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DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 蔡曜陽(Yao-Yang Tsai) | |
dc.contributor.author | Cho-Han Lee | en |
dc.contributor.author | 李卓翰 | zh_TW |
dc.date.accessioned | 2021-06-16T08:40:22Z | - |
dc.date.available | 2018-10-01 | |
dc.date.copyright | 2013-09-25 | |
dc.date.issued | 2013 | |
dc.date.submitted | 2013-09-17 | |
dc.identifier.citation | [1] S. S. Murthy, Y. K. Joshi, W. Nakayama, Single chamber compact thermosyphons with micro-fabricated components, Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems, Vol. 2, (2000), pp. 321-327.
[2] R. S. Gaugler, Heat transfer devices, U.S. Patent 2350348, 1944. [3] G. M. Grover, Evaporation-condensation heat transfer devices, U.S. Patent 3229759, 1966. [4] T. Nguyen, M. Mochizuki, K. Mashiko, Y. Saito, I. Sauciuc, R. Boggs, Advanced cooling system using miniature heat pipes in mobile PC, IEEE Transactions on Components and Packing Technology, Vol. 23, (2000), pp. 86-90. [5] J. Legierski, B. Wiecek, Steady state analysis of cooling electronic circuits using heat pipes, IEEE Transactions on Components and Packing Technology, Vol. 24, (2001), pp. 549-553. [6] M. Jacob, Heat transfer, Wiley, New York, 1949, pp. 636-638. [7] H. M. Kurihari, J. E. Myers, The effects of superheat and roughness on the boiling coefficients, AIChE Journal, Vol. 6, (1960), pp. 83-91. [8] J. Wang, I. Catton, Enhanced evaporation heat transfer in triangular grooves covered with a thin fine porous layer, Applied Thermal Engineering, Vol. 21, (2001), pp. 1721-1737. [9] C. L. Tien, K. H. Sun, Minimum meniscus radius of heat pipe wicking materials, International Journal of Heat and Mass Transfer, Vol. 14, (1971), pp. 1853-1855. [10] R. Ponnappan, A novel micro-capillary groove-wick miniature heat pipe, Energy Conversion Engineering Conference and Exhibit (IECEC) 35th Intersociety, Vol. 2, (2000), pp. 818-826. [11] A. Gupta, G. Upadhya, Optimization of heat pipe wick structures for low wattage electronics cooling applications, Advances in Electronic Packaging 1999, Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference, Vol. 26, (1999), pp. 2129-2137. [12] P. D. Dunn, D. A. Reay, Heat pipes, Pergamon, Oxford, 1994, pp. 195-196. [13] X. Yang, Y. Y. Yan, D. Mullen, Recent developments of lightweight, high performance heat pipes, Applied Thermal Engineering, Vol. 33, (2012), pp. 1-14. [14] K. C. Leong, C. Y. Liu, G. Q. Lu, Characterization of sintered copper wicks used in heat pipe, Journal of porous materials, Vol. 4, (1997), pp. 303-308. [15] S. C. Wong, J. H. Liou, C. W. Chang, Evaporation resistance measurement with visualization for sintered copper-powder evaporator in operating flat-plate heat pipes, International Journal of Heat and Mass Transfer, Vol. 53, (2010), pp. 3792-3798. [16] J. H. Liou, C. W. Chang, C. Chao, S. C. Wong, Visualization and thermal resistance measurement for the sintered mesh-wick evaporator in operating flat-plate heat pipes, International Journal of Heat and Mass Transfer, Vol. 53, (2010), pp. 1498-1506. [17] M. A. Hanlon, H. B. Ma, Evaporation