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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 盧信嘉 | |
dc.contributor.author | Yien-Tien Chou | en |
dc.contributor.author | 周晏田 | zh_TW |
dc.date.accessioned | 2021-06-16T13:23:40Z | - |
dc.date.available | 2023-12-31 | |
dc.date.copyright | 2013-07-30 | |
dc.date.issued | 2013 | |
dc.date.submitted | 2013-07-24 | |
dc.identifier.citation | [1] Stephen H. Hall, Garrett W. Hall, and James A. McCall, High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices. New York: Wiley, 2000, ch. 10.
[2] Toshio Sudo, Hideki Sasaki, Norio Masuda, and James L. Drewniak, “Electromagnetic interference (EMI) of system-on-package (SOP),” IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 304–314, May 2004. [3] Clayton R. Paul, Introduction to Electromagnetic Compatibility. Wiley-Interscience, 2006, ch. 6 and ch. 8. [4] Mohamed Ramdani, Etienne Sicard, Alexandre Boyer, Sonia Ben Dhia, James J. Whalen, Todd H. Hubing, Mart Coenen, and Osami Wada, “The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future,” IEEE Trans. Electromagn. Compat., vol. 51, no. 1, pp. 78–100, Feb. 2009. [5] Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions, IEC 61967-1 Ed.1, 2002. [6] Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: TEM cell and wideband TEM cell method, IEC 61967-2 Ed.1, 2005. [7] James P. Muccioli, Terry M. North, and Kevin P. Slattery, “Investigation of the theoretical basis for using a 1 GHz TEM cell to evaluate the radiated emissions from integrated circuits,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 1996, pp. 63–67. [8] Kevin P. Slattery, James P. Muccioli, and Terry North, “Measuring the radiated emissions from a family of microprocessors using a 1-GHz TEM cell,” IEEE Trans. Electromagn. Compat., vol. 41, no. 2, pp. 146–152, May 1999. [9] W. R. Pfaff, “Application independent evaluation of electromagnetic emissions for integrated circuits by the measurement of conducted signals,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 1998, pp. 219–224. [10] Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions – 1Ω/150Ω direct coupling method, IEC 61967-4 Ed.1, 2002. [11] IEC 62127, TR, Ed.1: Application Guidance to IEC 61967-4, Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions – 1 Ohm/150 Ohm direct coupling method, IEC 62127, 2004. [12] Michael Joester, Frank Klotz, Wolfgang Pfaff, and Thomas Steinecke, Generic IC EMC test specification, Jan. 2010. [13] Franco Fiori and Francesco Musolino, “Measurement of integrated circuit conducted emissions by using a transverse electromagnetic mode (TEM) cell,” IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 622–628, Nov. 2001. [14] Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - magnetic probe method, IEC 61967-6, 2002. [15] Amendment 1 to IEC 61967-6, Ed. 1: Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - magnetic probe method, IEC 61967-6 Amend 1/Ed.1, 2008. [16] Franco Fiori and Francesco Musolino, “Comparison of IC conducted emission measurement methods,” IEEE Trans. Electromagn. Compat., vol. 52, no. 3, pp. 839–845, June 2003. [17] Yamarita Villavicencio, Francesco Musolino, Franco Fiori, Dacide Pandini, “Influence of the IEC 61967 test board on IC electromagnetic emissions,” in IEEE Int. Zurich Symp. on EMC, Jan. 2009, pp. 281–284. [18] Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 3: Measurement of radiated emissions – Surface scan method, IEC 61967-3, 2005. [19] Constantine A. Balanis, Antenna Theory Analysis and Design. Wiley-Interscience, 2005, ch. 4. [20] R. R. Goulette, “The measurement of radiated emissions from integrated circuits,” in IEEE Int. Symp. Electromagn. Compat., Aug. 1992, pp. 340–345. [21] Mizuki Iwanami, Etsushi Yamazaki, Ken Nakano, Toshio Sudo, Shigeki Hoshino, Shinichi Wakana, Masato Kishi, and Masahiro Tsuchiya, “Magnetic near-field measurements over LSI