全球IC設計產業之發展趨勢 --以Qualcomm和聯發科為例

Abstract

早期台灣因洞悉歐美半導體產業供應價值鏈發展無法滿足市場需求，發展趨勢朝向產業分工結構發展。台灣半導體產業策略順勢而為，集合產業、政府、學術三方力量，提早佈局搶得先機，逐漸在全球IC設計、IC晶圓代工及IC封裝測試這三種產業站上世界舞台，成為支撐台灣電子業出口最主要的動力。 近代半導體產業三個主要的供應價值鏈包含整合元件製造廠商(IDM)、IC設計廠商(Fabless)以及晶圓代工廠商(Foundry)，這三者彼此之間競合關係的發展牽動著全球半導體價值鏈結構的佈局策略。近年來國際半導體大廠積極向前整合併購IC設計公司，進入新市場，擴大經濟規模，經濟壁壘不斷增高，而中國政府全力扶持的IC設計產業已成為全球IC設計產業另ㄧ股新興的勢力。產業內競爭激烈，全球IC設計產業大者恆大的趨勢已成型，半導體供應鏈是否會有新的分工模式或創新商業模式產生？ 本研究分析IDM、Fabless及Foundy這三個產業價值鏈的演進競合關係，試著尋找出這三種產業未來可能發展的策略。同時探討全球IC設計龍頭美國Qualcomm及東方IC設計霸主台灣聯發科的策略佈局及經營績效，做為台灣IC設計業者面對中國競爭對手時擬定競爭策略的思考借鏡。

In order to fulfill foreign market demand for semiconductors, Taiwan developed a market model focusing on division of labor very early on, combining the efforts of the government, the industry as a whole, and academic scholars. As a result, Taiwan is gradually gaining an increasing role in the global IC design, foundry, and packaging and testing industries, and this role has become a backbone for Taiwan’s growing electronics industry. The semiconductor value chain includes three types of businesses, namely IDM companies, IC design houses (fabless companies), and foundries. Cooperation and competition between these three types of businesses impact greatly on the global semiconductor industry. This study focuses on the semiconductor value chain and the relationships between IDM, fabless, and foundry companies. Case studies were also conducted on IC design houses Qualcomm and MediaTek. It is hoped that the conclusions of this study can aid in the mapping of future industry strategies and provide insight on the current climate.