heat transfer in sintered porous media, Journal of Heat Transfer-Transactions of the ASME, Vol. 125, (2003), pp. 644-652. [18] P. C. Stephan, C. A. Busse, Analysis of the heat transfer coefficient of grooved heat pipe evaporator walls, International Journal of Heat and Mass Transfer, Vol. 35, (1992), pp. 383-391. [19] H. Wang, S. V. Garimella, J. Y. Murthy, An analytical solution for the total heat transfer in the thin-film region of an evaporating meniscus, International Journal of Heat and Mass Transfer, Vol. 51, (2008), pp. 6317-6322. [20] F. W. Holm, S. P. Goplen, Heat transfer in the meniscus thin-film transition region, Journal of Heat Transfer, Vol. 101, (1979), pp. 543-547. [21] V. Sartre, M. C. Zaghdoudi, M. Lallemand, Effect of interfacial phenomena on evaporative heat transfer in micro heat pipes, International Journal of Thermal Sciences, Vol. 39, (2000), pp. 498-504. [22] H. Wang, S. V. Garimella, J. Y. Murthy, Characteristics of an evaporating thin film in a microchannel, International Journal of Heat and Mass Transfer, Vol. 50, (2007), pp. 3933-3942. [23] C. Li, G. P. Peterson, Y. X. Wang, Evaporation/boiling in thin capillary wicks (I) - wick thickness effects, Journal of Heat Transfer-Transactions of the ASME, Vol. 128, (2006), pp. 1312-1319. [24] T. Li. G. P. Peterson, Evaporation/boiling in thin capillary wicks (II) - effects of volumetric porosity and mesh size, Journal of Heat Transfer-Transactions of the ASME, Vol. 128, (2006), pp. 1320-1328. [25] A. J. Jiao, R. Riegler, H. B. Ma, G. P. Peterson, Thin-film evaporation effect on heat transport capability in a grooved heat pipe, Microfluid Nanofluid, Vol. 1, (2005), pp. 227-233. [26] R. Ranjan, J. Y. Murthy, S. V. Garimella, Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures, Journal of Heat Transfer- Transactions of the ASME, Vol. 131, (2009), pp. 101001 1-11. [27] R. Ranjan, J. Y. Murthy, S. V. Garimella, A microscale model for thin-film evaporation in capillary wick structures, International Journal of Heat and Mass Transfer, Vol. 54, (2011), pp. 169-179. [28] G. A. Asselman, D. B. Green, Heat pipes, Phillips Technical Review, Vol. 16, (1973), pp. 169-186. [29] W. J. Mantle, W. S. Chang, Effective thermal conductivity of sintered metal fibers, International Journal of Thermophysics, Vol. 5, (1991), pp. 545-549. [30] Y. X. Wang, G. P. Peterson, Analytical model for capillary evaporation limitation in thin porous layers, Journal of Thermophysics and Heat Transfer, Vol. 17, (2003), pp. 145-149. [31] P. Grootenhuis, R. W. Powell, R. P. Tye, Thermal and electrical conductivity of porous metals made by powder metallurgy methods, Proceedings of the Physical Society Section B, Vol. 65, (1952), pp. 502-511. [32] M. Kurashige, M. Mishima, K. Imai, Simulated effective thermal conductivity of sintered, randomly packed spheres and statistical structures of packings, Journal of Thermal Stresses, Vol. 22, (1999), pp. 713-733. [33] G. P. Peterson, L. S. Fletcher, Effective thermal conductivity of sintered heat pipe wicks, International Journal of Thermophysics, Vol. 1, (1987), pp. 