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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 蘇國棟(Guo-Dung Su) | |
dc.contributor.author | Tsung-Han Wu | en |
dc.contributor.author | 吳宗翰 | zh_TW |
dc.date.accessioned | 2021-06-14T16:44:25Z | - |
dc.date.available | 2018-12-31 | |
dc.date.copyright | 2008-08-04 | |
dc.date.issued | 2008 | |
dc.date.submitted | 2008-08-01 | |
dc.identifier.citation | 1. S. Nakamura, M. Senoh, N. Iwasa, S. Nagahama; “High power InGaN single quantum well structure blue and violet light‐emitting diodes”; Applied Physics Letters, 1995; p 1868-1870
2. C. Tsou, Y. S. Huang, G. W. Lin; “Silicon-based packaging platform for light emitting diode”, IEEE Transactions on Advanced Packaging, v 29, n 3, August, 2006, p 607-614 3. H. T. Hsieh, G. D.John Su; “A fabrication technique for microlens array with high fill-factor and small radius of curvature”, Proceedings of SPIE - The International Society for Optical Engineering, v 6883, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics, 2008, p 68830 4. E. F. Schubert, Light Emitting Diodes, Cambridge University Press, Cambridge UK, 2003h 5. M. J. Dai, C. K. Liu, C. K. Yu, S. L. Kuo; “High power LED integrated with silicon-based thermoelectric cooler package”, 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, v 2, 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, 2007, p 229-233 6. W. K. Jeung, S. H. Shin, S. Y. Hong, S. M. Choi, S. Yi, Y. B. Yoon, “Silicon-based, multi-chip LED package,” 57th Electronic Components and Technology Conference 2007, p 722-727 7. M. J. Madou, Fundamentals of microfabrication , CRC Press, New York, 1997 8. D. Soo Lee, S. Min, M. Seop Lee; “Design and analysis of spatially variant microlens-array diffuser with uniform illumination for short-range infraredwireless communications using photometric approach”; Optics Communications 219 (2003) p.49–55 9. C. F. Madigan, M.-H. Lu, and J. C. Sturm; “Improvement of output coupling efficiency of organic light-emitting diodes by backside substrate modification”; Applied Physics Letters, v 76, n 13, Mar 27, 2000, p 1650-1652 10. M. He, X. C. Yuan1, N. Q. Ngo, J. Bu and S. H. Tao; “Single-step fabrication of a microlens array in sol–gel material by direct laser writing and its application in optical coupling”, Journal of Optics A: Pure and Applied Optics, 2004, p 94-96 11. T. R. M. Sales, S. H. Chakmakjian, D. J. Schertler, G. M. Morris, “LED illumination control and color mixing with engineered diffuser” Proceedings of SPIE - The International Society for Optical Engineering, v 5530, Fourth International Conference on Solid State Lighting, 2004, p 133-140 12. T. R. M. Sales; “Structured Microlens Arrays for Beam Shaping” ; Proceedings of SPIE - The International Society for Optical Engineering, v 5175, Laser Beam Shaping IV, 2003, p 109-120 13. S. I. Chang, J. B. Yoon, H. Kim, J.J. Kim, B.K. Lee, D.H. Shin “Microlens array diffuser for a light-emitting diode backlight system” Optics Letters, v 31, n 20, Oct 15, 2006, p 3016-3018 14. T.K. Shih, C.F. Chen, J.R. Ho, F.T. Chuang; “Fabrication of PDMS (polydimethylsiloxane) microlens and diffuser using replica molding”; Microelectronic Engineering 83 (2006) p.2499–2503 15. S. McCoya, D. Browna, D. Brown, “Double-sided lenslet array in an imaging multi-beam integrator configuration for a diffuser application” Proceedings of SPIE - The International Society for Optical Engineering, v 5175, Laser Beam Shaping IV, 2003, p 139-148 16. H.Urey and K. D. Powell; “Microlens-array-based exit-pupil expander for full-color displays” APPLIED OPTICS _ Vol. 44, No. 23 _ 10 August 2005, p 227-236 17. S. Muthu, F. J. Schuurmans, M. D. Pashley, “Red, Green, and Blue LED based white light generation: Issues and control” , Conference Record - IAS Annual Meeting (IEEE Industry Applications Society), v 1, 2002, p 327-333 18. D.A. Steigerwald, J. C. Bhat, D. Collins, R. M. Fletcher, M.O. Holcomb,M. J. Ludowise; “Illumination with Solid State Lighting Technology,” IEEE Journal on Selected Topics in Quantum Electronics, VOL. 8, NO. 2, 2002, p 310-320 19. J. H. Ko, “Back light unit technology”, http://www.hallym.ac.kr/main.html, the 9th KLCC 20. “Luxeon DCC for LCD Backlighting Application Brief AB27” Lumileds http://www.lumileds.com/solutions/solution.cfm?id=2 21. C. A. Deller, G. B. Smith, J. B. Franklin; “Uniform white light distribution with low loss from coloured LEDs using polymer doped polymer mixing rods” Proceedings of SPIE - The International Society for Optical Engineering, v 5530, Fourth International Conference on Solid State Lighting, 2004, p 231-240 22. Lamda research Http://www.lamdares.com 23. I. Schnitzer; E. Yablonovitch. “30% external quantum efficiency from surface textured, thin-film LEDs” Appl. Phys. Lett., Vol 63, No. 16, 1993, p 2174-2176 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/40304 | - |