package pins by fiber-edge magnetooptic probe,” Journal of Kightwave Tech., vol. 21, no. 12, pp. 3273–3281, Dec. 2003. [22] Bernd Deutschmann, Harald Pitsch, and Gunter Langer, “Near field measurements to predict the electromagnetic emission of integrated circuits,” in Proc. of the 5th Int. Workshop on Electromagn. Compat. Integr. Circuits, Nov. 2005, pp. 27–32. [23] K. Haelvoet, S. Criel, F. Dobbelaere, L. Martens, P. De Langhe, and R. De Smedt, “Near-field scanner for the accurate characterization of electromagnetic fields in the close vicinity of electronic devices and systems,” in Proc. IEEE Instrum. Meas. Technol. Conf., June 1996, pp. 1119–1123. [24] Bernd Deutschmann and Roland Jungreithmair, “Visualizing the electromagnetic emission at the surface of ICs,” in IEEE Int. Symp. Electromagnetic Compat., May 2003, pp. 1125–1128. [25] David Baudry, Christian Arcambal, Anne Louis, B′elahc`ene Mazari, and Philippe Eudeline, “Applications of the near-field techniques in EMC investigations,” IEEE Trans. Electromagn. Compat., vol. 49, no. 3, pp. 485–493, Aug. 2007. [26] Tristan Dubois, Sylvie Jarrix, Annick Penarier, Philippe Nouvel, Daniel Gasquet, Laurent Chusseau, and Bruno Azais, “Near-field electromagnetic characterization and perturbation of logic circuits,” IEEE Trans. Instrum. Meas., vol. 57, no. 11, pp. 2398–2404, Nov. 2008. [27] K. Hu, H. Weng, D. Beetner, D. Pommerenke, J. Drewniak, K. Lavery, and J. Whiles, “Application of chip-level EMC in automotive product design,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 2006, pp. 842–848. [28] Min-Woo Kim, Do-Wan Kim, Bon-Sung Koo, Yong-Bum Kim, On-Sik Choi, and Nam-Deog Kim, “Chip level techniques for EMI reduction in LCD panels,” in IEEE Int. Zurich Symp. on EMC, Jan. 2009, pp. 441–444. [29] Masahiro Yamaguchi, Hideki Toriduka, Shoichi Kobayashi, Takeshi Sugawara, Naofumi Hommaa, Akashi Satoh, and Takafumi Aoki, “Development of an on-chip micro shielded-loop probe to evaluate performance of magnetic film to protect a cryptographic LSI from electromagnetic analysis,” in IEEE Int. Symp. Electromagnetic Compat., July 2010, pp. 103–108. [30] Shoichi Kobayashi, Hideki Torizuka, Sandeep Dhungana, Masahiro Yamaguchi, “Measurement of RF current waveform of a source driver chip used in a liquid crystal-TV display panel,” in IEEE Int. Symp. Electromagnetic Compat., July 2010, pp. 505–508. [31] Clayton R. Paul, “A comparison of the contributions of common-mode and differential-mode currents in radiated emissions,” IEEE Trans. Electromagn. Compat., vol. 31, no. 2, pp. 189–193, May 1989. [32] David M. Hockanson, James L. Drewniak, Todd H. Hubing, Thomas P. Van Doren, Fei Sha, and Michael J. Wilhelm, “Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables,” IEEE Trans. Electromagn. Compat., vol. 38, no. 4, pp. 557–566, Nov. 1996. [33] Adam Tankielun, Uwe Keller, Etienne Sicard, Peter Kralicek, and Bertrand Vrignon, “Electromagnetic near-field scanning for microelectronic test chip investigation,” IEEE EMC Society Newsletter, Issue no. 208, pp. 68–72, Winter 2006. [34] Haixiao Weng, Daryl G. Beetner, Richard E. DuBroff, and Jin Shi, “Estimation of high-frequency currents from near-field scan measurements,” IEEE Trans. Electromagn. Compat., vol. 49, no. 4, pp. 805–815, Nov. 2007. [35] Paul-Andŕe Barri`ere, Jean-Jacques Laurin, and Yves Goussard, “Mapping of equivalent currents on high-speed digital printed circuit boards based on near-field measurements,” IEEE Trans. Electromagn. Compat., vol. 51, no. 3, pp. 649–658, Aug. 2009. [36] Wout Joseph and Luc Martens, “The influence of the measurement probe on the evaluation of electromagnetic fields,” IEEE Trans. Electromagn. Compat., vol. 43, no. 2, pp. 339–349, May 2003. [37] Tadao Nagatsuma, Mitsuru Shinagawa, Nabil Sahri, Ai-ichiro Sasaki, Yakov Royter, and Akihiko Hirata, “1.55-μm photonic systems for microwave and millimeter-wave