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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 蔡坤諭 | |
dc.contributor.author | Shin-Chuan Chen | en |
dc.contributor.author | 陳信全 | zh_TW |
dc.date.accessioned | 2021-06-15T02:23:08Z | - |
dc.date.available | 2015-02-11 | |
dc.date.copyright | 2010-02-11 | |
dc.date.issued | 2009 | |
dc.date.submitted | 2009-08-18 | |
dc.identifier.citation | [1] E. Kratschmer, et al., “Experimental evaluation of a 20x20 mm footprint microcoumn,”
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/43543 | - |
dc.description.abstract | 電子束微影術為一種極具潛力的次世代微影技術,在於具有高的解析度以及不需要光罩的製作,但是缺點為較低的產能。為了改善低產能的問題,微小化靜電元件可應用於多電子束微影系統中。
然而,電子透鏡的對準為影響其聚焦特性的一大問題。因此使用先陽極接合再鑽孔的微機電技術方法來製作電子透靜可避免對準精度的問題。 在本論文中,提出多電子束微影技術系統內的電子透鏡結構。電子透鏡可以聚焦電子束於矽晶圓上,然而,加工精確性會影響電子透鏡的製作,因此提出影像處理方法及疊對的方法來改善加工的精確性。此外,利用IES LORENTZ 套裝軟體及MATLAB 針對先陽極接合再鑽孔的微機電技術所製作的電子透靜的可製造性分析包括錐形結構及電子透鏡基板不平坦度影響。由可製造性的分析可知使用先陽極接合再鑽孔的方法所製作的電子透鏡可用於電子直寫式微影。 | zh_TW |
dc.description.abstract | Electron beam lithography is one of the promising candidates for next generation lithography because of the ultra-high resolution and the property of no mask need, but
low throughout is the significant drawback. In order to improve the problem of slow throughput, miniature electrostatic elements can be widely applied to multiple electron-beam lithography system. However, the misalignment problem of electron lens is the significant effect to focusing property of electron lens, thus bond-then-drill method based on MEMS technology for fabricating electron lens can prevent misalignment problem. In this thesis, architecture of electron lens for multiple electron beam lithography system is proposed. It can focus the electrons on the wafer. However, electron lens fabrication has the effect of fabrication accuracy, thus image process and overlay methods are proposed via MATLAB programming to improve fabrication accuracy. Besides, manufacturability analysis of MEMS-based electron lens with bond-then-drill method includes the effects of taper shapes structure and flatness variation is proposed by using Lorentz and MATLAB. It is believed that electron lens fabrication with bond-then-drill method can be useful for electron beam direct-write lithography. | en |
dc.description.provenance | Made available in DSpace on 2021-06-15T02:23:08Z (GMT). No. of bitstreams: 1 ntu-98-R95921071-1.pdf: 3575226 bytes, checksum: ce050eacf7576dba662263fb92f03707 (MD5) Previous issue date: 2009 | en |
dc.description.tableofcontents | Abstract II
摘要 III Statement of Contributions IV 誌謝 VI Table of Contents VII List of Figures X List of Tables XIV Chapter 1 Introduction 1 1.1 Electron Beam Lithography ................................................................................1 1.2 Microcolumn .......................................................................................................2 1.3 Multiple Electron Beam Lithography ..................................................................3 Chapter 2 Overview of Electrostatic Lens 5 2.1 Introduction .........................................................................................................5 2.2 Einzel Lens ..........................................................................................................5 2.3 Einzel Lens Design and Fabrication ....................................................................8 Chapter 3 Electron Lens Array Fabrication 12 3.1 Electron Lens Array Architecture .....................................................................12 3.2 MEMS Technique .............................................................................................13 3.2.1 Integrated Circuit Fabrication 14 3.2.1.1 Deposition Process 15 3.2.1.2 Lithography Process 15 3.2.1.3 Etching Process 16 3.2.2 Laser Micromachining 17 3.2.3 Anodic Bonding Process 18 3.3 Fabrication Methods Based on MEMS Technique ...........................................19 3.3.1 Drill-then-Bond Method 20 3.3.1.1 Electrode fabrication 21 3.3.1.2 Insulator fabrication 24 3.3.1.3 Electron Lens Array Bonding 25 3.3.2 Bond-then-Drill Method 28 3.3.2.1 Bonded Five Layer Structure With Anodic Bonding 29 3.3.2.2 Using UV-Laser Micromachining to Fabricate The Bonded Five Layer Structure 30 Chapter 4 Analysis of Insulator Characteristics 32 4.1 Electrical Breakdown Experiment .....................................................................32 4.1.1 Pico-ampere 33 4.1.2 High Voltage Power Supply 34 4.2 Comparison with Insulating Paper ....................................................................37 4.3 Thermal Analysis between Electron Lens and Chamber ..................................40 Chapter 5 Analysis of Fabrication Processes 48 5.1 Analysis of Misalignment Error during Anodic Bonding .................................48 5.1.1 Fundamental of Misalignment 49 5.1.1.1 Introduction 49 5.1.1.2 Alignment Marks 50 5.1.2 Misalignment Model Application to Anodic Bonding 51 5.1.3 Misalignment Error Improvement 53 5.2 Image Processing and Application to Estimation of Fabrication Accuracy ......58 5.2.1 Estimation of Alignment Accuracy between Silicon Wafer and Pyrex Glass 59 5.2.2 Estimation of Fabrication Accuracy of Pyrex Glass 68 Chapter 6 Manufacturability Analysis of A MEMS-based Electron-Optical System Design 80 6.1 Description of Electron Lens with Effects of Fabrication Variation .................80 6.2 Analysis of Electron-Optical System with Electron Lens Subject to Imperfect Hole Profiles ...............................................................................................................81 6.2.1 Feasible Analysis of EOS with Bond-then-Drill Method 81 6.2.2 Effects of Hole Diameters of Electron lens with Vertical Hole profile 84 6.2.3 Effects of Electron Lens with Imperfect Hole Profiles 86 6.3 Analysis of EOS with Electron Lens Subject to Substrate Topography ...........89 Chapter 7 Conclusions and Future Work 92 Bibliography 93 | |
dc.language.iso | en | |
dc.title | 電子束微影基於微機電技術之電子透鏡製作與可製造性分析 | zh_TW |
dc.title | FABRICATION AND MANUFACTURABILITY ANALYSIS OF
MEMS-BASED ELECTRON LENS FOR ELECTRON BEAM DIRECT-WRITE LITHOGRAPHY | en |
dc.type | Thesis | |
dc.date.schoolyear | 97-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 陳政宏,顏家鈺,郭宇軒,李佳翰 | |
dc.subject.keyword | 電子束微影術,電子透鏡,微機電技術,影像處理,疊對方法,錐形, | zh_TW |
dc.subject.keyword | electron beam lithography,electron lens,MEMS,image process,overlay,, | en |
dc.relation.page | 95 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2009-08-18 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電機工程學研究所 | zh_TW |
顯示於系所單位: | 電機工程學系 |
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