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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 吳宗霖(Tzong-Lin Wu) | |
| dc.contributor.author | Yu-Wen Huang | en |
| dc.contributor.author | 黃郁雯 | zh_TW |
| dc.date.accessioned | 2021-06-15T01:39:13Z | - |
| dc.date.available | 2009-07-17 | |
| dc.date.copyright | 2009-07-17 | |
| dc.date.issued | 2009 | |
| dc.date.submitted | 2009-07-15 | |
| dc.identifier.citation | [1] International Technology Roadmap for Semiconductors.
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Lin, “Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB,” IEEE Trans.Electromagn. Compat., vol. 46, pp. 33-45, Feb. 2004. [7] T. Sudo, H. Sasaki, N. Masuda, and J. L. Drewniak, “Electromagnetic interference (EMI) of system-on-package (SOP),” IEEE Trans. Adv. Packag., vol. 27, pp. 304-314, May. 2004. [8] M. Swaminathan and A.E. Engin, Power Integrity Modeling and Design for Semiconductors and Systems [9] T. H. Hubing, J. L. Drewniak, T. P. Van Doren, and D. M. Hockanson, “Power bus decoupling on multilayer printed circuit boards,” IEEE Trans. Electromag. Compat., vol. 37, pp. 155-166, May 1995. [10] X. Minjia, T. H. Hubing, J. Chen, T. P. Van Doren, J. L. Drewniak, and R. E. DuBroff, “Power-bus decoupling with embedded capacitance in printed circuit board design,” IEEE Trans. Electromag. Compat., vol. 45, pp. 22-30, Feb. 2003. [11] H. Kim, B. K. Sun, and J. Kim, 'Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs,' IEEE Microwave and Wireless Comp. Letters, vol. 14, no. 2, pp. 71-73, Feb. 2004. [12] W. Cui, J. Fan, Y. Ren, H. Shi, J. L. D rewniak, and R. E. DuBroff, “DC power-bus noise isolation with power-plane segmentation,” IEEE Trans. Electromagn. Compat., vol. 45, pp. 436–443, May 2003. [13] T. H. Kim, J. Lee, H. Kim, and J. Kim, “3 GHz wide frequency model of ferrite bead for power/ground noise simulation of high-speed PCB,” Electrical Performance of Electronic Packaging, 2002. pp.217-220. [14] Murata Manufacturing Co., Ltd. (http://www.murata.com/) [15] C. R. Paul, Introduction to Electromagnetic Compatibility, 2nd ed. [16] T. Kamgaing, and O. M. Ramahi, “A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface,” IEEE Microwave and Wireless Comp. Letters, vol. 13, pp. 21-23, Jan. 2003. [17] S. Shahparnia and O. M. Ramahi, “Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic band gap structures, ” IEEE Trans. on Electromagn. Compat ., vol. 46, pp. 580-587, Nov. 2004. [18] D. Sievenpiper, L. Zhang, R. F. J. Broas, N. G. Alexopolous, and E. Yablonovitch, “High-impedance electromagnetic surfaces with a forbidden frequency band,” IEEE Trans. Microwave Theory & Tech., vol. 47, pp. 2059-2074, Nov. 1999. [19] D. F. Sievenpiper, “High-impedance electromagnetic ground planes,” Ph.D. dissertation, Dept. Elect. Eng., Univ. California at Los Angeles, Los Angeles, CA, 1999. [20] J. Lee, H. Kim and J. Kim, “High Dielectric Constant Thin Film EBG Power/Ground Network for Broad-band Suppression of SSN and Radiated Emissions”, IEEE Microwave and Wireless Components Letters, vol. 15, No.8, pp. 505-507, Aug. 2005. [21] C. L. Wang, G. H. Shiue, W. D. Guo, and R. B. Wu, “A Systematic Design to Suppress Wideband Ground Bounce Noise in High-Speed Circuits by Electromagnetic-Band gap-Enhanced Split Powers”, IEEE Trans. Microwave Theory and Tech., vol. 54, No.12, pp. 4209-4217, Dec. 2006. [22] J. Park, A. C. W. Lu, K. M. Chua, L. L. Wai, J. Lee, and J. Kim, “Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications”, IEEE Microwave and WirelessComponents Letters, vol. 15, No.8, pp. 505-507, Aug. 2005. [23] T. L. Wu, Senior Member, IEEE, Y. H. Lin, T. K. Wang, C. C. Wang, and S. T. Chen, “Electromagnetic Band gap Power/Ground Planes for Wideband Suppression of Ground Bounce Noise and Radiated Emission in High-Speed Circuits”, IEEE Trans. Microwave Theory and Tech., vol. 53, No.9, pp. 2935-2942, Sept.2005. [24] T. L. Wu, Y. H. Lin, and S. T. Chen, “A Novel Power Plane With Super-Wideband Elimination of Ground Bounce Noise on High Speed Circuits”, IEEE Microwave and Wireless Components Letters, vol. 15, No.3, pp. 174-176, March 2005. [25] 韓子偉，應用於高速系統封裝之新型電磁能隙電源平面設計，國立台灣大學碩士論文，2007年6月。 [26] T. L. Wu and S. T. Chen, “A Photonic Crystal Power/Ground Layer for Eliminating Simultaneously Switching Noise in High-Speed Circuit”, IEEE Trans. Microwave Theory and Tech., vol. 54, No.8, pp. 3398-3406, Aug 2006. [27] J. D. Joannopoulos, R. D. Meade, J. N. Winn, Photonic Crystals: Molding the Flow of Light [28] J. Kim and M. Swaminathan,“Modeling of multilayered power distribution planes using transmission matrix method,” IEEE Trans. Adv. Packag., vol. 25, no. 2, pp.189-199, May 2002. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/43144 | - |
