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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/43757完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 莊晴光(Ching-Kuang C. Tzuang) | |
| dc.contributor.author | Sin-Han Yang | en |
| dc.contributor.author | 楊星瀚 | zh_TW |
| dc.date.accessioned | 2021-06-15T02:27:47Z | - |
| dc.date.available | 2014-08-19 | |
| dc.date.copyright | 2009-08-19 | |
| dc.date.issued | 2009 | |
| dc.date.submitted | 2009-08-17 | |
| dc.identifier.citation | [1] Peter H. Siegel, “Terahertz Technology,” IEEE Trans. Microwave Theory and Tech., vol. 50, no. 3, pp. 910-928, Mar. 2002
[2] Ferguson and X.-C. Zhang, “Materials for Terahertz Science and Technology,” Review Article, Nature Materials, 1, 26, 2002. [3] Peter H. Siegel, “Terahertz Technology in Biology and Medicine,” IEEE Trans. Microwave Theory and Tech., vol. 52, no 10, pp. 2438-2447, Oct. 2004. [4] M. C. Gaidis, H. M. Pickett, C. D. Smith, R. P. Smith, S. C. Martin, and P.H. Siegel, “A 2.5 THz receiver front-end for spaceborne applications,” IEEE Trans. Microwave Theory Tech., vol. 48, pp. 733–739, Apr. 2000. [5] T-L. Hwang, S. E. Schiwarz, and D. B. Rutledge, “Microbolometers for infrared detection,” Applied Physics Letters, vol. 34 (11), pp. 773- 776, Mar. 1979. [6] P. L. Richards, “Bolometers for infrared and millimeter waves,” J. Appl. Phys., vol. 76, no. 1, pp. 1–24, July 1994. [7] Kenneth K. O., “Affordable Terahertz Electronics,” IEEE Microwave Magazine, vol. 10, no. 3, pp. 113-116, May 2009. [8] Chien-Chang Liu, Carlos H. Mastrangelo, “A CMOS Uncooled Heat-Balancing Infrared Imager,” IEEE J. Solid-State Circuits, vol. 35, no. 4, pp. 527–535, Apr. 2000. [9] D. S. Tezcan, S. Eminoglu, O. S. Akar, and T. Akin, “A low cost uncooled infrared microbolometer focal plane array using the CMOS n-well layer,” in the 14th IEEE Int. MicroElectroMechanical Systems Conf. (MEMS 2001), pp. 566-569, Interlaken, Switzerland, January 21-25, 2001. [10] A. Luukanen and V.-P. Viitanen, “Terahertz imaging system based on antenna-coupled microbolometers,” Proc. SPIE, vol. 3378, pp. 34-44, 1998. [11] J. Altet, and A. Rubio, “Differential Sensing Strategy for Dynamic Thermal Testing of ICs,” Proceedings of the 15th IEEE VLSI Test Symposium, Monterey (USA), pp. 434-439, April 27- May 1, 1997. [12] Ashish Syalt, Victor Lee, Andre Ivanov, and Josep Altet, “CMOS Differential and Absolute Thermal Sensors,” Journal of Electronic Testing: Theory and Applications, vol. 18, pp. 295–304, 2002. [13] Edited by H. Baltes, O. Brand, G.K. Fedder, C. Hierold, J. Korvink, O. Tabata, Advanced Micro and Nanosystems. Vol. 2. CMOS – MEMS, WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim, 2005. [14] Eduardo Aldrete-Vidrio, Diego Mateo, and Josep Altet, “Differential temperature sensors in 0.35μm CMOS technology,” THERMINIC 2005, Belgirate, Lago Maggiore, Italy, 2005. [15] C. Fumeaux, G. Boreman, W. Herrmann, F. Kneubühl, and H. Rothuizen, “Spatial impulse response of lithographic infrared antennas,” Applied Optics, vol. 38, pp. 37-46, 1999. [16] J. Alda, C. Fumeaux, I. Codreanu, J. Schaefer, and G. Boreman, “A deconvolution method for two-dimensional spatial-response mapping of lithographic infrared antennas,” Applied Optics, vol. 38, pp. 3993-4000, 1999. [17] Francisco Javier González, Javier Alda, Jorge Simón, James Ginn, and Glenn Boreman, “The effect of metal dispersion on the resonance of antennas at infrared frequencies,” Infrared Physics & Technology, vol. 52, no. 1, pp. 48-51, Jan. 2009. [18] B. Razavi, Design of Analog CMOS Integrated Circuits, McGraw-Hill, pp. 390-392, 2001. [19] M. A. Ordal, L. L. Long, R. J. Bell, S. E. Bell, R. R. Bell, R. W. Alexander, Jr., and C. A. Ward, “Optical properties of the metals Al, Co, Cu, Au, Fe, Pb, Ni, Pd, Pt, Ag, Ti, and W in the infrared and far infrared,” Applied Optics, vol. 22, no. 7, pp. 1099-1119, Apr. 1, 1983. [20] E.D. Palik, Handbook of optical constants of solids, Academic, New York, 1985. [21] Y. Suzaki and A. Tachibana, “Measurement of the micron sized radius of Gaussian laser beam using the scanning knife-edge,” Applied Optics, vol. 14, no. 12, pp. 2809-2810, Dec. 1975 | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/43757 | - |
