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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/40407完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 吳文方 | |
| dc.contributor.author | Tsung-Ying Tsai | en |
| dc.contributor.author | 蔡宗穎 | zh_TW |
| dc.date.accessioned | 2021-06-14T16:46:50Z | - |
| dc.date.available | 2011-08-04 | |
| dc.date.copyright | 2008-08-04 | |
| dc.date.issued | 2008 | |
| dc.date.submitted | 2008-07-30 | |
| dc.identifier.citation | 1. K. Y. Goh, J. E. Luan and T. Y. Tee, “Drop Impact Life Prediction Model for Wafer Level Chip Scale Packages,” Proceedings of the 7th Electronics Packaging Technology Conference, Vol. 1, pp. 58-65, Singapore, 2005.
2. J. E. Luan, T. Y. Tee, X. Zhang, E. Hussa, J. Wang, C. Ford and K. C. Jen, “Drop Impact Life Prediction Models with Solder Joint Failure Modes and Mechanisms,” Proceedings of the 7th Electronics Packaging Technology Conference, Vol. 1, pp. 66-72, Singapore, 2005. 3. T. Y. Tee, J. E. Luan, E. Pek, C. T. Lim and Z. Zhong, “Novel Numerical and Experimental Analysis of Dynamic Responses under Board Level Drop Test,” Proceedings of the 5th Thermal and Mechanical Simulation and Experiments in Microelectronics and Microelectronics, pp. 133-140, Brussels, Belgium, 2004. 4. J. E. Luan and T. Y. Tee, “Novel Board Level Drop Test Simulation Using Implicit Transient Analysis with Input-G Method,” Proceedings of the 6th Electronics Packaging Technology Conference, pp. 671-677, Singapore, 2004. 5. J. E. Luan, T. Y. Tee, E. Pek, C. T. Lim, Z. Zhong and J. Zhou, “Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact,” IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3, pp. 449-456, 2006. 6. J. E. Luan, T. Y. Tee, E. Pek, C. T. Lim and Z. Zhong, “Dynamic Responses and Solder Joint Reliability under Board Level Drop Test,” Microelectronics reliability, Vol. 47, pp. 450-460, 2007. 7. A. Syed, W. Lin, E. S. Sohn and S. W. Cha, “Plastic Deformation and Life Prediction of Solder Joints for Mechanical Shock and Drop/Impact Loading Conditions,” Proceedings of the Electronic Components and Technology Conference, pp. 507-514, 2007. 8. F. X. Che, J. H. L. Pang, W. H. Zhu, W. Sun, A. Sun, C. K. Wang and H. B. Tan, “Comprehensive Modeling of Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition,” Proceedings of the Electronic Components and Technology Conference, pp. 528-535, 2007. 9. Y. Y. Wang, F. Wang and T. C. Chai, “Finite Element Modeling of CSP package subjected to board level drop test,” Proceedings of the 6th Electronics Packaging Technology Conference, pp. 684-688, Singapore, 2004. 10. C. L. Yeh, T. Y. Tsai and Y. S. Lai, “Response Spectra Analysis for Transient Structural Responses of Board-level Electronic Packages Subjected to Half-sine Impact Acceleration Pulses,” Proceedings of the 7th Electronics Packaging Technology Conference, pp. 81-88, Singapore, 2005. 11. T. Y. Tee, J. E. Luan and H. S. Ng, “Development and Application of Innovational Drop Impact Modeling Techniques,” IEEE Transactions on Electronic Components and Technology Conderence, Vol. 1, pp. 504-512, 2005. 