| dc.description.abstract | 為了達到寬頻的兆赫茲雜訊抑制效果，一個可當元件使用的新式寬能隙結構被提出。此結構由三維的交疊式電容與U型傳輸線週期性串接而成並利用低溫共燒陶瓷製程的特性達到縮小化的效果。為了快速預測截止頻帶，理論的模型也將被建立。此模型能成功的描述出該縮小化結構在高頻時內部的電感性耦合效應。藉由全波模擬軟體的使用與量測，模型的精確性可以得到驗證。同時，利用此模型的協助，不同的結構參數與截止頻帶的關係也將一併被探討。在此論文中，實作成品大小為1.2mm×3.8mm×0.728mm ，模擬與量測結果相當吻合。截止頻帶範圍約為2~5.5 GHz，在此範圍內，雜訊至少有25 dB的抑制效果。除此之外，我們也從事此結構與晶片封裝系統的共模擬，從實驗結果可以發現，在數位與類比電路中，都有很好的雜訊抑制能力。 | zh_TW |
| dc.description.abstract | A novel electromagnetic band gap (EBG) structure as a component is proposed for broadband suppression of GHz simultaneous switching noise. The structure is composed of three-dimensional interdigital capacitors (3D-IDC) and series U-shaped transmission lines periodically. The EBG structure can be miniaturized based on the LTCC fabrication technology. A theoretical circuit model which considers the inductive coupling in the 3D-IDC will be developed to predict the stop band. The accuracy of the proposed model will be verified by comparing with both the full-wave simulation and the measurement results. This modeling method is also employed to study the variation of band gap dependent on different geometrical parameters for the 3D-IDC and the U-shaped transmission line. A prototype is implemented using the LTCC technology with the dimension 1.2mm×3.8mm×0.728mm. Both simulation and measurement show the rejection band is from 2GHz to 5.5GHz. Over 25dB noise reduction in the stop band could be achieved. In addition, the suppressive ability is also verified in the chip-package co-simulation. From the simulation result, significant reduction of power noise could be found both in digital and mixed signal circuits. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-15T01:39:13Z (GMT). No. of bitstreams: 1 ntu-98-R96942015-1.pdf: 3663330 bytes, checksum: b97b93b58eb248624f0cae87e8add88b (MD5) Previous issue date: 2009 | en |
| dc.description.tableofcontents | Abstract (Chinese)……………………...……………………………….Ⅰ
Abstract……………………………………………………………...…..Ⅱ Table of Contents……………………………………………………..…Ⅲ List of Figures………………………………………………...……........Ⅴ Acronyms…………………………………………………………...…..Ⅷ Chapter 1 Introduction 1.1 Research Motivation………………………………………..……1 1.2 Simultaneous Switching Noise (SSN) in Power Distribution Network (PDN) of IC packages………………………………….2 1.3 Chapter Outline of This Paper……………………………………4 Chapter 2 Various Solutions to SSN Problem 2.1 Component……………………………………………..………..6 2.1.1 Decoupling Capacitors…………………………………….6 2.1.2 Ferrite Beads……………………………...……………….11 2.2 Electromagnetic Band Gap Structure…………………………...14 2.2.1 Embedded EBG Structure…………………………..…….15 2.2.2 Coplanar EBG Structure………………….……………….19 2.3 Photonic Crystal Power/Ground Layer…………………………22 Chapter 3 A Miniaturized EBG Structure as A Component 3.1 Design Concept…………………………………………………27 3.2 Theoretical Model and Band Gap Prediction…………......…….31 3.2.1 Theoretical Model of The 3D-IDC………………..….…...31 3.2.2 Prediction of Stop Band……………….……...…......…....40 3.2.3 Parameter Effect on The Band Gap………...………..…....45 3.3 Power Integrity Performance and Co-simlation…………….......50 3.3.1 Fabrication and Measurement………………..….………..50 3.3.2 Chip and Package Co-simulation…….……...…………....53 3.3.2.1 Digital Noise Coupled to Digital Circuit………...55 3.3.2.2 Digital Noise Coupled to RF Circuit…………….58 Chapter 4 Conclusion Reference 65 | |
| dc.language.iso | en | |
| dc.subject | 低溫共燒陶瓷製程 | zh_TW |
| dc.subject | 寬能隙結構 | zh_TW |
| dc.subject | 同步切換雜訊 | zh_TW |
| dc.subject | SSN | en |
| dc.subject | LTCC | en |
| dc.subject | EBG | en |
| dc.title | 以低溫共燒陶瓷製程設計和模型化抑制兆赫茲同步切換雜訊的微小化寬能隙結構 | zh_TW |
| dc.title | Design and Modeling of Miniaturized Band Gap Structure for Wideband GHz-Noise Suppression Based on LTCC Technology | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 97-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 洪子聖(Tzu-Sheng Hung),洪志斌(Chih-Ping Hung),駱韋仲(Wei-Chung Lo),鄭士康(Shih-Kang Cheng) | |
| dc.subject.keyword | 寬能隙結構,同步切換雜訊,低溫共燒陶瓷製程, | zh_TW |
| dc.subject.keyword | EBG,SSN,LTCC, | en |
| dc.relation.page | 69 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2009-07-15 | |
| dc.contributor.author-college | 電機資訊學院 | zh_TW |
| dc.contributor.author-dept | 電信工程學研究所 | zh_TW |
| 顯示於系所單位： | 電信工程學研究所 | |
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| ntu-98-1.pdf 未授權公開取用 | 3.58 MB | Adobe PDF |
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