measurement,” IEEE Trans. Microwave Theory Tech., vol. 49, no. 10, pp. 1831–1839, Oct. 2001. [38] J. S. Dahele and A. L. Cullen, “Electric probe measurements on microstrip,” IEEE Trans. Microwave Theory Tech., vol. 28, no. 7, pp. 752–755, July 1980. [39] Kevin P. Slattery, Jeffrey W. Neal, and Wei Cui, “Near-field measurements of VLSI devices,” IEEE Trans. Electromagn. Compat., vol. 41, no. 4, pp. 374–384, Nov. 1999. [40] D. Baudry, A. Louis, and B. Mazari, “Characterization of the open ended coaxial probe used for near field measurements in EMC applications,” PIER, Progr. Electromagn. Res., vol. 60, pp. 311–333, 2006. [41] Sylvie Jarrix, Tristan Dubois, Ronan Adam, Philippe Nouvel, Bruno Azais, and Daniel Gasquet, “Probe characterization for electromagnetic near-field studies,” IEEE Trans. Instrum. Meas., vol. 59, no. 2, pp. 292–300, Feb. 2010. [42] Daisuke Uchida, Toshiaki Nagai, Yoshitaka Oshima, and Shinichi Wakana, “Novel high-spatial resolution probe for electric near-field measurement,” in Proc. IEEE Rasio and Wireless Symp., Jan. 2011, pp. 299–232. [43] Yingjie Gao and Ingo Wolff, “Miniature electric near-field probes for measuring 3-D fields in planar microwave circuits,” IEEE Trans. Microwave Theory Tech., vol. 46, no. 7, pp. 907–913, July 1998. [44] Yingjie Gao, Andreas Lauer, Qiming Ren, and Ingo Wolff, “Calibration of electric coaxial near-field probes and applications,” IEEE Trans. Microwave Theory Tech., vol. 46, no. 11, pp. 1694–1703, Nov. 1998. [45] Jung-Hwan Choi, Jung-Ick Moon, and Seong-Ook Park, “Measurement of the modulated scattering microwave fields using dual-phase lock-in amplifier,” IEEE Antennas Wireless Propag. Lett., vol. 3, no. 1, pp. 340–343, Dec. 2004. [46] R. Justice and V. H. Rumsey, “Measurement of electric field distributions,” IRE Trans. Antennas Propag., vol. 3, no. 4, pp. 177–180, Oct. 1955. [47] J. H. Richmond, “A modulated scattering technique for measurement of field distributions,” IRE Trans. Microwave Theory Tech., vol. 3, no. 4, pp. 13–15, July 1955. [48] Thomas P. Budka, Scott D. Waclawik, and Gabriel M. Rebeiz, “A coaxial 0.5-18 GHz near electric field measurement system for planar microwave circuits using integrated probes,” IEEE Trans. Microwave Theory Tech., vol. 44, no. 12, pp. 2174–2184, Dec. 1996. [49] H. Whiteside and R. W. P. King, “The loop antenna as a probe,” IEEE Trans. Antennas Propag., vol. AP-12, pp. 291–297, May 1964. [50] John D. Dyson, “Measurement of near fields of antennas and scatterers,” IEEE Trans. Antennas Propag., vol. AP-21, no. 4, pp. 446–460, July 1973. [51] Motohisa Kanda, “Standard probes for electromagnetic field measurements,” IEEE Trans. Antennas Propag., vol. AP-41, no. 10, pp. 1349–1364, Oct. 1993. [52] Mark I. Montrose and Edward M. Nakauchi, Testing for EMC Compliance: Approaches and Techniques. Wiley-IEEE Press, 2004, ch. 5. [53] X. Dong, S. Deng, T. Hubing, and D. Beetner, “Analysis of chip-level EMI using near-field magnetic scanning,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 2004, pp. 174–177. [54] Yingjie Gao and Ingo Wolff, “A new miniature magnetic field probe for measuring three-dimensional fields in planar high-frequency circuits,” IEEE Trans. Microwave Theory Tech., vol. 44, no. 6, pp. 911–918, June 1996. [55] Jung-Min Kim, Woo-Tae Kim, and Jong-Gwan, “Resonance-suppressed magnetic field probe for EM field-mapping system,” IEEE Trans. Microwave Theory Tech., vol. 53, no. 9, pp. 2693–2699, Sep. 2005. [56] Samuel S. Osofsky and S. E. Schwarz, “Design and performance of a non-contacting probe for measurements on high-frequency planar circuits,” IEEE Trans. Microwave Theory Tech., vol. 40, no. 8, pp. 1701–1708, Aug. 1992. [57] M. Yamaguchi, S. Yabukami, and K. I. Arai, “A new permeance meter based on both lumped elements/transmission line theories,” IEEE Trans. Magn., vol. 32, no. 5, pp. 4941–4943, Sep. 