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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 黃美嬌(Mei-Jiau Huang) | |
dc.contributor.author | Pei-Keng Tsai | en |
dc.contributor.author | 蔡沛耕 | zh_TW |
dc.date.accessioned | 2021-06-16T05:18:07Z | - |
dc.date.available | 2021-02-20 | |
dc.date.copyright | 2021-02-20 | |
dc.date.issued | 2021 | |
dc.date.submitted | 2021-02-05 | |
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/56183 | - |
dc.description.abstract | 本論文利用全頻聲子蒙地卡羅法研究單介面結構的穩態微觀熱傳性質,包括由矽/矽組成的同質結構及由矽/鍺組成的異質結構。藉由改變材料長度,系統性地探討不同尺寸下彈道-擴散熱傳效應、非彈性散射與介面穿透率對溫度分布與熱通量的影響。研究發現彈道熱傳使材料與邊界熱槽溫度不連續,介面穿透率導致小尺寸的矽與鍺展現迥異於單一材料的全頻熱通量,而非彈性散射讓全頻熱通量頻譜更為平滑,並稀釋介面穿透率的影響。介面熱阻在同質結構中隨尺寸先降後升,在異質結構中則隨尺寸單調下降。 同步我們提出一個適用於單介面結構的理論模型-全頻線性模型,以彈道熱傳描述邊界熱通量,再利用塊材聲子分布推導材料內部與介面之熱通量,在假設熱通量詳細守恆的情況下,求得全頻熱通量密度與全頻溫度。此模型可用以描述聲子彈道-擴散熱傳現象,並在系統尺寸極大時趨近塊材理論之結果、尺寸極小時與彈道熱傳的熱通量吻合;不同於模擬結果,此模型預測介面熱阻與尺寸無關。同質介面的全頻熱通量與模擬結果吻合,異質介面的預測值則與完全彈性散射的模擬結果吻合。在預測溫度分布方面,同質介面獲得較佳的結果,準確度隨尺寸提升,而異質介面中矽區的溫度分布較準確,鍺只有在大尺寸時誤差較小。 模擬與模型結果都指出在相同邊界條件下,尺寸越大的系統熱傳越依賴較低頻的聲子,系統中含有鍺也會對小尺寸矽的熱通量產生選擇性抑制作用,本研究成果有助於設計多尺寸結構以達成低熱傳導係數之目標。 | zh_TW |
dc.description.abstract | In this thesis, a full-spectrum phonon Monte Carlo simulation method is utilized to investigate the nanoscale, steady thermal properties in single-interface structure. A homogeneous structure made of Si/Si and a heterogeneous structure made of Si/Ge are covered. By changing the materials’ length, we look into the effect of ballistic-diffusive heat transfer, inelastic scattering and interfacial transmissivity on the temperature distribution and heat flux of the system. Ballistic effect causes temperature jump between the system and the boundary thermal reservoirs. The interfacial transmissivity leaves Si/Ge structure a distinguished spectral heat flux from the homogeneous case. Inelastic scattering however, reduces the effect of transmissivity and makes the spectral heat flux smoother. The simulated interfacial resistance drops before rising with the system length in homogeneous structures, while monotonically decreases in heterogeneous structures. We also propose a theoretical model to account for the single-interface system. The model incorporates the concept of detailed energy balance and spectral temperature that characterizes phonons of different frequencies. This model is consistent with both diffusive heat transfer in large-scale limit and ballistic heat flux in small-scale limit. Different from simulation result, the model interfacial resistance is constant for all system length. The predicted spectral heat flux of the homogeneous structure coincides with the simulation result, while in the heterogeneous case, the model predictions only meet the results of simulations that only include elastic scatterings. The model predicts temperature distributions better in Si/Si than in Si/Ge, and it becomes more accurate for longer system. Both simulation and model point out that heat transfer within larger systems relies on phonons with lower frequency, and how Ge suppresses the heat flux in Si depending on the system length. This research helps to develop multiscale structures to achieve lower heat conductivity. | en |
dc.description.provenance | Made available in DSpace on 2021-06-16T05:18:07Z (GMT). No. of bitstreams: 1 U0001-0402202117082100.pdf: 7124708 bytes, checksum: 4ceb62f07a2b7929e9f783c044fb5518 (MD5) Previous issue date: 2021 | en |
dc.description.tableofcontents | 口試委員審定書 I 致謝 II 中文摘要 III Abstract IV 目錄 VI 表目錄 IX 圖目錄 X 符號說明 XIV 第1章 緒論 1 1-1 文獻回顧 1 1-2 研究動機與目的 6 1-3 論文架構 6 第2章 3D非結構性網格全頻蒙地卡羅法 7 2-1 基本理論 7 2-1-1聲子波茲曼傳輸方程式 7 2-1-2能量基底偏差概念 8 2-1-3線性化 10 2-1-4蒙地卡羅法求解流程 11 2-2 初始條件與邊界條件 11 2-2-1初始條件 11 2-2-2邊界條件 12 2-3 模擬粒子的產生 13 2-3-1初始粒子 14 2-3-2邊界粒子 16 2-4 網格與流程 18 2-4-1網格建立 18 2-4-2模擬流程 19 2-4-3本質散射 20 2-5 統計分析與數據處理(後處理) 22 2-5-1資訊收集 22 2-5-2頻率相依換算 28 2-6 介面散射 30 2-6-1 DMM模型 30 2-6-2模擬處理方法 32 2-7 材料性質 34 2-7-1 聲子色散關係 34 2-7-2本質散射機制 37 2-8 程式驗證 39 第3章 線性模型 42 3-1 全頻線性模型 42 3-1-1 擴散熱傳(大尺寸)極限: 48 3-1-2 彈道熱傳(小尺寸)極限: 50 3-2 總體線性模型 51 3-3 模型計算結果 56 3-3-1同質介面 56 3-3-2異質介面 62 第4章 單介面材料熱傳性質 69 4-1 模擬設定 69 4-2 同質介面 73 4-2-1總體溫度與總體熱通量 73 4-2-2全頻熱傳性質 82 4-3 異質介面 85 4-3-1總體溫度與總體熱通量 85 4-3-2全頻熱傳性質 94 第5章 結論與未來展望 108 5-1 結論 108 5-1-1 數值模擬工具設計與驗證 108 5-1-2 線性模型 108 5-1-3 單介面材料熱傳性質 109 5-2 未來展望 110 參考文獻 111 | |
dc.language.iso | zh-TW | |
dc.title | 單介面系統全頻聲子熱傳之研究 | zh_TW |
dc.title | A Full-spectrum Investigation into the Phonon Flow in Single-interface Systems | en |
dc.type | Thesis | |
dc.date.schoolyear | 109-1 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 饒達仁(Da-Jeng Yao),陳軍華(chun-hua chen),呂明璋(Ming-Chang Lu) | |
dc.subject.keyword | 彈道-擴散熱傳,聲子蒙地卡羅法,全頻,矽鍺,線性模型,尺寸效應, | zh_TW |
dc.subject.keyword | ballistic-diffusive heat conduction,phonon Monte Carlo,full-spectrum,silicon,germanium,linear model,size effect, | en |
dc.relation.page | 115 | |
dc.identifier.doi | 10.6342/NTU202100528 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2021-02-07 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
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