dc.description.abstract | 發光二極體的特性包含高耐用性,壽命長以及低能源消耗。因為這些特性,發光二極體將可在背光模組以及一般照明取代現有的光源。對於高亮度發光二極體而言,封裝是一個極為重要的因素。封裝最重要的兩個環節即為光學設計與熱管理。我們將會在此論文研究如何提高光學方面的外部效率與均勻度。
在單晶片封裝中,我們使用微透鏡陣列來有效提高光學效率與均勻度,此微透鏡陣列的特性將會利用實驗與模擬結果來了解。藉由考慮到側杯的一次反射,微透鏡陣列的位置將會被小心的設計。在加入此微透鏡陣列後,效率從0.66提升至0.77。而同時,在比較峰對谷值與標準差後也可發現均勻度已經有效改善。 在考慮完單一封裝之後,我們設計一個擁有四個發光二極體的多晶片封裝。每一個晶片與晶片的距離是1毫米。我們藉由研究其中單一綠光發光二極體的均勻度來證明此多晶片封裝系統是可以有效讓紅光、綠光、藍光混光。經由這分析,我們已經得到微透鏡陣列與矽封裝應用在未來的高亮度發光二極體是非常適合的。 | zh_TW |
dc.description.abstract | Light-emitting Diode (LED) is a suitable light source in general lighting and backlight module due to its robustness, long life, and low power consumption. For high brightness LED, packaging has become a crucial factor. The issue of packaging can be divided into optical design and thermal management. External efficiency and uniformity of optical design will be discussed in this thesis.
To increase external efficiency and uniformity in single chip LED, we introduce microlens array. The characteristic of microlens is discussed through experiment and simulation result. The location of microlens is cautiously designed by considering cup reflection. Efficiency is increased from 0.66 to 0.77 with specific microlens film in single packaging. Meanwhile, the uniformity is also improved with the comparison of peak-to-valley value in ray pattern and standard deviation. On the other hand, LEDs cluster together in multi-chip packaging. The gap between LEDs is about 1mm. We focus on a green chip LED to demonstrate that RGB lights can be mixed through microlens film. After these analyses, with efficiency and uniformity improvement we prove that the silicon packaging which is compacted microlens film is adequate for future HBLED. | en |
dc.description.provenance | Made available in DSpace on 2021-06-14T16:44:25Z (GMT). No. of bitstreams: 1 ntu-97-R95941033-1.pdf: 4696176 bytes, checksum: 42cefc9e51d3954d90d0e61ebfbe52f2 (MD5) Previous issue date: 2008 | en |
dc.description.tableofcontents | Abstract…………………………………………………………………………………Ⅰ
中文摘要……………………………………………………………………………….Ⅱ 致謝…………………..………………………………………………………………...Ⅲ Content…………………………………………………………………………………Ⅳ List of figures…………………………………………………………………………..Ⅵ List of tables………….………………………………………………………………...Ⅹ CONTENT Chapter 1: Introduction…………………………………………………………………..1 Chapter 2 Concerns of LEDs packaging 2.1: Packaging roadmap and silicon packaging…………………………………4 2.2: MEMS technology…………………………………………………………7 2.3: Review of microlens……………………………………………………….9 2.4: RGB mixing………………………………………………………………11 2.5: Monte-carlo method and Tracepro………………………………………..17 Chapter 3 Optical design 3.1: Total internal reflection and Material selection…………………………..19 3.2: Improvement of efficiency and microlens design………………………..21 3.3: Cup design………………………………………………………………..24 3.4: Encapsulant effect and uniformity………………………………………..29 Chapter 4 Experiment and discussion 4.1: Experiment setup and result……………………………………………...32 4.2: Singel packaging 4.2.1 Uniformity improvement in single packaging…………..…………40 4.2.2 Location effect in efficiency aspect……………..…………………42 4.3.3 Summary of single packaging……………………………………..46 4.3: Single wavelength LEDs multi-chip packaging 4.3.1 Full microlens film application…………………………………….46 4.3.2 Specific microlens array film in multi-chip design………………..51 4.4: RGGB LEDs multi-chip packaging………………………………………53 Chapter 5 Conclusion…………………………………………………………………..59 References……………………………………………………………………………...61 Appendix Tracepro setting of chip pattern……………………………………………….66 | |
dc.language.iso | en | |
dc.title | 微透鏡陣列在發光二極體封裝之分析與應用 | zh_TW |
dc.title | Analysis and Application of Microlens Array in
Silicon Packaging | en |
dc.type | Thesis | |
dc.date.schoolyear | 96-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 蔡睿哲,黃鼎偉 | |
dc.subject.keyword | 發光二極體,矽,封裝,微透鏡陣列, | zh_TW |
dc.subject.keyword | Light emitting diode,silicon,packaging,microlens, | en |
dc.relation.page | 71 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2008-08-01 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 光電工程學研究所 | zh_TW |
顯示於系所單位: | 光電工程學研究所 |
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