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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 鄭如忠 | |
dc.contributor.author | Wei-Yao Chang | en |
dc.contributor.author | 張偉瑤 | zh_TW |
dc.date.accessioned | 2021-06-15T13:38:08Z | - |
dc.date.available | 2021-02-16 | |
dc.date.copyright | 2016-02-16 | |
dc.date.issued | 2016 | |
dc.date.submitted | 2016-01-22 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/51541 | - |
dc.description.abstract | 本論文主要分為兩個部份:第一部份有別於一般以雙胺類 (Diamine)為起始單體合成聚亞醯胺(Polyimide),主要探討利用價格較為低廉之二苯基甲烷二異氰酸酯(Methylene Diphenyl Diisocyanate, MDI) 單體合成出五大系列,分別為 (1) 聚脲酯-聚亞醯胺 (Polyurea-imide, PUI), (2) 聚脲酯-聚醯胺-聚亞醯胺 (Polyurea-amide-imide, PUAI), (3) 聚脲酯-聚亞醯胺-聚酯 (Polyurea-imide-ester, PUIE) (4) 聚亞醯胺-環氧樹酯 (Polyimide-epoxy, PIE) (5) 聚醯胺-聚亞醯胺-環氧樹酯 (Polyamide-imide-epoxy, PAIE);利用不同比例的均苯四甲酸二酐 (Pyromellitic Dianhydride, PMDA), 羧基鄰苯二甲酐 (Trimellitic Anhydride, TMA), 4’4-二胺基二苯醚 (4’4-Oxydianline, ODA), 雙酚A (Bisphenol-A, BPA) 及環氧樹酯 ( Diglycidyl Ether of Bisphenol-A, DGEBA)進行一系列的合成並添加奈米黏土 (Nano-Clay)製備奈米複合材料,期待可分析出在不同官能基的改變下,做出價格低廉且同時俱備高耐熱及低介電性質的高分子。並進一步以熱重分析儀 (Thermal Gravimetric Analysis, TGA), 示差掃描量熱儀 (Differential Scanning Calorimetry, DSC), 熱機械分析儀 (Thermomechanical Analysis, TMA) 進行熱性質分析;掃描式電子顯微鏡 (Scanning Electron Microscope, SEM)和穿透式電子顯微鏡 (Transmission Electron Microscopy, TEM) 探討有機-無機混成材料之表面型態;亦探討機械性質及介電性質的影響。由實驗中可知當含有亞醯胺官能基 (Imide Group)含量越多時,其熱性質及機械性質均有較佳的結果;當合成聚亞醯胺-環氧樹脂 (Polyimide-epoxy, PIE)時,其熱裂解溫度可高達500 oC以上,介電常數則介於3.3-3.5之間,在價格較Kapton®低廉時便可得到與之相對應的特性。
第二部分主要為使用不同甲基數目的二胺類與二酸酐類並利用一步法進行合成,進而探討其不同甲基數目對材料性質的影響。主要利用4,4’-diamino-3,3’-dimethyl-diphenyl-methane (DDMDPM),4,4’-methylene -bis(2-ethyl-6-methylaniline) (MBEMA); 和 4,4’-methylene-bis(2,6-diethylaniline) (MBDEA)這三種胺4,4'-聯苯醚二酐 (4,4’-oxydiphthalic anhydride, ODPA)及4,4'-(六氟異丙烯)二酞酸酐(4,4'-(Hexafluoroisopropylidene)diphthalic anhydride, 6FDA)此兩種二酸酐進行反應,並探討其熱性質及電氣性質。從結果可得知當甲基數目越多時其介電常數也會隨之下降;而當引入氟系列的元素時其介電更會大幅降低。 | zh_TW |
dc.description.abstract | In this thesis, it is composed of two major parts: The first part is synthesis the kinds of polyimide by Methylene diphenyl diisocyanate (MDI). By adjust the molar ratio of Pyromellitic Dianhydride (PMDA), Trimellitic Anhydride (TMA), 4’4-Oxydianline (ODA), Bisphenol-A (BPA), and Diglycidyl Ether of Bisphenol A (DGEBA) to synthesis polyurea-imide (PUI), polyurea-amide-imide (PUAI), polyurea-imide-ester (PUIE), polyimide-epoxy (PIE), and polyamide-imide-epoxy (PAIE). The purpose of this study is using much cheaper materials to synthesis high thermal properties and low dielectric constant polymers. The thermal properties are measure by Thermal Gravimetric (TGA), Differential Scanning Calorimetry (DSC), and Thermomechanical Analysis (TMA); the morphologies of polymer/nano-clay are observed by Scanning Electronic Microscopy (SEM) and Transmission Electron Microscopy (TEM); and also measured the mechanical and electronic properties. The results of this study are shown that when imide groups are more, it will have good thermal and mechanical properties. The best polymer of this study is polyimide-epoxy (PIE), the degradation temperature is over 500 oC, and the dielectric constant is between 3.3-3.5. Therefore, polyimide-epoxy (PIE) polymer is much cheaper and also has higher performance as Kapton®.