1996. [58] M. Yamaguchi, S. Yabukami, H. Yurugi, K. Nakada, K. I. Arai, A. Itagaki, K. Itagaki, N. Saito, K. Fuda, M. Watanabe, H. Takahashi, T. Tamogami, and Y. Sakurada, “Two dimensional electromagnetic noise imaging system using planar shielded-loop coil array,” in IEEE Int. Symp. Electromagnetic Compat., May 1999, pp. 51–54. [59] Norio Masuda, Naoya Tamaki, Toshihide Kuriyama, Jin Ching Bu, Masahiro Yamaguchi, and Ken-lchi Arai, “High frequency magnetic near field measurement on LSI chip using planar multi-layer shielded loop coil,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 2003, pp. 80–85. [60] Naoya Tamaki, Norio Masuda, Toshihide Kuriyama, Jin-Ching Bu, Masahiro Yamaguchi, and Ken-Ichi Arai, “A miniature thin-film shielded-loop probe with a flip-chip bonding for magnetic near field measurements,” IEICE Trans. Electron. (Japanese Edition), vol. J87-C, no. 3, pp. 335–342, Mar. 2004. [61] Noriaki Ando, Norio Masuda, Naoya Tamaki, Toshihide Kuriyama, Shinsaku Saito, Kunio Kato, Keishi Ohashi, Mikiko Saito, and Masahiro Yamaguchi, “Miniaturized thin-film magnetic field probe with high spatial resolution for LSI chip measurement,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 2004, pp. 357–362. [62] N. Ando, N. Masuda, N. Tamaki, T. Kuriyama, M. Saito, S. Saito, K. Kato, K. Ohashi, and M. Yamaguchi, “Development of miniaturized thin-film magnetic field probes for on-chip measurement,” J. Magn. Soc. Jpn., vol. 30, no. 4, pp. 429–434, 2006. [63] Masahiro Yamaguchi, Shota Koya, Hideki Torizuka, Satoshi Aoyama, and Shoji Kawahito, “Shielded-loop-type on chip magnetic-field probe to evaluate radiated emission from thin-film noise suppressor,” IEEE Trans. Magn., vol. 43, no. 6, pp. 2370–2372, June 2007. [64] Hiroki Funato and Takashi Suga, “Magnetic Near-field probe for GHz band and spatial resolution improvement technique,” in IEEE Int. Zurich Symp. on EMC, Mar 2006, pp. 284–287. [65] Shun-Yun Lin, Shang-Kuei Yen, Wen-Shyang Chen, and Pao-Hsia Cheng, “Printed magnetic field probe with enhanced performances,” in IEEE Asia Pacific Microwave Conf. Dig., Dec. 2009, pp. 649–652. [66] Satoshi Aoyama, Masahiro Yamaguchi, and Shoji Kawahito, “Fully integrated active magnetic probe for high-definition near-field measurement,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 2006, pp. 427–429. [67] Satoshi Aoyama, Shoji Kawahito, and Masahiro Yamaguchi, “An active magnetic probe array for the multiple-point concurrent measurement of electromagnetic emissions,” IEEE Trans. Magn., vol. 42, no. 10, pp. 3303–3305, Oct. 2006. [68] EMSCAN, Alberta, Canada, 2010. [Online]. Available: http://www.emscan.com [69] Motohisa Kanda, “An electromagnetic near-field sensor for simultaneous electric and magnetic-field measurements,” IEEE Trans. Electromagn. Compat., vol. 26, no. 3, pp. 102–110, Aug. 1984. [70] Satoshi Zazama, Shinichi Shinohara, and Risaburo Sato, “Estimation of current and voltage distributions by scanning coupling probe,” IEICE Trans. Commun., vol. E83-B, no. 3, pp. 460–466, Mar. 2000. [71] Satoshi Kazama and Ken Ichi Arai, “Adjacent electric field and magnetic field distribution measurement system,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 2002, pp. 395–400. [72] Shaohua Li, Kuifeng Hu, Daryl Beetner, James Drewniak, James Reck, Matt O'Keefe, Kai Wang, Xiaopeng Dong, and Kevin Slattery, “Development and application of a high-resolution thin-film probe,” in IEEE Int. Symp. Electromagnetic Compat., July 2007, pp. 1–5. [73] James N. Reck, Kuifeng Hu, Shaohua Li, Haixiao Weng, Daryl G. Beetner, Matthew J. O’Keefe, Darlene S. Ramsay, and James L. Drewniak, “Fabrication of two-layer thin-film magnetic-field microprobes on freestanding SU-8 photoepoxy,” IEEE Trans. Device Mater. Rel., vol. 10, no. 1, pp. 26–32, Mar. 2010. [74] Tun Li, Yong Cheh Ho, and David Prommerenke, “Orthogonal loops probe design and characterization for near-field