18/2、2/21/2、2/24/2、2/9/2/9/2、2/12/2/12/2、2/18/2/9/2及2/6/1/6/1/6/2 nm)八種結構,並製作在三種不同基板共18個元件,發現元件色溫範圍由1700K到3000K,元件閥值電壓範圍由2.5V到3.5V,而部份元件記憶體電阻切換抹寫次數可達10萬次,並且穩定時間至少10,000秒,多階層的資料儲存亦證實可能。 | zh_TW |
dc.description.abstract | In this thesis, we demonstrate a new kind of devices which com-bine broadband white light emission and ReRAM characteristics. The devices were prepared by Plasma-Enhanced Atomic Layer Deposition (PE-ALD).
There are three main parts in this thesis. First, we elaborate the mechanisms of broadband white light emission and ReRAM charac-teristics. Second, we introduce how to make our devices, including the mechanism and operation of PE-ALD, the calibration of growth rate and X-ray photoelectron spectroscopy analysis of each material, and the whole device fabrication process. After fabrication, we observed the device’s cross section by using HRTEM. The third part is the meas-urement and analysis of devices, including electroluminescence spectra, color coordinates, correlated color temperature, I-V characteristics, DC voltage sweep analysis, pulse memory switching operation and reten-tion time analysis. We used PE-ALD to deposit AlON/GaON layers structure(of thickness 2/12/2, 2/18/2, 2/21/2, 2/24/2,2/9/2/9/2, 2/12/2/12/2,2/18/2/9/2 and 2/6/1/6/1/6/2 nm), and to fabricate them on three different substrates. There are 18 devices in total. We discovered CCT of the devices ranges from 1700K to 3000K, and the threshold voltage range is from 2.5V to 3.5V. ReRAM switching operations of some devices can be as many as 105 cycles, and the retention time can be at least 10,000 seconds. Multilevel resistance states were confirmed to be possible, too. | en |
dc.description.provenance | Made available in DSpace on 2021-06-17T02:24:22Z (GMT). No. of bitstreams: 1 ntu-106-R04941040-1.pdf: 5648457 bytes, checksum: f3c9aac1b80bc3a43f526651c78d2c7c (MD5) Previous issue date: 2017 | en |
dc.description.tableofcontents | Chapter 1 緒論 1
1.1 白光二極體簡介 1 1.2 新式非揮發性記憶體簡介 3 1.3 研究動機與論文概述 8 1.3.1 研究動機 8 1.3.2 論文概述 10 Chapter 2 白光二極體及二極記憶體元件之原理 11 2.1 白光二極體的發光原理 11 2.2 二極記憶體的操作原理 16 Chapter 3 白光二極體及二極記憶體的元件製作 19 3.1 原子層沉積系統 Atomic Layer Deposition 19 3.1.1 ALD技術發展沿革 20 3.1.2 ALD成長機制 22 3.1.3 ALD成長模式概述 24 3.2 PE-ALD機台架構及沉膜材料分析 27 3.2.1 機台架構 27 3.2.2 PE-ALD氮氧化物材料測試與分析 32 3.3 元件製作流程 44 3.4 元件材料分析 55 Chapter 4 元件量測計算 61 4.1 量測系統架構與方法 62 4.1.1 量測系統架構 62 4.1.2 量測計算方法 65 4.2 發光二極體量測及模擬 72 4.2.1 發光二極體光性量測 72 4.2.2 發光二極體電性量測 86 4.3 二極記憶體量測分析 92 4.3.1 直流電壓掃描分析 92 4.3.2 單點脈衝電阻切換 97 4.3.3 記憶時間分析 102 Chapter 5 結論與未來展望 106 參考文獻 108 | |
dc.language.iso | zh-TW | |
dc.title | 三族氮氧化物白光二極體及二極記憶體之研製 | zh_TW |
dc.title | A Development of Ⅲ-Nitride-Oxide Based
White Light Emitting Diode and Diode Memory | en |
dc.type | Thesis | |
dc.date.schoolyear | 105-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 王維新,賴志明 | |
dc.subject.keyword | 發光二極體,電阻型記憶體, | zh_TW |
dc.subject.keyword | LED,RRAM, | en |
dc.relation.page | 110 | |
dc.identifier.doi | 10.6342/NTU201703835 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2017-08-19 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 光電工程學研究所 | zh_TW |
顯示於系所單位: | 光電工程學研究所 |
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