The second part is synthesis the new soluble polyimides which were synthesized from different 4,4'-diaminodiphenylmethane monomers with different alkyl substituents (4’4’-diamino-3,3’-dimethyl-diphenyl-methane, DDMDPM; 4,4’-methylene -bis(2-ethyl-6-methylaniline), MBEMA; and 4,4’-methylene-bis(2,6-diethylaniline), MBDEA)) in one-step with the poly(amic acid)s prepared from the polyaddition of 4,4’-oxydiphthalic anhydride (ODPA) and 4,4'-(Hexafluoroisopropylidene)diphthalic anhydride (6FDA). These polyimides exhibited excellent thermal stability, and they also possessed relatively low coefficients of thermal expansion and dielectric constants. | en |
dc.description.provenance | Made available in DSpace on 2021-06-15T13:38:08Z (GMT). No. of bitstreams: 1 ntu-105-D98549014-1.pdf: 9462296 bytes, checksum: 94edf1ffb873ec2bb1c5f93ac002d272 (MD5) Previous issue date: 2016 | en |
dc.description.tableofcontents | 中文摘要 I
Abstract III Figure List X Scheme List XIII Table List XVI 1. Introduction 1 1.1 Polyimide 1 1.1.1 Polyimide Background 1 1.1.2 Dielectric Properties of Polyimide 2 1.1.3 Polyimide Synthesis 7 1.2 Polyamide-imide (PAI) 16 1.2.1 Polyamide-imide (PAI) Background 16 1.2.2 Polyamide-imide (PAI) Synthesis and Review 18 1.3 Polyurea 27 1.3.1 Polyurea and Polyurethane Background 27 1.3.2 Polyurea Synthesis and Paper Review 29 1.4 Polyester 36 1.4.1 Polyester Background and Paper Review 36 1.4.2 Polyester-imide (PEI) and Review 38 1.5 Epoxy 41 1.5.1 Epoxy Background 41 1.5.2 Epoxy Synthesis and Paper Review 44 1.6 Organic-inorganic Materials 55 1.6.1 The Background of Organic-inorganic Materials 55 1.6.2 Low Dielectric Constant Materials 59 2. Experimental 64 2.1 Motivation 64 2.2 Materials 65 2.3 Measurements 75 2.4 Polymers Synthesis 77 2.4.1 Polyurea-imide (PUI) Synthesis 77 2.4.2 Polyurea-amide-imide (PUAI) Synthesis 79 2.4.3 Polyurea-imide-ester (PUIE) Synthesis 81 2.4.4 Polyimide-epoxy (PIE) Synthesis 83 2.4.5 Polyamide-imide-epoxy (PAIE) synthesis 85 2.4.6 Different Pendent Group Diamine Synthesis Polyimides 87 2.5 Composite Preparation 88 3. Results and Discussion of Polyurea-imide (PUI), Polyurea-amide-imide (PUAI), Polyurea-imide-ester (PUIE), Polyimide-epoxy (PIE), and Polyaimide-imide-epoxy (PAIE). 90 3.1 Polyurea-imide (PUI) 90 3.1.1 FTIR of Polyurea-imide (PUI) Synthesis 90 3.1.2 Thermal Properties 91 3.1.2.1 Thermal Degradation of Polyurea-imide (PUI) and Hybrid with Nano-Clay 91 3.1.2.2 Thermal Transitions of Polyurea-imide (PUI) 94 3.1.2.3 Thermal Mechanical of Polyurea-imide (PUI) 95 3.1.3 SEM and TEM Morphology 98 3.1.4 Tensile Strength 101 3.1.5 Electrical Properties 103 3.1.6 Summary 105 3.2 Polyurea-amide-imide (PUAI) 106 3.2.1 FTIR of polyurea-amide-imide (PUAI) Synthesis 106 3.2.2 Thermal Properties 107 3.2.2.1 Thermal Degradation of Polyurea-amide-imide (PUAI) and Hybrid with Nano-Clay 107 3.2.2.2 Thermal Transitions of Polyurea-amide-imide (PUAI) 110 3.2.2.3 Thermal Mechanical of Polyurea-amide-imide (PUAI) 111 3.2.3 SEM Morphology 114 3.2.4 Tensile