measurement,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 2008, pp. 18–22. [75] Kyoung Yang, Gerhard David, Stephen V. Roberston, John F. Whitaker, and Linda P. B. Katehi, “Electrooptic mapping of near-field distributions in integrated microwave circuits,” IEEE Trans. Microwave Theory Tech., vol. 46, no. 12, pp. 2338–2343, Dec. 1998. [76] Shinichi Wakana, Takuya Ohara, Mari Abe, Etsushi Yamazaki, Masato Kishi, and Masahiro Tsuchiya, “Fiber-edge electrooptic/magnetooptic probe for spectral-domain analysis of electromagnetic field,” IEEE Trans. Microwave Theory Tech., vol. 48, no. 12, pp. 2611–2616, Dec. 2000. [77] Etsushi Yanazaki, Hyonde Park, Shinichi Wakana, Masto Kishi, and Masahiro Tsuchiya, “Implementation of magneto-optic probe with > 10 GHz bandwidth,” Jpn. J. Appl. Phys., vol. 41, no. 7B, pp. L864–866, July 2002. [78] Etsushi Yanazaki, Shinichi Wakana, Masto Kishi, and Masahiro Tsuchiya, “10 GHz-class magneto-optic field sensing with bi-substituted rare-earth ion garnet rotation magnetization employed,” Jpn. J. Appl. Phys., vol. 41, no. 2A, pp. 904–907, Feb. 2002. [79] Mizuki Iwanami Shigeki Hoshino, Masto Kishi, and Masahiro Tsuchiya, “Wideband magnetooptic probe with 10 um-class spatial resolution,” Jpn. J. Appl. Phys., vol. 43, no. 4B, pp. 2288–2292, Apr. 2004. [80] W. Liang, G. Hygate, J. F. Nye, D. G. Gentle, and R. J. Cook, “A probe for making near-field measurements with minimal disturbance: The optically modulated scatterer,” IEEE Trans. Antennas Propag., vol. 45, no. 5, pp. 772–780, May 1997. [81] Hamidreza Memarzadeh-Tehran, Jean-Jacques Laurin, and Raman Kashyap, “Optically modulated probe for precision near-field measurements,” IEEE Trans. Instrum. Meas., vol. 59, no. 10, pp. 2755–2765, Oct. 2010. [82] Eiji Suzuki, Satoru Arakawa, Hiroyasu Ota, Ken Ichi Arai, and Risaburo Sato, “Optical magnetic field probe working up to 15 GHz using CdTe electrooptic crystals,” IEEE Trans. Electromagn. Compat., vol. 47, no. 2, pp. 344–351, May 2005. [83] Eiji Suzuki, Satoru Arakawa, Hiroyasu Ota, Ken Ichi Arai, and Risaburo Sato, “Optical magnetic field probe with a loop antenna element doubly loaded with electrooptic crystals,” IEEE Trans. Electromagn. Compat., vol. 46, no. 4, pp. 641–647, Nov. 2004. [84] Takashi Harada, Hideki Sasaki, and Eiji Hankui, “Time-domain magnetic field waveform measurement near printed circuit boards,” Electrical Engineering in Japan, vol. 125, no. 4, 1998, translated from Denki Gakkai Ronbunshi, vol. 117-A, no. 5, May 1997, pp. 523-530. [85] Takashi Harada, Norio Masuda, and Masahiro Yamaguchi, “Near-field magnetic measurements and their application to EMC of digital equipment,” IEICE Trans. Electron., vol. E89-C, no. 1, pp. 9–15, Jan. 2006. [86] Jan Van Niekerk, Farron L. Dacus, and Steven Bible, “Matching loop antennas for short-range radios,” Microwaves RF, pp. 72–84, Aug. 2002. [87] Douglas C. Smith, “Signal and noise measurement techniques using magnetic field probes,” in IEEE Int. Symp. Electromagn. Compat., Aug. 1999, pp.559-563. [88] Yien-Tien Chou and Hsin-Chia Lu, “Electric field coupling suppression using via fences for magnetic near-field shielded-loop coil probes in low temperature cofired ceramic,” in IEEE Int. Symp. Electromagn. Compat., Aug. 2011, pp.6-10. [89] Carlo F. M. Carobbi, Luigi M. Millanta, and Lorenzo Chiosi, “The high-frequency behavior of the shield in the magnetic-field probes,” in IEEE Int. Symp. Electromagn. Compat., Aug. 2000, pp. 35–40. [90] Carlo F. M. Carobbi and Luigi M. Millanta, “Analysis of the common-mode rejection in the measurement and generation of magnetic fields using loop probes,” IEEE Trans. Instrum. Meas., vol. 53, no. 2, pp. 514–523, Apr. 2004. [91] Lap Kun Yeung and Ke-Li Wu, “A compact second-order LTCC bandpass filter with two finite transmission zeros,” IEEE Trans. Microwave Theory Tech., vol. 51, no. 2, pp. 337–341, Feb. 2003. [92] FINETECH. [Online]. http://www.finetech.de [93] William J. Greig, Integrated Circuit Packaging, Assembly and Interconnections. Berlin, Germany: Springer, 2007, ch. 11. [94] Matthias Spang, Manfred Albach, and Goeran Schubert, “Response of a magnetic loop probe to the current and voltage on a microstrip line,” in IEEE Int. Symp. Electromagn. Compat., Aug. 2008, pp. 1–5. [95] Farron L. Dacus, Jan Van Niekerk, and Steven Bible, “Introducing loop antennas for short-range radios,” Microwaves RF, pp. 80–88, July 2002. [96] AET, Inc. [Online]. http://www.aetjapan.com [97] LANGER EMV Technik. [Online]. http://www.langer-emv.de [98] MORITA Tech. [Online]. http://www.morita-tech.co.jp [99] Amber Precision Instruments (api). [Online]. http://www.amberpi.com [100] Edgar J. Denlinger, “A frequency dependent solution for microstrip transmission lines,” IEEE Trans. Microwave Theory Tech., vol. 19, no. 1, pp. 30–39, Jan. 1971. [101] David E. Bockelman and William R. Eisenstadt, “Combined differential and common-mode scattering parameters: theory and simulation,” IEEE Trans. Microwave Theory Tech., vol. 43, no. 7, pp. 1530–1539, July 1995. [102] Jin Shi, Michael A. Cracraft, Kevin P. Slattery, Masahiro Yamaguchi, and Richard E. DuBroff, “Calibration and compensation of near-field scan measurements,” IEEE Trans. Electromagn. Compat., vol. 47, no. 3, pp. 642–650, Aug. 2005. [103] Adam Tankielun, Heyno Garbe, and Werner John, “Calibration of electric probes for post-processing of near-field scanning data,” in IEEE Int. Symp. Electromagnetic Compat., Aug. 2006, pp. 119–124. [104] Haixiao Weng, Daryl G. Beetner, and Richard E. DuBroff, “Frequency-domain probe calibration and compensation using reciprocity,” IEEE Trans. Electromagn. Compat., vol. 53, no. 1, pp. 2–10, Feb. 2011. [105] Ryadh Brahimi, Adam Kornaga, Mohamed Bensetti, David Baudry, Zouheir Riah, Anne Louis, and Belahcene Mazari, “Postprocessing of near-field measurement based on neural networks,” IEEE Trans. Instrum. Meas., vol. 60, no. 2, pp. 539–546, Feb. 2011. [106] Dirk Deschrijver, Filip Vanhee, Davy Pissoort, and Tom Dhaene, “Automated near-field scanning algorithm for the EMC analysis of electronic devices,” IEEE Trans. Electromagn. Compat., vol. 54, no. 3, pp. 502–510, June 2012. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/62022 | - |
dc.description.abstract | 隨著積體電路(IC)操作速度的大幅提升,與日益複雜的電路架構和密集封裝,電磁干擾(EMI)的問題日趨嚴重。電磁干擾產生由干擾源、干擾源傳輸路徑、輻射天線構成,為了有效的抑制電磁干擾,找出干擾源並消除它總是最有效率和低成本的解決方式。在現代的電子產品中,最大的干擾源大部分來自於積體電路的快速切換電流,為了快速精確地偵測此種類型的雜訊源,國際電工委員會(IEC)制定了IEC 61967標準系列,而其中的IEC 61967-3和IEC 61967-6標準為近場電磁場量測方法,其可提供詳細的IC表面電磁場分佈,表面電磁場分佈與電壓和電流傳輸路徑有關,電子工程師可依此資訊,快速的找出干擾源來debug電磁干擾。此兩種標準中的關鍵設備是近場量測探針,因此於此篇論文中,我們回顧過去與近場探針相關的論文並探討這些探針的優缺點,主要分別為電子式和光學式探針,更近一步的提出兩種創新的電子式磁場探針架構:
首先介紹數個以低溫共燒陶瓷製程製作,具低成本和堅固耐用特性的新型單端近場磁場探針。為了抑制電場耦合,將平行C形金屬帶和其變形插入探針前端的迴路區來形成多種共模高通帶拒濾波器,這些具有此種濾波器的探針擁有極好地寬頻電場抑制,我們稱其為高電場抑制探針,依序命名為A至D型,在全部單端探針中,迴路孔隙尺寸皆為100微米長和400微米寬,而由迴路接收到的訊號經由一外徑為0.047英吋的半硬式同軸線傳輸到量測儀器,且使用具低損耗和良好屏蔽特性的覆晶技術來連接在低溫共燒陶瓷中的探針頭和半硬式同軸線。我們將探針放置在一寬度為2000微米的微帶線上方來量測探針特性,對一個根據舊設計實現的對照組探針來說,頻率範圍從0.05到12.65 GHz,其電磁場隔離度大於30 dB,而對具有雙平行C形金屬帶的A型探針來說,頻率範圍從0.1到11.05 GHz,其電磁場隔離度大於35 dB。將C形金屬帶的一端短路到地,可得一C型探針,在電磁場隔離度大於30 dB的條件下,其操作頻率範圍可擴大到0.05~17.8 GHz。具附加的佈局變化的D型探針,在頻率高達10.9 GHz時,其電磁場隔離度仍可超過40 dB。當微帶線金屬表面和迴路最下緣間的距離維持120微米時,這些探針的空間解析度可達到140微米。與對照組探針比較起來,新型探針的校準因子(CF)僅稍微增加。 其次,為了達到高空間解析度,傳統式探針必須縮小迴路尺寸,然而,較小的迴路會導致探針的靈敏度變低,除此之外,迴路尺寸總是受限於製程的最小線距。另一個問題是當非對稱電場耦合到探針時,即使探針結構是對稱的,此耦合電場仍不能完全抵消,為了解決這些問題,在本論文中,我們提出一具有三種空間解析度的空間差分式近場磁場探針,此探針頭部也是以低溫共燒陶瓷實現並包含一單圈迴路和一雙圈迴路,單圈迴路被雙圈迴路包夾,而此兩迴路被兩屏蔽地金屬板包覆來形成一三層板結構,此兩迴路接收到的訊號經由兩帶線和SMA接頭輸出,同樣地使用覆晶技術連接探針頭和帶線來完成組裝。使用一組抗為50歐姆和寬度為436微米的微帶線來量測探針特性,因為兩個不同的迴路位於微帶線上方不同高度處,所以探針的兩輸出埠會有不同的空間解析度,而接收訊號被差分輸出時,此差分式探針會有更高的空間解析度,當與一空間解析度可與差分式探針媲美的平衡雙負載式探針比較時,藉由電磁模擬可發現因為兩迴路同時接收相似的電場,所以當執行差分操作後,所提出的差分式探針可以很好地抑制側邊電場耦合 | zh_TW |