343-347. [34] N. Atabaki, B. R. Baliga, Effective thermal conductivity of water-saturated sintered powder-metal plates, Heat and Mass Transfer, Vol. 44, (2007), pp. 85-99. [35] T. W. Davis, S. V. Garimella, Thermal resistance measurement across a wick structure using a novel thermosyphon test chamber, Experimental Heat Transfer, Vol. 21, (2008), pp. 143-154. [36] B. D. Iverson, T. W. Davis, S. V. Garimella, M. T. North, S. Kang, Heat and mass transport in heat pipe wick structures, Journal of Thermophysics and Heat Transfer, Vol. 21, (2007), pp. 392-404. [37] C. Hohmann, P. Stephan, Microscale temperature measurement at an evaporating liquid meniscus, Experimental Thermal and Fluid Science, Vol. 26, (2002), pp. 157-162. [38] J. A. Weibel, S. V. Garimella, M. T. North, Characterization of evaporation and boiling from sintered powder wicks fed by capillary action, International Journal of Heat and Mass Transfer, Vol. 53, (2010), pp. 4204-4215. [39] L. H. Chien, C. C. Chang, Experimental study of evaporation resistance on porous surfaces in flat heat pipes, IEEE Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electrical Systems, (2002), pp. 236-242. [40] S. W. Kang, S. H. Tsai, H. C. Chen, Fabrication and test of radial grooved micro heat pipes, Applied Thermal Engineering, Vol. 22, (2002), pp. 1559-1568. [41] S. C. Wong, Y. C. Lin, J. H. Liou, Visualization and evaporator resistance measurement in heat pipes charged with water, methanol or acetone, International Journal of Thermal Sciences, Vol. 52, (2012), pp. 154-160. [42] R. Rafferty, TCE Presentation, Internal document of Thermacore Europe Ltd., (2009). [43] G. P. Peterson, An introduction to heat pipes. Modeling, testing, and applications. Wiley, New York, 1994. [44] S. W. Chi, Heat pipe theory and practice, McGraw-Hill, New York, 1976. [45] A. Faghri, Heat pipe science and technology, Taylor & Francis, London, 1995. [46] J. G. Collier, J. R. Thome, Convective boiling and condensation, 3rd ed., Oxford University Press, England, 1994. [47] R. Cole, W. M. Rohsenow, Correlation of bubble diameters for boiling of saturated liquids, Chemical Engineering Progress Symposium Series, Vol. 65, (1968), pp. 211-213. [48] M. S. Plesset, S. A. Zwick, The growth of vapor bubbles in superheated liquids, Journal of Applied Physics, Vol. 25, (1954), pp. 493-500. [49] B. B. Mikic, W. M. Rohsenow, P. Griffith, On bubble growth rates, International Journal of Heat and Mass Transfer, Vol. 13, (1969), pp. 657-666. [50] G. C. Kuczynski, Self-diffusion in sintering of metallic particles, Transactions of the AIME, Vol. 85, (1949), pp. 169-178. [51] 黃坤祥, 粉末冶金學, 新文京, 台北, 2003. [52] J. E. Burke, Role of grain boundaries in sintering, Journal of the American Ceramic Society, Vol. 40, (1957), pp. 80-85. [53] R. L. Coble, Initial sintering of alumina and hematite, Journal of the American Ceramic Society, Vol. 41, (1958), pp. 55-62. [54] Y. C. Lu, K. S. Huang, Improved densification of carbony iron compacts by the addition of fine alumina powders, Metallurgical and Materials Transactions A, Vol. 31, (2000), pp. 1645-1652. [55] F. N. Rhines, C. E. Birchenall, L. A. Hughes, Behavior