12. J. E. Luan, T. Y. Tee, E. Pek, C. T. Lim and Z. Zhong, “Modal Analysis and Dynamic Responses of Board Level Drop Test,” Proceedings of the 5th Electronics Packaging Technology Conference, pp. 233-243, Singapore, 2003. 13. Y. S. Lai, P. C. Yang and C. L. Yeh, “Effects of Different Drop Test Conditions on Board-Level Reliability of Chip-Scale Packages,” Microelectronics reliability, Vol. 48, pp. 274-281, 2008. 14. T. Y. Tee, H. S. Ng, C. T. Lim, E. Pek and Z. Zhong, “Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication applications,” Proceedings of the 53rd Electronic Components and Technology Conference, pp. 121-129, New Orleans, LA, USA, 2003. 15. Y. Q. Wang, K. H. Low, F. X. Che, H. L. J. Pang and S. P. Yeo, “Modeling and Simulation of Printed Circuit Board Drop Test,” Proceedings of the 5th Electronics Packaging Technology Conference, pp. 263-268, Singapore, 2003. 16. H. Lou, X. Qu, Z. Chen and J. Wang, “Lifetime Assessment of Solder Joints of BGA Package in Board Level Drop Test,” Proceedings of the 6th Electronics Packaging Technology Conference, 2005. 17. D. S. Jiang, Y. L. Tzeng, Y. P. Wang and C. S. Hsiao, “Board Level Drop Test and Simulation of CSP for Handheld Application,” Proceedings of the 7th Electronics Packaging Technology Conference, pp. 1-4, 2006. 18. Y. Liu, Y. Liu and S. Irving, “Board Level Drop Test Simulation for an Advanced MLP,” Proceedings of the 8th Electronics Packaging Technology Conference, pp. 1-5, 2007. 19. L. F. Coffin, Jr., “A Study of the Effects of Cyclic Thermal Stress on a Ductile Metal,” Trans. ASME, Vol. 76, pp. 931-950, 1954. 20. S. S. Manson, “Behavior of Materials under Conditions of Thermal Stress,” Heat Transfer Symposium, University of Michigan Engineering Research Institute, pp. 9-57, 1953. 21. Subassembly Mechanical Shock, JESD22-B111, JEDEC Solid State Technology Association, 2001. 22. S. S. Rao, Mechanical Vibrations, Pearson Prentice Hall, 2004 23. C. E. Ebeling, An Introduction to Reliability and Maintainability Engineering, McGraw-Hill, New York, 1997. 24. 陳精一，ANSYS振動學實務分析，高立圖書有限公司，2005。 25. 林有玉，電子構裝之力學分析與量化可靠度評估，國立台灣大學機械工程研究所碩士論文，2005。 26. 吳克恭，無鉛銲錫報告書，新原金屬工業股份有限公司，2006。 27. 李輝煌，ANSYS工程分析基礎與觀念，高立圖書有限公司，2005。 28. 莊東漢，材料破損分析，五南圖書出版公司，2007。 29. http://72.14.235.104/search?q=cache:GE1xcMntAxIJ:www.cna.edu.tw/~sas/ccna/article/dmme02.doc+basquin+s+n+%E6%8F%90%E5%87%BA&hl=zh-TW&ct=clnk&cd=8&gl=tw&lr=lang_zh-CN|lang_zh-TW | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/40407 | - |
| dc.description.abstract | 一般來說，多數研究者估計電子封裝體所能承受之掉落次數，亦即其衝擊壽命為一定值；然而衝擊試驗結果顯示，此壽命呈現離散的情況。本研究即分別探討電子封裝體尺寸與壽命預估模型中參數之不確定性，對其衝擊壽命的影響。吾人首先利用有限元素軟體，模擬封裝體在錫球直徑變異下，錫球與印刷電路板或晶片間的最大剝離應力值，代入封裝體壽命預估模型後，將衝擊壽命以機率分佈方式呈現，相較於原始封裝體可承受245次掉落次數，若由可靠度函數計算後，其可靠度僅有46.71%，顯示封裝體幾何形狀參數之不確定性會對其壽命造成影響；電子封裝體壽命預估模型為一經驗公式，其中會有誤差存在，吾人接著探討封裝體壽命預估模型中常數項及指數項參數變異，造成衝擊壽命的離散性，並以可靠度方法評估之，結果顯示封裝體各材料參數的不確定性對其壽命具有一定程度之影響。本研究之分析過程與結果應可作為封裝體掉落衝擊壽命之可靠度評估。 | zh_TW |