dc.description.abstract | With increasing operation speed, ever-complicated circuit structure, and dense packaging, electromagnetic interference (EMI) problem of electronic products becomes more and more serious. In general, EMI generation can be viewed as three parts: interference source, interfering path, and radiation antenna. To effectively suppress EMI, finding out the interference sources and eliminating them are always the most efficient and low-cost solution. In modern electronic products, most interference sources are caused by the rapid switching current of the integrated circuits (ICs). International Electrotechnical Commission (IEC) defines the IEC 61967 standard series to rapidly and accurately detect this kind of emission sources. The third and sixth parts of this standard series introduce the electromagnetic near-field (NF) measurement method. The detailed electromagnetic field distribution related to the voltage and current flowing paths over the surface of the IC device under test (DUT) can be obtained using this NF scanning method. Electrical engineers can debug the EMI according to the information of the field distribution. NF probe is the key component of the surface field scan method. Therefore, we review the previous papers concerning the NF probes and discuss their characteristics. They are mainly typed as electrical and optical probes, and then we further propose two kinds of innovative electrical probe structures in this dissertation.
Firstly, several new types of low-cost and robust single-ended magnetic NF probes fabricated in low temperature co-fired ceramics (LTCC) are presented. Parallel C-shaped strips and its variations are inserted into the loop area in the front end of probes to achieve common-mode high-pass and notch filters for electric-field noise suppression. These probes with this kind of filter have excellent wideband electric field suppression. They are named as high electric field suppression (HEFS) probes type A~D. The size of loop aperture in all probes is 100 μm long and 400 μm wide. The signal received from the loop is routed to a measurement apparatus through a semi-rigid coaxial cable with outer diameter of 0.047 in. The flip-chip junction with low loss and good shielding is used between the probe head in LTCC and the semi-rigid coaxial cable. We take the probes over a 2000-μm-wide microstrip line as DUT to measure the probe characteristics. The isolation between electric and magnetic fields for a reference probe based on an old design using the same LTCC process is better than 30 dB from 0.05 to 12.65 GHz. Proposed type A probe has two parallel C-shaped strips, and it has better isolation of 35 dB from 0.1 to 11.05 GHz. Type C has one end of its strip shorted to ground, its 30 dB isolation frequency range can be extended to 0.05~17.8 GHz. With additional layout variation in type D, isolation can be improved to 40 dB up to 10.9 GHz. The spatial resolution for these probes is 140 μm when the distance between the metal surface of the microstrip line and the nearest edge of the loop is held at 120 μm. The calibration factors (CFs) of the proposed probes are only slightly increased as compared with reference probe. Secondly, to achieve good spatial resolution, small loop size is required in the traditional loop probe. However, the smaller loop size will lead to the lower sensitivity for the probe. In addition, loop size is always limited by the minimum line spacing of the fabrication process. Another problem is that the asymmetric electric field coupling into a probe will not be canceled perfectly even if the structure of this probe is symmetric. To circumvent these problems, the space difference magnetic NF probe with three kinds of spatial resolutions is proposed in this dissertation. The probe head including a single-turn loop and a two-turn loop is also manufactured in LTCC. The single-turn loop is clamped with the two-turn loop. Two loops are covered with two shielding ground plates to form a tri-plate