| dc.description.abstract | 使用0.18微米CMOS製程設計兆赫波感測系統。因為製程中最大增益頻率的不足，我們使用測輻射熱儀的方式設計這個系統。
設計了一個溫度感測電路在CMOS製程，替換了需要特殊材料的測輻射熱儀。在這感測系統中，天線接收了兆赫波的能量，經由匹配的負載吸收轉換成熱能。隨之升高的溫度再經由溫度感測電路的偵測轉換成電壓的輸出。因此，我們可以偵測兆赫波的信號。 在這論文中，展現了10.6微米波長的天線設計。示範了使用有線元素法軟體進行熱的分析。設置了一個量測的環境。 最後我們得到了兩張空間響應分布圖，分別是使用垂直極化波和水平極化波入射。可從中看出天線和不同結構金屬對兆赫波能量的吸收程度。 | zh_TW |
| dc.description.abstract | We design a THz sensing system using 0.18 micron CMOS process. Here we use the bolometer approach because the maximum gain frequency of 0.18 micron CMOS is not enough for micron wavelength detector.
A thermal sensor is designed in CMOS process to replace the bolometer in other process. THz signal is received by an antenna and the power of THz beam is translated to heat by a matched load. The thermal sensor senses the change of temperature and output a respond voltage level. Therefore, the THz signal is obtained. In this report, the design of antenna in 10.6 micron wavelength is shown and the thermal analysis using FEM software is demonstrated. The measurement environment is setup. Finally, two pictures of spatial response in horizontal polarization and vertical polarization are got. The absorbing ability of THz wave in antennas and different metal structure can be seen. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-15T02:27:47Z (GMT). No. of bitstreams: 1 ntu-98-R96942003-1.pdf: 6460848 bytes, checksum: 3f44468333c3ba00e5e6f9389a812242 (MD5) Previous issue date: 2009 | en |
| dc.description.tableofcontents | 誌謝 i
中文摘要 ii ABSTRACT iii CONTENTS iv LIST OF FIGURES vi LIST OF TABLES ix Chapter 1 Introduction 1 Chapter 2 Terahertz Sensing System 6 2.1 Basic Bolometer Theory 6 2.2 Block Body Radiation 9 2.2.1 Heat Radiation 9 2.2.2 Stefan-Boltzmann Law 9 2.3 Proposed Terahertz Sensor in EM-Thermal Approach 10 Chapter 3 Thermal Sensing Circuits 12 3.1 PTAT (Proportional To Absolute Temperature) Circuit 12 3.2 Thermopiles 17 3.3 Differential Thermal Sensor 19 Chapter 4 The Heating of Matched Load 24 4.1 Antennas Designed in CMOS 25 4.2 Static State Thermal Simulation 29 4.3 Transient Thermal Simulation 34 Chapter 5 Test and Measurement 38 5.1 First Time Measurement 38 5.2 Second Time Measurement 42 Chapter 6 Conclusion 50 REFERENCE 51 | |
| dc.language.iso | en | |
| dc.subject | 紅外線 | zh_TW |
| dc.subject | 互補式金氧半 | zh_TW |
| dc.subject | 兆赫波 | zh_TW |
| dc.subject | 溫度感測 | zh_TW |
| dc.subject | 空間響應分布 | zh_TW |
| dc.subject | spatial response | en |
| dc.subject | infrared | en |
| dc.subject | CMOS | en |
| dc.subject | terahertz | en |
| dc.subject | thermal sensor | en |
| dc.title | 使用CMOS積體電路製程設計30兆赫感測系統中的溫感電路 | zh_TW |
| dc.title | Thermal Sensing Circuit for 30 THz Sensing System Using CMOS Process | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 97-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 許博文(Powen Hsu),張宏鈞(Hung-Chun Chang),柏小松(Sheau-Shong Bor),陳仲羲(John-Sea Chen) | |
| dc.subject.keyword | 互補式金氧半,兆赫波,溫度感測,空間響應分布,紅外線, | zh_TW |
| dc.subject.keyword | CMOS,terahertz,thermal sensor,spatial response,infrared, | en |
| dc.relation.page | 53 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2009-08-17 | |
| dc.contributor.author-college | 電機資訊學院 | zh_TW |
| dc.contributor.author-dept | 電信工程學研究所 | zh_TW |
| 顯示於系所單位： | 電信工程學研究所 | |
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| ntu-98-1.pdf 未授權公開取用 | 6.31 MB | Adobe PDF |
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