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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 廖運炫 | |
dc.contributor.author | Chian-Hsing Huang | en |
dc.contributor.author | 黃建興 | zh_TW |
dc.date.accessioned | 2021-06-15T02:29:00Z | - |
dc.date.available | 2011-08-19 | |
dc.date.copyright | 2009-08-19 | |
dc.date.issued | 2009 | |
dc.date.submitted | 2009-08-17 | |
dc.identifier.citation | 1.H. Kurafuji and K. Suda, “Electrical discharge drilling of glass,” Annals of the CIRP, Vol. 16, 1968, pp.415-419
2.Y. Liu, Z. Jia and J. Liu, “Study on hole machining of non-conducting ceramics by gas-filled electrodischarge and electrochemical compound machining,” Journal of Materials Processing Technology, Vol. 69, 1996, pp.198-202 3.V.K. Jain and N. Gautam, “Experimental investigations into ECSD process using various tool kinematics,” International Journal of Machine Tools and Manufacture, Vol. 38, 1998, pp.15-27 4.B. Bhattacharyya, B.N. Doloi and S.K. Sorkhel, “Experimental investigations into electrochemical discharge machining (ECDM) of non-conductive ceramic materials,” Journal of Materials Processing Technology, Vol. 95, 1999, pp.145-154 5.何世賢,玻璃材料之電化學放電加工特性研究,碩士論文,國立中央大學機械工程研究所,民國八十八年六月 6.楊景棠、蔡宏營、吳東權,一種具主動式氣幕電化學放電加工法及裝置(Method and device for electro-chemical discharge processing with self-acting bubble layer),中華民國專利,發明第180600號,民國八十九年 7.V. Fascio, H. Langen, H. Bleuler and Ch. Comminellis, “Investigations of the spark assisted chemical engraving,” Electrochemistry Communications 5, pp. 203–207, 2003 8.R. Wuthrich, U. Spaelter, Y. Wu and H. Bleuler, “A systematic characterization method for gravity-feed micro-hole drilling in glass with spark assisted chemical engraving(SACE),” Journal of Micromechanics and Microengineering, Vol. 16, 2006, pp.1891-1896 9.D.J. Kim, Y. Ahn, S.H. Lee and Y.K. Kim, “Voltage pulse frequency and duty ratio effects in an electrochemical discharge mecrodrilling process of Pyrex glass,” International Journal of Machine Tools and Manufacture, Vol. 46, 2006, pp.1064-1067 10.曾俊文,異形電極的微孔電化學放電加工特性研究,碩士論文,國立中央大學機械工程研究所,民國九十四年六月 11.R. Wuthrich, B. Despont, P. Maillard and H. Bleuler , “Improving the material removal rate in spark-assisted chemical engraving(SACE) gravity-feed micro-hole drilling by tool vibration,” Journal of Micromechanics and Microengineering, Vol. 16, 2006, N28–N31 12.吳倫靜,電化學放電鑽孔加工品質提升之研究,碩士論文,國立台灣大學機械工程學研究所,民國九十五年七月 13.K. C. Sanjay and P. V. Rao, “Trepanning of Al2O3 by electro-chemical discharge machining(ECDM) process using abrasive electrode with pulsed DC supply,” Journal of Machine Tools and Manufacture, Vol. 47, 2007, 2061-2070 14.莊博淵,主動式氣膜輔助電化學放電鑽孔加工之研究,碩士論文,國立台灣大學機械工程學研究所,民國九十六年七月 15.Z. P. Zheng, J. K. Lin, F. Y. Huang and B. H. Yan, “Improving the machining efficiency in electrochemical discharge machining(ECDM) microhole drilling by offset pulse voltage,” Journal of Micromechanics and Microengineering, Vol. 18, 2008, 025014 (6pp) 16.彭文陽,電化學放電現象與製程應用之研究,博士論文,國立台灣大學機械工程學研究所,民國九十四年九月 17.http://www.piezomechanik.com/en/home/introduction/index.html 18.http://www.triwin.com.tw 19.http://140.112.32.1/old_www/research/sem.htm 20.http://catalog2.corning.com/Lifesciences/media/pdf/Description_of_7740_Glasses.pdf | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/43799 | - |
dc.description.abstract | 電化學放電加工常用於對玻璃、陶瓷這類非導體硬脆材料進行加工,但是電化學放電鑽孔加工法仍然有許多需要克服的地方,例如鑽孔深度、加工速度、擴孔現象、孔錐度等等。主動式氣膜電化學放電鑽孔加工為使用中空管狀電極,鑽孔加工時在中空管內施打空氣。結果顯示,由於施打的空氣氣泡向上漂浮,改變電極側面局部絕緣層厚度,而無法產生較穩定的絕緣氣膜,降低電極側面放電火花發生的機率,故能獲得較小的擴孔量與較佳的孔錐度。但因電極側面放電不均勻的關係,使得孔壁粗糙度不佳。本文的研究目的在於改善主動式氣膜電化學放電鑽孔加工,主要是在施打空氣的中空管狀電極加上微振動,且於電極側壁使用線切割放電加工機加工出多道環狀溝槽,並觀察微振動與電極側面的溝槽對電化學放電鑽孔加工所造成的影響。實驗結果顯示,由於電極的振動擾動了電極側壁的絕緣層,使得絕緣層變的不穩定,因而減少了電極側壁的放電機率;而振動與電極側壁的環狀溝槽搭配之下,能將電極側壁與孔壁之間中空管狀電極所施打的空氣氣泡撞擊而分解為較小氣泡,使其難以結合為絕緣氣膜,因此電極側壁放電的機率變的更低,故能得到更小的擴孔率與更佳的孔錐度,並且由於振動能將電極與孔壁間的氣泡平均分散,改善電極側壁放電不均勻的現象,因此能改善孔壁表面粗糙度不佳的問題。 | zh_TW |