structure. The received signals from these two loops are outputted with two SMA connectors through two striplines. In the same way, the flip-chip junction is used between the probe head and the striplines for assembly. The probe characteristics are measured using a 436-μm-wide microstrip line with impedance of 50 Ω. Two output ports have different spatial resolutions because two different loops are located above the microstrip line at different heights. The space difference probe will have higher spatial resolution when the received signals are outputted in difference. In comparison with one smaller double-loaded probe whose resolution is comparable to that of this difference output of the proposed probe by EM simulation, the proposed spatce difference probe can suppress the side electric field coupling well by the difference operation because two loops receive approximate electric field simultaneously. | en |
dc.description.provenance | Made available in DSpace on 2021-06-16T13:23:40Z (GMT). No. of bitstreams: 1 ntu-102-D95943011-1.pdf: 3846060 bytes, checksum: bd4be6628fe717b041f1404ea57650ed (MD5) Previous issue date: 2013 | en |
dc.description.tableofcontents | Contents
Chapter 1 Introduction 1 1.1 Background 1 1.2 Research motive 7 1.3 Dissertation organization 8 Chapter 2 Survey of near-field (NF) probes 11 2.1 Electrical electric field probes 12 2.2 Electrical magnetic field probes 17 2.3 Electrical electromagnetic field probes 25 2.4 Optical electric and magnetic field probes 28 2.5 Combination of electrical and optical probes 31 Chapter 3 Traditional and proposed single-ended magnetic NF probes 33 3.1 Microstrip line calibration method 34 3.2 Reference magnetic NF probe 37 3.2.1 Reception mechanism of electric and magnetic fields for loop probes 37 3.2.2 Structure and equivalent model of the loop 40 3.2.3 Complete structure of the probe 43 3.2.4 Experimental setup and probe characteristics 44 3.3 Proposed high electric field suppression (HEFS) probes 50 3.3.1 HEFS probe type A 50 3.3.2 Equivalent model of the loop in the HEFS probe type A for electric field coupling 51 3.3.3 Measured characteristics of probe type A 55 3.3.4 Type B, C, and D, three variations of the probe type A 57 Chapter 4 Proposed space difference magnetic NF probe 65 4.1 Space difference magnetic NF probe 67 4.1.1 Principle of the probe design 67 4.1.2 Complete structure of the probe 72 4.1.3 Experimental setup and probe characteristics 74 4.2 Advantages of space difference magnetic NF probe 83 4.2.1 More flexible in process selection 83 4.2.2 Asymmetric electric field suppression 85 Chapter 5 Conclusion 89 5.1 Summary 89 5.2 Challenges in NF measurement 91 5.2.1 Calibration and compensation for the field perturbation 91 5.2.2 Inferior probe sensitivity and resolution due to the increased spacing distance between the probe and DUT 92 5.2.3 Optimize the scanning points to save measurement time 92 Abbreviations 93 Publication list 95 Reference 97 | |
dc.language.iso | en | |
dc.title | 以低溫共燒陶瓷製程製作用於電磁干擾檢測的兩種創新的近場磁場探針 | zh_TW |
dc.title | Two kinds of innovative magnetic near-field probes fabricated in low temperature co-fired ceramics for electromagnetic interference detection | en |
dc.type | Thesis | |
dc.date.schoolyear | 101-2 | |
dc.description.degree | 博士 | |
dc.contributor.oralexamcommittee | 吳瑞北,瞿大雄,邱奕鵬,馬自莊,吳宗霖 | |
dc.subject.keyword | 電磁干擾,近場量測,近場磁場探針,高空間解析度,共模高通帶拒濾波器,電場耦合抑制,差分輸出,空間解析度改善, | zh_TW |
dc.subject.keyword | EMI,near-field measurement,magnetic near-field probe,high spatial resolution,common-mode high-pass and notch filter,electric field coupling suppression,difference output,spatial resolution improvement, | en |
dc.relation.page | 106 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2013-07-24 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電子工程學研究所 | zh_TW |
顯示於系所單位: | 電子工程學研究所 |
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