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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/66515完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 許麗(Li Xu) | |
| dc.contributor.author | Kuan-Ting Chiang | en |
| dc.contributor.author | 江冠廷 | zh_TW |
| dc.date.accessioned | 2021-06-17T00:40:02Z | - |
| dc.date.available | 2021-02-20 | |
| dc.date.copyright | 2021-02-20 | |
| dc.date.issued | 2021 | |
| dc.date.submitted | 2021-02-08 | |
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/66515 | - |
| dc.description.abstract | 矽基材料在半導體元件的發展史上扮演舉足輕重的地位，同時隨著近年來穿戴式電子元件的蓬勃發展，研究各材料於柔性基板的加工成為重要的課題，因此研究矽基半導體材料於柔性基板上的加工成為本實驗研究的重點。我們透過527 nm 奈秒脈衝雷射的應用，來實現以選擇性雷射燒結技術將矽奈米/微米顆粒燒結於PET柔性基板上，以矽奈米/微米顆粒皆成功燒結出緻密的矽微米線，而圖形化掃描解析度以矽微米顆粒燒結可達約100 μm，而以矽奈米顆粒燒結約130 μm。另外透過雷射二次退火的方式，來改善雷射燒結而造成的表面不平整性，並分別歸納出改善表面輪廓之機制，最後本實驗示範以選擇性雷射燒結技術製作可撓性矽膜溫度感測器，來作為本實驗的研究成果。 | zh_TW |
| dc.description.abstract | Silicon-based materials play a pivotal role in the development history of semiconductor components. In addition, with the vigorous development of wearable electronic divices in recent years, study on the processing of various materials on flexible substrates has become a hot topic. Therefore, study on silicon particles on flexible substrates becomes a focus in this study. Through the application of 527 nm nanosecond pulsed lasers, we achieved the selective laser sintering method to sinter the silicon nano/micron-particles on the PET substrate, and successfully sintered the silicon consecutive micro-line with the silicon nano/micron particles. The resolution of the pattern can reach about 100 μm with silicon micro-particles sintering, and about 130 μm with silicon nano-particles sintering. Moreover, the laser secondary annealing method is used to improve the surface unevenness caused by laser sintering process. Finally, we demonstrate the selective laser sintering method to make flexible silicon film temperature sensor. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-17T00:40:02Z (GMT). No. of bitstreams: 1 U0001-0202202113391800.pdf: 7035209 bytes, checksum: 4973a2bc753059e4c509adea891f1762 (MD5) Previous issue date: 2021 | en |
| dc.description.tableofcontents | 誌謝 i 中文摘要 ii Abstract iii 目錄 iv 圖目錄 vii 表目錄 xii 符號說明 xiii Chapter 1 緒論 1 1-1 前言 1 1-2 本文內容與架構 3 Chapter 2 文獻回顧和實驗動機 4 2-1 金屬顆粒之雷射燒結 4 (a)金顆粒之雷射燒結 4 (b)銀顆粒之雷射燒結 7 (c)合金顆粒之雷射燒結 9 2-2 非金屬顆粒之雷射燒結 10 (a)陶瓷顆粒之雷射燒結 10 (b)塑膠顆粒之雷射燒結 12 (c)矽顆粒之雷射燒結 13 2-3 實驗動機和目的 18 Chapter 3 實驗方法與實驗架構 19 3-1 實驗方法 19 (a) 矽顆粒塗層之實驗流程 19 (b) 選擇性雷射燒結技術之實驗流程 20 3-2 奈米/微米矽顆粒之塗層 21 3-3脈衝雷射掃描系統 23 (a)脈衝雷射和光路設計 24 (b) 2D 振鏡(2D Galvanometer) 26 (c)微控定位台(Linear Stage) 28 3-4 奈米/微米材料分析設備 30 (a)鎢燈絲式掃描式電子顯微鏡(SEM) 30 (b)聚焦離子束與電子束顯微系統(FIB-SEM) 32 (c)能量散射X射線譜(EDS) 33 3-5 電性分析設備 34 (a)數位萬用電錶(Digital Multimeter, DMM) 34 (b)電源量測單元(Source Measure Unit, SMU) 35 Chapter 4 結果與討論 36 4-1矽微米顆粒之塗層 36 4-2選擇性雷射燒結系統校正 38 (a)脈衝雷射功率設定 38 (b)脈衝雷射之光斑大小 41 4-3矽微米顆粒之沉積退火 45 (a)雷射功率和掃描次數對沉積結果之影響 45 (b)脈衝重疊率對沉積結果之影響 47 (c)雷射功率、掃描次數和脈衝重疊率對線寬之影響 48 (d)矽微米線之表面形態分析 50 4-4 矽微米顆粒之二次退火 52 4-5矽奈米顆粒之塗層 59 4-6矽奈米顆粒之沉積退火 61 (a)雷射功率、掃描次數對沉積結果之影響 61 (b)雷射功率、掃描次數對線寬之影響 64 (c)矽微米線之表面形態分析 65 4-7矽奈米顆粒之二次退火 66 4-8 FIB-SEM觀察驗證 74 4-9矽膜溫度感測器 79 Chapter 5 結論與未來展望 83 參考文獻 85 | |
| dc.language.iso | zh-TW | |
| dc.subject | 可撓曲溫度感測器 | zh_TW |
| dc.subject | 選擇性雷射燒結技術 | zh_TW |
| dc.subject | 柔性基板 | zh_TW |
| dc.subject | 矽微奈米顆粒 | zh_TW |
| dc.subject | Selective laser sintering | en |
| dc.subject | Silicon nano/micro-particles | en |
| dc.subject | Flexible substrate | en |
| dc.subject | Flexible Silicon film temperature sensor | en |
| dc.title | 在柔性基板上選擇性雷射燒結矽微奈米顆粒 | zh_TW |
| dc.title | Selective Laser Sintering Silicon Nano/Micro-particles on Flexible Substrate | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 109-1 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 莊嘉揚(Jia-Yang Juang),呂明璋(Ming-Chang Lu) | |
| dc.subject.keyword | 選擇性雷射燒結技術,矽微奈米顆粒,柔性基板,可撓曲溫度感測器, | zh_TW |
| dc.subject.keyword | Selective laser sintering,Silicon nano/micro-particles,Flexible substrate,Flexible Silicon film temperature sensor, | en |
| dc.relation.page | 89 | |
| dc.identifier.doi | 10.6342/NTU202100372 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2021-02-12 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
| 顯示於系所單位： | 機械工程學系 | |
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