dc.description.abstract | Electrochemical discharge machining (ECDM) is widely used to machine the non-conductive brittle materials such as glasses and ceramics. However a lot of significant problems are still remained unsolved, eg., the machining depth, the machining rate, the enlarging hole condition and the tapering hole phenomenon etc. Self-acting gas film electrochemical discharge drilling process injected air through a hollow tube electrode during the drilling process to reduce the enlarging and tapering hole phenomenon. But the experimental results showed that the surface roughness of the workpiece was worse comparing to that machined without the air injecting process because the local thickness of the gas film around the electrode became unstable and there was only few sparks taking place non-uniformly around the tube electrode. Hence, the purpose of this study is to improve the self-acting gas film electrochemical discharge drilling process with a micro vibration assisted on the hollow tube electrode which has been already repaired with several grooves on its side by wire electrical discharge machining (WEDM) while injecting air. This study also figured out the effect of the micro vibration assisted and the produced groove. Experimental results showed that the thickness of the gas film around the electrode became unstable because of the micro vibration, so that the chance of sparks which can take place around the electrode is reduced, ie., the bubbles from the air injected turned into the smaller bubbles and then this condition is hard to integrate into gas film. As a result, this developed process can improve the enlarging hole condition and the tapering hole phenomenon. In addition, because of the micro vibration, the bubbles can disperse averagely between the electrode and the hole. Thus the problem of the worse surface roughness of the performed hole also could be improved. | en |
dc.description.provenance | Made available in DSpace on 2021-06-15T02:29:00Z (GMT). No. of bitstreams: 1 ntu-98-R95522709-1.pdf: 2637279 bytes, checksum: 2f8deda914856bd27a29fc84180e338f (MD5) Previous issue date: 2009 | en |
dc.description.tableofcontents | 口試委員會審定書 I
致謝 II 摘要 III Abstract IV 目錄 V 圖目錄 VII 表目錄 IX 符號對照表 X 第一章 緒論 1 1-1 引言 1 1-2 文獻回顧 2 1-3 研究目的 12 1-4 本文內容 13 第二章 基本原理 14 2-1 電化學放電現象 14 2-2 電化學放電加工原理 17 第三章 實驗設備與方法 20 3-1 實驗設備 20 3-1-1 電化學放電加工設備 21 3-1-2 放電電源部份 26 3-1-3 相關輔助儀器 30 3-1-4 實驗材料 34 3-2 實驗方法 38 第四章 實驗結果討論 39 4-1 普通電極與有溝槽電極加上振動之現象觀察與比較 40 4-1-1 火花形貌觀察 40 4-1-2 電流波形 43 4-1-3 氣泡觀察 47 4-1-4 不同電極所加工之孔比較 49 4-2 電極加上不同振幅與頻率的振動對鑽孔加工之影響 56 4-2-1 擴孔率及孔錐度 56 4-2-2 孔壁粗糙度 59 4-3 實驗結果與討論 62 第五章 結論與未來展望 65 5-1 結論 65 5-2 未來展望 67 參考文獻 68 作者簡歷 70 | |
dc.language.iso | zh-TW | |
dc.title | 微振動輔助主動式氣膜電化學放電鑽孔加工之研究 | zh_TW |
dc.title | Study of Micro Vibration Aided Self-Acting Gas Film Electrochemical Discharge Drilling | en |
dc.type | Thesis | |
dc.date.schoolyear | 97-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 顏炳華,蔡曜陽,彭文陽 | |
dc.subject.keyword | 電化學放電加工,鑽孔,擴孔現象,孔錐度,微振動,孔壁粗糙度, | zh_TW |
dc.subject.keyword | ECDM,oversize,taping angle,surface roughness,micro vibration, | en |
dc.relation.page | 70 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2009-08-17 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
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