側向輻射雙極化毫米波天線之研製

Abstract

本論文提出了一個在側邊有最大輻射的印刷雙極化毫米波應用天線。論文的一開始，我們比較及討論了晶片嵌入式天線和封裝之天線在毫米波射頻電路與天線的整合。因為考量天線輻射效率，我們採用了封裝之天線整合技術。關於封裝之天線整合技術的板材選取，我們研究了兩種製成方法:低溫共燒陶瓷與印刷電路板。論文提出了設計在低溫共燒陶瓷與印刷電路板的垂直及水平極化準八木偶極天線。準八木偶極天線有著寬頻、單一方向輻射、高增益、高效率的特色。我們更進一步整合兩個不同極化的天線在印刷電路板上，使得尺寸縮小。再根據天線可能在行動終端上的配置，提出了角落及側邊的設計。側邊的設計更延伸成相控陣列的形態。所設計之天線適合在毫米波和多輸入多輸出系統的應用。

This thesis presents a printed dual-polarized antenna with a maximum radiation in the end-fire direction for millimeter-wave (mmW) applications. In the beginning, Antenna-on-Chip (AoC) and Antenna-in-Package (AiP) which integrate RF circuits with antennas in mmW band are compared and discussed, where AiP is adopted because of the antenna efficiency. Regarding the selection of AiP platform substrate, we investigate two kinds of manufacturing process: Low Temperature Co-fired Ceramic (LTCC) and Printed Circuited Board (PCB). This thesis proposes vertically and horizontally polarized quasi Yagi-Uda antennas particularly designed on LTCC and PCB. Quasi Yagi-Uda antenna has several features including broadband, unidirectional pattern, high gain, and high efficiency. For PCB process, we further integrate the antennas of two different polarizations into the same area, leading to a size reduction. Both corner and lateral designs are investigated according to potential positions of antennas in mobile terminal. The lateral design is further extended to array level for phased array operation. The proposed antennas are suitable for mmW mobile communications and MIMO system applications.