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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
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dc.contributor.advisor | 毛明華(Ming-Hua Mao) | |
dc.contributor.author | Cheng-Yu Liu | en |
dc.contributor.author | 劉振宇 | zh_TW |
dc.date.accessioned | 2021-06-15T16:24:53Z | - |
dc.date.available | 2020-08-17 | |
dc.date.copyright | 2015-08-17 | |
dc.date.issued | 2015 | |
dc.date.submitted | 2015-08-14 | |
dc.identifier.citation | 1. J. Hryniewicz, P. Absil, B. Little, R. Wilson, and P. Ho, 'Higher order filter response in coupled microring resonators,' IEEE Photonics Technology Letters 12, 320-322 (2000).
2. S. T. Chu, B. E. Little, W. Pan, T. Kaneko, S. Sato, and Y. Kokubun, 'An eight-channel add-drop filter using vertically coupled microring resonators over a cross grid,' Photonics Technology Letters, IEEE 11, 691-693 (1999). 3. C. Seung June, K. Djordjev, C. Sang Jun, and P. D. Dapkus, 'Microdisk lasers vertically coupled to output waveguides,' Photonics Technology Letters, IEEE 15, 1330-1332 (2003). 4. K. J. Vahala, 'Optical microcavities,' Nature 424, 839-846 (2003). 5. M. Shimbo, K. Furukawa, K. Fukuda, and K. Tanzawa, 'Silicon‐to‐silicon direct bonding method,' Journal of Applied Physics 60, 2987-2989 (1986). 6. S. R. Sakamoto, C. Ozturk, B. Young Tae, J. Ko, and N. Dagli, 'Low-loss substrate-removed (SURE) optical waveguides in GaAs-AlGaAs epitaxial layers embedded in organic polymers,' Photonics Technology Letters, IEEE 10, 985-987 (1998). 7. N. Frank, 'Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems,' Department of Signals, Sensors and Systems,Royal Institute of Technology,Stockholm Master Thesis, 1-65 (2002). 8. N. C. Frateschi, and A. F. J. Levi, 'The spectrum of microdisk lasers,' Journal of Applied Physics 80, 644-653 (1996). 9. 王立延, '低溫基板黏接鍵合及其應用於光學微共振腔垂直耦合之研究,' 國立台灣大學碩士論文 (2014). 10. G. C. DeSalvo, W. F. Tseng, and J. Comas, 'Etch Rates and Selectivities of Citric Acid/Hydrogen Peroxide on GaAs , Al0.3Ga0.7As , In0.2Ga0.8As , In0.53Ga0.47As,In0.52Al0.48As,and InP,' Journal of The Electrochemical Society 139, 831-835 (1992). | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/52725 | - |
dc.description.abstract | 在本篇論文中,我們使用苯環丁烯進行低溫基板黏接鍵合,將具有氮化矽波導的砷化鎵樣品黏接鍵合到矽基板上,並使用檸檬酸蝕刻液選擇性蝕刻砷化鎵/砷化鋁鎵,移除了砷化鎵基板,然後製作出與波導垂直耦合的微碟共振腔。
我們進行了直徑50μm的微碟共振腔和波導之水平相對位置變化與耦合行為的探討,我們從穿透頻譜得到其模態間距約為3nm,由於其模態間距較小,模態結構複雜,頻譜難以分析。 因此我們製作了直徑20μm的微碟共振腔,並進行其與波導水平相對位置變化與耦合行為的探討,從穿透頻譜得到其模態間距約為9.41nm,並且找到最高的Q值出現在重疊3.7μm時,其Q值達到17800。 | zh_TW |
dc.description.abstract | In this thesis, we bonded a GaAs sample with SiNx waveguides onto a Si substrate by a low temperature adhesive wafer bonding method with benzocyclobutene. Then, we removed the GaAs substrate using citric acid to selectively etch GaAs against the AlGaAs layer. Thus, we successfully fabricated GaAs microdisks vertically coupled with SiNx waveguides.
We investigated the coupling behavior due to different lateral positions between waveguides and microdisks of 50μm in diameter. The free spectral range is about 3nm, which is rather small and results in a complicated modal structure. Therefore, we fabricated microdisks of 20μm in diameter and discuss its coupling behavior when the lateral position between the microdisk and the waveguide is changed. The free spectral range is increased to 9.41nm. The lateral position with highest quality factor of 17800 is achieved when the microdisk overlaps with the waveguide by 3.7μm. | en |
dc.description.provenance | Made available in DSpace on 2021-06-15T16:24:53Z (GMT). No. of bitstreams: 1 ntu-104-R02943107-1.pdf: 2063103 bytes, checksum: b044121e4bcabac9cbaa91f5fb3e3e25 (MD5) Previous issue date: 2015 | en |
dc.description.tableofcontents | 目錄
口試委員會審定書 i 誌謝 ii 摘要 iii Abstract iv 第一章緒論 1 1.1積體光路簡介 1 1.2波導與微型共振腔簡介 2 1.3垂直耦合與水平耦合 3 1.4低溫基板黏接鍵合技術 5 1.5 研究動機 7 第二章理論分析 8 2.1波導 8 2.2迴音廊模態 10 2.3品質因子 14 第三章實驗製程 15 3.1材料選用 15 3.2實驗製程 15 第四章穿透頻譜量測分析 21 4.1量測架構 21 4.2波導和共振腔之耦合與其水平相對位置探討 22 4.2.1 直徑50μm的微碟共振腔之探討 23 4.2.2直徑20μm的微碟共振腔之探討 28 第五章結果與討論 44 5.1結果討論 44 5.2未來方向 45 參考文獻 46 | |
dc.language.iso | zh-TW | |
dc.title | 低溫基板黏接鍵合應用於砷化鎵微碟共振腔垂直耦合 | zh_TW |
dc.title | Vertically Coupled GaAs Microdisk Resonators by Low Temperature Adhesive Wafer Bonding | en |
dc.type | Thesis | |
dc.date.schoolyear | 103-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 林浩雄(Hao-Hsiung Lin),黃鼎偉(Ding-Wei Huang) | |
dc.subject.keyword | 微碟共振腔,垂直耦合,基板鍵合,砷化鎵,波導, | zh_TW |
dc.subject.keyword | Microdisk,Vertical coupling,Wafer bonding,GaAs,Waveguide, | en |
dc.relation.page | 47 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2015-08-14 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電子工程學研究所 | zh_TW |
顯示於系所單位: | 電子工程學研究所 |
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