| dc.description.abstract | Most researchers consider the life of an electronic package subjected to drops is a fixed value. However, drop tests show that impact lives of a random sample of an electronic package usually exhibit certain scatter. Therefore, the impact life had better be described by a random variable. In this study, the influence of geometrical size variation of an electronic package on its impact life distribution and reliability is investigated. The influence of uncertainty of parametric values in the life prediction model is investigated as well. First, finite element analysis is employed to evaluate the maximum peeling stresses of solders of a random sample of an electronic package. The obtained maximum stresses are then substituted into a life prediction model to obtain the distribution of impact lives. The result shows that size variation of electronic packages does affect the life distribution and reliability estimation of the package. Next, the influence of uncertainty of parametrical values in the impact life prediction model is investigated. It is also found that uncertainty of parametrical values affects the variation of impact life and its associated reliability estimation. It is believed that the study can be used for quantitative reliability estimation of an electronic package subjected to drops. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-14T16:46:50Z (GMT). No. of bitstreams: 1 ntu-97-R95522629-1.pdf: 1973017 bytes, checksum: 8d31916a99e6985af59d9c6f3e5c7a62 (MD5) Previous issue date: 2008 | en |
| dc.description.tableofcontents | 誌謝 I
中文摘要 II Abstract III 目 錄 IV 表 目 錄 VI 圖 目 錄 VII 第一章 序論 1 1-1 研究背景 1 1-2 文獻回顧 1 1-3 研究動機與目的 3 1-4 論文架構 3 第二章 理論介紹 6 2-1 機率統計理論 6 2-1-1 離散型機率質量函數 6 2-1-2 連續型機率密度函數 6 2-1-3 累積分佈函數 6 2-1-4 隨機取樣、平均值與變異數 7 2-2 可靠度及其相關理論 7 2-2-1 可靠度函數 7 2-2-2 機率分佈函數 9 2-2-3 機率點圖(Probability plots) 13 2-2-4 卡方適合度檢定(Chi-square goodness-of-fit test) 15 2-3 掉落測試之力學分析 15 2-3-1 機械能守恆、碰撞原理及衝量動量原理 15 2-3-2 振動基礎理論[22, 24] 16 2-3-3 衝擊理論[22] 19 2-4 電子封裝體掉落測試之壽命預估模型 20 2-4-1 疲勞曲線 20 2-4-2 電子封裝體壽命預估模型 20 2-5 JEDEC衝擊規範 21 第三章 有限元素分析 29 3-1 有限元素法概述及研究相關應用 29 3-2 電子封裝體掉落衝擊模擬 33 3-3 有限元素模型建構 34 3-3-1 模型基本假設 34 3-3-2 模型尺寸 34 3-3-3 模型材料性質 35 3-3-4 邊界條件 35 3-4 有限元素模擬之結果 35 第四章 封裝體尺寸變異對掉落衝擊壽命之影響 46 4-1 無鉛錫球直徑變異之影響 46 4-2 小結 47 第五章 封裝體掉落衝擊壽命預估模型參數變異對掉落衝擊壽命之影響 54 5-1 前言 54 5-2 參數 為隨機變數時與壽命之關係 54 5-3 參數 為隨機變數與壽命之關係 56 5-4 參數 及 皆為隨機變數與壽命之關係 57 5-5 小結 58 第六章 結論及未來展望 67 6-1 結論 67 6-2 討論 67 6-3 未來展望 68 參考文獻 69 | |
| dc.language.iso | zh-TW | |
| dc.subject | 可靠度 | zh_TW |
| dc.subject | 電子封裝體 | zh_TW |
| dc.subject | 衝擊壽命 | zh_TW |
| dc.subject | reliability | en |
| dc.subject | electronic package | en |
| dc.subject | impact lives | en |
| dc.title | 電子封裝體掉落之力學分析與可靠度評估 | zh_TW |
| dc.title | Mechanics Analysis and Reliability Assessment of Electronic Packages Subjected to Drops | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 96-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 鍾添東,徐堯 | |
| dc.subject.keyword | 電子封裝體,衝擊壽命,可靠度, | zh_TW |
| dc.subject.keyword | electronic package,impact lives,reliability, | en |
| dc.relation.page | 71 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2008-07-31 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
| 顯示於系所單位： | 機械工程學系 | |
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