of pores during the sintering of copper compacts, Transactions of the American Institute of Mining and Metallurgical Engineers, Vol. 188, (1950), pp. 378-388. [56] R. L. Coble, Sintering alumina: effect of atmospheres, Journal of the American Ceramic Society, Vol. 45, (1962), pp. 123-127. [57] E. R. G. Eckert, R. M. Drake, Heat and mass transfer 2nd ed., McGraw-Hill, New York, 1959. [58] P. E. Liley, Steam Tables in SI Units, private communication, Purdue University, West Lafayette, 1984. [59] S. W. Kang, S. H. Tsai, M. H. Ko, Metallic micro heat pipe heat spreader fabrication, Applied Thermal Engineering, Vol. 24, (2004), pp. 299-309. [60] M. Juneja, P. S. Sandhu, Performance evaluation of edge detection techaniques for images in spatial domain, International Journal of Computer Theory and Engineering, Vol. 1, (2009), pp. 614-621. [61] J. Canny, A computational approach to edge detection, IEEE Transactions on Pattern Analysis and Machine Intelligence, Vol. 8, (1986), pp. 679-698. [62] J. P. Holman, Heat transfer 7th ed., McGraw-Hill, New York, 1995. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/58946 | - |
dc.description.abstract | 隨著半導體製程與高功率發光二極體於高性能、高功率及微型化的發展,高熱密度的熱交換需求應用漸被重視。高熱密度下,由於熱傳面積很小,為了降低熱交換時的熱阻,熱傳必須在很小的溫差內進行。而於高熱傳量與低溫差的熱傳條件下,無論是熱擴散或熱傳遞,相變化熱傳元件皆為一個適合的解決方案。在這些元件內部,發生於蒸發端的薄膜蒸發相變化機制,扮演著元件能運作於低過熱度下一個重要的角色。比較各種毛細結構,薄膜蒸發機制在粉末燒結的多孔性結構內,能夠最明顯且有效率地以潛熱的形式進行熱傳。本研究在各粉末燒結結構的結構參數間,包含45 μm、75 μm、150 μm的粉末尺寸,球狀、樹枝狀的粉末形狀及三個結構厚度等級,比較過熱度需求與熱通量之間的關係,並探討其影響薄膜蒸發的機制。
本研究包含了兩個部分的實驗,分別為多孔性結構的固體等效熱傳導實驗與多孔性結構的相變化熱傳實驗。其中,相變化熱傳實驗又可分為相變化機制轉換實驗及薄膜蒸發實驗。由於本研究著重於低過熱度的應用,為了準確量測相變化熱傳實驗中,微小的溫差與熱通量,本研究研發製作了一套設備,以期能夠達到準確量測的目的。此設備的特色包含加熱式低溫差型的絕熱腔體、直接燒結結構於熱通量量測柱以避免接觸熱阻的設計、穩定的環境真空循環系統、高解析度與取樣頻率的資料擷取系統。實驗結果顯示,無論是球狀或樹枝狀粉末,較小尺寸粉末的燒結結構表現出較高的等效熱傳導係數。而相同粉末尺寸時,球狀粉末的燒結結構表現出較樹枝狀高的等效熱傳導係數,其差異達到兩倍。而在薄膜蒸發實驗中,過熱度範圍從2 K至5 K,熱通量隨著過熱度的提高成正相關地增加。相同過熱程度時,較薄結構厚度、較小粉末尺寸及樹枝狀粉末的燒結結構,表現出較高的熱通量及較低的熱阻。 輔以影像處理流程,對燒結結構進行影像辨識,偵測出單一截面下,固體結構的輪廓與其長度,這個輪廓為固體燒結結構與液體工作流體間,可能形成交界的位置,亦代表工作流體形成薄膜的可能區域,藉此量化形成薄膜量的趨勢。總體來說,結合影像辨識的評估與兩個部分的實驗結果,即可組合出多孔性燒結結構蒸發器進行薄膜蒸發相變化熱傳時的總熱阻。並探討低過熱度時,薄膜量為一個影響薄膜蒸發熱傳的重要因素。 | zh_TW |
dc.description.abstract | With the developement of semiconductor manufacturings and high power light emited diodes, the heat exchange abilitiy of high heat density has been noticed recently. In the small heat transfer area, the requirement of a smaller temperature difference is necessary to reduce the thermal resistance. Two-phase heat transfer devices are a proper thermal solution for this high heat density application. At low superheat levels, thin-film evaporation at the evaporator of a two-phase heat transfer device plays an important role in its overall heat transfer performance. Among various wick structures, the mechanism of thin-film evaporation transfers latent heat obviously and efficiently in sintered powder structures. With various structural parameters, such as the powder sizes of 45 μm, 75 μm, 150 μm, the powder shapes of spherical, dendritic, and three levels of structural thickness, this study investigates the correlations between superheat levels and heat fluxes.
