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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 黃天偉(Tian-Wei Huang) | |
dc.contributor.author | Joseph Chong | en |
dc.contributor.author | 張主禧 | zh_TW |
dc.date.accessioned | 2021-06-14T17:09:40Z | - |
dc.date.available | 2009-07-30 | |
dc.date.copyright | 2008-07-30 | |
dc.date.issued | 2008 | |
dc.date.submitted | 2008-07-26 | |
dc.identifier.citation | [1] International Telecommunication Union.
[2] IEEE 802.15 WPAN Millimeter Wave Alternative PHY Task Group 3c (TG3c). [3] S. K. Reynolds, “A silicon 60GHz receiver and transmitter chipset for broadband communication,” IEEE International Solid State Circuit Conference, vol. 41, pp. 2820–2831, December 2006. [4] B. Razavi, RF Microelectronics. Prentice Hall, 1998. [5] A. F. Molisch, Wireless Communication. John Wiley & Sons, 2005. [6] T. H. Lee, “From oxymoron to mainstream: The evolution and future of rf cmos,” IEEE International Workshop on Radio-Frequency Integration Technology, December 2007. [7] R. Caverly, CMOS RFIC design principles. Artech House, 2007. [8] A. C. W. Lu, W. Fan, L. L. Wai, L. A. Low, F. X. Ke, K. C. Yip, and Y. P. Lim, “Modeling and characterization of wire bonding for RF applications,” Proc IEEE Electronic Components and Technology Conference, pp. 905–909, 2002. [9] C. Poynton, Digital Video and HDTV Algorithms and Interfaces. Elsevier Science, 2003. [10] Digital Display Working Group. [11] High-Definition Multimedia Interface. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/40974 | - |
dc.description.abstract | IEEE802.15.3是設定60GHz附近頻帶之無線個人網路的標準。
藉著在60GHz附近非常寬的頻寬,無線轉輸的資料量可以達到每秒十億位元(Gbps)的資料量。高畫質影像無線傳輸是該標準製定者群提出的其中一項應用。為了使多顆晶片可以封裝在一起,我們必須釐清晶片打線對電路效能的影響。實驗指明打線的電感值比預期小。 另外,我們也對高畫質影像無線傳輸作了測試。含有1.485Gbps資料量的1080i高畫質影像被載到40GHz的頻帶,然後傳輸了1.5公尺的距離。 | zh_TW |
dc.description.abstract | IEEE802.15.3 is a WPAN standard for wireless transmisson at 60GHz band.With the wide bandwidth around 60GHz it is possible to implement high data-rate,transmitting up to Gbps speed. One of the proposed usage is the wireless transmission of high-definition multimedia content.
In order that several chips could be packaged in a module, the effect of bondwire needs to be clarify. Experiment shows that wire-bonding for CMOS chip is much smaller than predicted. Wireless HD video transmission is also tested. The 1080i HD video, data-rate 1.485Gbps, is up-converted to 40GHz band, and transmitted over 1.5m distance. | en |
dc.description.provenance | Made available in DSpace on 2021-06-14T17:09:40Z (GMT). No. of bitstreams: 1 ntu-97-J95921036-1.pdf: 4551740 bytes, checksum: 5ea5083f39bbcc5188a9572340c55be0 (MD5) Previous issue date: 2008 | en |
dc.description.tableofcontents | 致謝 i
中文摘要 ii Abstract iii 1 Introduction 1 1.1 Background and Motivation 1 1.2 Contributions 3 1.3 Thesis Overview 4 2 Fundamentals 5 2.1 Propogation mechanisms 6 2.2 Signal Modulation 9 2.2.1 Analog Modulation 10 2.2.2 Digital Modulation 12 2.3 RF Frontend 15 2.3.1 Noise Figures and Low Noise Amplifiers 17 2.3.2 Frequency Synthesizers and Mixers 17 2.3.3 Power Amplifiers and Duplexers 18 3 CMOS Chip Bonding Study 20 3.1 CMOS Interconnect 21 3.2 Bonding Wires 24 3.2.1 60GHz CMOS Power Amplifier 24 3.2.2 Performance after Wire-Bonding 25 3.2.3 Literature Study 28 4 Wireless High Definition Video 30 4.1 High Definition (HD) Video 30 4.1.1 Definitions 30 4.1.2 Chroma Subsampling 32 4.1.3 HD Video Transfer Interfaces 34 4.2 Wireless HD Video Industry 37 4.3 Transmission Test 39 4.3.1 Baseband Signal 39 4.3.2 Transceiver 42 4.3.3 Wireless Transmission 43 5 Conclusion 48 5.1 CMOS Wire Bonding 48 5.2 Wireless HD video 49 References 51 | |
dc.language.iso | en | |
dc.title | 互補式金氧半導體晶片打線研究以及高畫質影像無線傳輸 | zh_TW |
dc.title | Complementary Metal-Oxide-Semiconductor Bonding Study and Wireless High-Definition Video Transmission | en |
dc.type | Thesis | |
dc.date.schoolyear | 96-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 王暉,盧信嘉,蔡政翰 | |
dc.subject.keyword | CMOS,打線,無線,高畫質,60GHz, | zh_TW |
dc.subject.keyword | CMOS,bondwire,wireless,high-definition,60GHz, | en |
dc.relation.page | 51 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2008-07-29 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電機工程學研究所 | zh_TW |
顯示於系所單位: | 電機工程學系 |
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