Strength 116 3.2.5 Electrical Properties 118 3.2.6 Summary 120 3.3 Polyurea-imide-ester (PUIE) 121 3.3.1 FTIR of Polyurea-imide-ester (PUIE) Synthesis 121 3.3.2 Thermal Properties 122 3.3.2.1 Thermal Degradation of Polyurea-imide-ester (PUIE) and Hybrid with Nano- Clay 122 3.3.2.2 Thermal Transitions of Polyurea-imide-ester (PUIE) 125 3.3.2.3 Thermal Mechanical of Polyurea-imide-ester (PUIE) 126 3.3.3 SEM Morphology 129 3.3.4 Tensile Strength 131 3.3.5 Electrical Properties 133 3.3.6 Summary 135 3.4 Polyimide-epoxy (PIE) 136 3.4.1 FTIR of Polyimide-epoxy (PIE) Synthesis 136 3.4.2 Thermal Properties 137 3.4.2.1 Thermal Degradation of Polyimide-epoxy (PIE) and Hybrid with Nano-Clay 137 3.4.2.2 Thermal Transitions of Polyimide-epoxy (PIE) 140 3.4.2.3 Thermal Mechanical of Polyimide-epoxy (PIE) 141 3.4.3 SEM Morphology 144 3.4.4 Tensile Strength 146 3.4.5 Electrical Properties 148 3.4.6 Summary 150 3.5 Polyamide-imide-epoxy (PAIE) 151 3.5.1 FTIR of Polyamide-imide-epoxy (PAIE) Synthesis 151 3.5.2 Thermal Properties 152 3.5.2.1 Thermal Degradation of Polyamide-imide-epoxy (PAIE) and Hybrid with Nano- clay 152 3.5.2.2 Thermal Transitions of Polyamide-imide-epoxy (PAIE) 155 3.5.2.3 Thermal Mechanical of Polyamide-imide-epoxy (PAIE) 156 3.5.3 SEM morphology 159 3.5.4 Tensile Strength 161 3.5.5 Electrical Properties 163 3.5.6 Summary 165 4. Conclusion of Polyurea-imide (PUI), Polyurea-amide-imide (PUAI), Polyurea-imide-ester (PUIE), Polyimide-epoxy (PIE) and Polyamide-imide-epoxy (PAIE). 166 5. Results and Discussion of Different Pendent Group of Diamines React with Dianhydride to Synthesis Polyimide 170 5.1 Characterization of these Polyimides 170 5.1.1FTIR of Polymer 170 5.1.2 1H-NMR Measurement 171 5.2 Thermal Properties 174 5.2.1 Thermal Degradation of Polymers 174 5.2.2 Thermal Transitions of Polymer 176 5.2.3 Thermal Mechanical of Polymer 178 5.3 Solubility and Electrical Properties 181 6. Conclusion of Different Pendent Group of Diamines Reacting with Dianhydride to Synthesis Polyimide 183 7. Future Work 185 8. References 187 Appendix I- Curriculum Vitae & List of Publication 200 | |
dc.language.iso | en | |
dc.title | 利用二苯基甲烷二異氰酸酯合成聚亞醯胺及其奈米複合材料之研究 | zh_TW |
dc.title | Synthesis and Characterization of Novel Polyimide via Methylene Diphenyl Diisocyanate (MDI) and Their Nanocomposites | en |
dc.type | Thesis | |
dc.date.schoolyear | 104-1 | |
dc.description.degree | 博士 | |
dc.contributor.coadvisor | 謝國煌 | |
dc.contributor.oralexamcommittee | 林江珍,莊清男,王志光,陳思賢 | |
dc.subject.keyword | 聚?酯-聚亞醯胺,聚?酯-聚醯胺-聚亞醯胺,聚?酯-聚亞醯胺-聚酯,聚亞醯胺-環氧樹酯,聚醯胺-聚亞醯胺-環氧樹酯,可溶性聚醯亞胺,低介電材料, | zh_TW |
dc.subject.keyword | Polyurea-imide (PUI),Polyure-amide-imide (PAI),Polyurea-imide-ester (PUIE),Polyimde-epoxy (PIE),Polyamide-imide-epoxy (PAIE),Soluble Polyimide,Low-k Materials, | en |
dc.relation.page | 201 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2016-01-25 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 高分子科學與工程學研究所 | zh_TW |
顯示於系所單位: | 高分子科學與工程學研究所 |
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