A two-part experiment in this study consists of effective thermal conductivity and phase-changing heat transfer. The evaporative heat transfer experiment includes transformation of phase-changing mechanisms and thin-film evaporation heat transfer. To measure the small temperature differences and heat fluxes at low superheat levels, this study developed an apparatus composed of a thermal guard test chamber, a direct sintering design, a pressure control loop, and a data acquisition system. The experimental results show that a smaller powder size achieved a higher effective thermal conductivity in both powder shapes. Spherical powder structures achieved twice the effective thermal conductivity of dendritic powder structures for each powder size. The thin-film evaporation heat transfer measurement showed that the heat flux increases proportionally with the superheat between 2 to 5 K. At the same superheat level, structures with thinner structural thickness and smaller powder size have a higher heat flux and lower thermal resistance, and dendritic powder structures perform better than spherical powder structures. Assisted by image recognition process, the edge length of solid sintered structures cross-sectional could be detected. The length of the contour is the contact interface between the solid structure and the liquid working fluid, and may represent the tendency of the total amount of thin film. However, this evaluation and the experimental results produce the total thermal resistance of heat transfer in the evaporator. In these structural parameters, the amount of thin film may be the primary factor affecting thin-film evaporation heat transfer. | en |
dc.description.provenance | Made available in DSpace on 2021-06-16T08:40:22Z (GMT). No. of bitstreams: 1 ntu-102-F97522702-1.pdf: 11557256 bytes, checksum: 5db43d73687d2532f514bb8c652774af (MD5) Previous issue date: 2013 | en |
dc.description.tableofcontents | 目 錄
口試委員會審定書………………………………………………… I 誌謝………………………………………………………………… II 中文摘要…………………………………………………………… III 英文摘要…………………………………………………………… IV 目錄………………………………………………………………… V 圖目錄……………………………………………………………… VII 表目錄……………………………………………………………… XII 符號說明…………………………………………………………… XIII 第一章 緒論……………………………………………………… 1 1.1 研究背景……………………………………………………… 1 1.2 文獻回顧……………………………………………………… 3 1.3 研究動機與目的……………………………………………… 11 1.4 論文大綱……………………………………………………… 13 第二章 相變化熱傳元件………………………………………… 14 2.1 工作原理……………………………………………………… 15 2.2 操作極限……………………………………………………… 18 2.3 沸騰理論……………………………………………………… 23 第三章 多孔性燒結結構………………………………………… 27 3.1 粉末燒結理論………………………………………………… 28 3.2 試片材料……………………………………………………… 34 3.3 試片製備設備………………………………………………… 41 3.4 燒結方法……………………………………………………… 47 3.5 試片參數……………………………………………………… 51 3.6 燒結結果……………………………………………………… 54 第四章 多孔性燒結結構的等效熱傳導………………………… 61 4.1 理論模式……………………………………………………… 62 4.2 實驗設備與規劃……………………………………………… 64 4.3 實驗參數……………………………………………………… 70 4.4 實驗方法……………………………………………………… 72 4.5 誤差分析……………………………………………………… 73 第五章 多孔性燒結結構於低過熱度的相變化熱傳…………… 74 5.1 理論模式……………………………………………………… 76 5.2 實驗設備與規劃……………………………………………… 79 5.3 實驗參數……………………………………………………… 93 5.4 實驗方法……………………………………………………… 96 5.5 誤差分析……………………………………………………… 100 第六章 實驗結果………………………………………………… 101 6.1 多孔性燒結結構等效熱傳導實驗結果……………………… 101 6.2 多孔性燒結結構相變化機制轉換實驗結果………………… 105 6.3 多孔性燒結結構於低過熱度下薄膜蒸發實驗結果………… 120 第七章 討論……………………………………………………… 142 7.1 燒結結構參數對固體熱傳導的影響………………………… 142 7.2 低過熱度下燒結結構參數與熱傳性能的關係……………… 144 7.3 薄膜區域數量與結構參數的關係…………………………… 147 7.4 結構參數對蒸發器之薄膜蒸發熱傳性能的影響…………… 153 第八章 結論與未來展望………………………………………… 161 8.1 結論…………………………………………………………… 161 8.2 未來展望……………………………………………………… 163 參考文獻…………………………………………………………… 164 | |
dc.language.iso | zh-TW | |
dc.title | 多孔性燒結結構蒸發器於低過熱度之熱傳研究 | zh_TW |
dc.title | Heat Transfer in Porous Sintered Structural Evaporator at Low Superheat Levels | en |
dc.type | Thesis | |
dc.date.schoolyear | 102-1 | |
dc.description.degree | 博士 | |
dc.contributor.oralexamcommittee | 康尚文(Shung-Wen Kang),林原慶(Yuan-Ching Lin),王朝正(Chaur-Jeng Wang),王興華(Ching-Hua Wang) | |
dc.subject.keyword | 過熱度,粉末燒結結構,薄膜蒸發,熱阻,蒸發器, | zh_TW |
dc.subject.keyword | superheat level,sintered powder structure,thin-film evaporation,thermal resistance,evaporator, | en |
dc.relation.page | 168 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2013-09-18 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
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