請用此 Handle URI 來引用此文件：
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/36037完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 陳希立 | |
| dc.contributor.author | Yuan-Chin Chiang | en |
| dc.contributor.author | 江沅晉 | zh_TW |
| dc.date.accessioned | 2021-06-13T07:50:08Z | - |
| dc.date.available | 2006-08-01 | |
| dc.date.copyright | 2005-08-01 | |
| dc.date.issued | 2005 | |
| dc.date.submitted | 2005-07-25 | |
| dc.identifier.citation | 參考文獻
1. Harper, D. R. and Brown, W. B., “Mathematical Equations for Heat Conduction in the Fins of Air Cooled Engine,” NACA Report, No. 158, 1922. 2. Murray, M. N., “Heat Transfer Through an Annular Disk or Fin of Uniform Thickness,” Trans. ASME, J. Applied Mech., 60, A78, 1938. 3. Strassberg, D., 'Cooling Hot Microprocessor,' EDN, Vol. 39, pp. 40-50, 1994. 4. Grover, G. M., “US Patent No.3229759,” 1963. 5. Nguyen, T., Mochizuki, M., Mashiko, K., Saito, Y., Sauciuc, I., and Boggs, R., “Advanced Cooling System Using Miniature Heat Pipes in Mobile PC,” IEEE Transactions on Components and Packing Technology, Vol.23, No.1, March 2000. 6. Legierski, J. & Wiecek, B.,” Steady State Analysis of Cooling Electronic Circuits Using Heat Pipes,” IEEE Transactions on Components and Packing Technology, Vol.24, No.4, December 2001. 7. Maydanik, Yu. F., 'Loop Heat Pipes – Development and Application,' the SEMINAR of Department of Mechanical Engineering National Taiwan University, Oct. 2003. 8. Murthy, S. S., Joshi, Y. K. and Nakayama, W., 'Single Chamber Compact Thermosyphons with Micro-Fabricated Components,' Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (I-Them), Las Vegas, NV, May 2000. 9. Ma, Z. N., Sobhan, C. B., Wong, T. N. and Huang, X. Y., 'Experimental Investigations on a Closed Mini Thermosyphon,' IEEE/CPMT Electronics Packaging Technology Conference, 1998 10. Ramaswamy, C., Joshi, Y. K. and Nakayama, W., 'Thermal Performance of a Compact Two-Phase Thermosyphon: Response to Evaporator Confinement and Transient Loads,' Journal of Enhanced Heat Transfer, Vol. 6, No. 2-4, pp. 279-288, 1999. 11. Ramaswamy, C., Joshi, Y. K., Nakayama, W. and Johnson, W. B., 'Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon,' IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, Mar. 2000. 12. Pal, A., Joshi, Y. K., Monem H., Patel, C. D. and Wenger, T. M., 'Design and Performance Evaluation of a Compact Thermosyphon,' IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 4, Dec. 2002 13. Yuan, L., Joshi, Y. K. and Nakayama, W., 'Effect of Condenser Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon,' Microscale Thermophysical Engineering, Vol. 7, pp. 163-179, 2003 14. NA, M. K., Jeon, J. S., Kwak, H. Y. and Nam, S. S., 'Experimental Study on Closed-Loop Two-Phase Thermosyphon Devices for Cooling MCMs,' Journal of Heat Transfer Engineering, Vol. 22, pp. 29-39, 2001. 15. Khodabandeh, R. and Palm, B., 'Influence of System Pressure on the Boiling Heat Transfer Coefficient in a Closed Two-Phase Thermosyphon Loop,' International Journal of Thermal Sciences, Vol. 41, pp. 619-624, 2002. 16. Jacob, M., 'Heat Transfer,' Wiley, New York, pp.636-638,1949. 17. Kurihari, H. M. and Myers, J. E., 'Effects of Superheat and Roughness on the Boiling Coefficients,' AIChE J., vol. 6, no. 1, pp. 83-91, 1960. 18. Griffith, P. and Wallis, J. D., 'The Role of Surface Conditions in Nucleate Boiling,' Chem. Eng. Prog. Symp. Ser., vol.55, no.29, pp.103-110,1959. 19. Chaudri, I. H. and McDougall, I. R., 'Aging Studies in Nucleate Pool Boiling of Isopropyl Acetate and Perchlorethylene, ' Int. J. Heat Mass Transfer, vol.12, pp.681-688,1969. 20. Bonilla, C. F., Grady, J. J., and Avery, G. A., 'Pool Boiling Heat Transfer from Scored Surfaces, ' Chem. Eng. Prog. Symp. Ser., vol. 61, no. 57, pp.280-288,1965. 21. O’Neill, P. S.,Gottzman, C. F., and Terbot, J. W., 'Novel Heat Exchanger Increases Cascade Cycle Efficiency for Natural Gas Liquefaction,in Advances in Cryogenic Engineering, ' ed. K. D. Timmerhaus, pp.420-437,Plenum,New York, 1972. 22. Lin, J.C., Wu, J.C., Yen, C.T., Yang, C.Y.,” Fabrication and Performance Analysis of Metallic Micro Heat Spreader for CPU”, 13th International Heat Pipe Conference (13th IHPC), Shanghai, China, September 21-25, 2004. 23. Kim, S.J., Kim, D., Lee, D.Y.,” On the local thermal equilibrium in microchannel heat sinks”, International Journal of Heat and Mass Transfer 43(2000) 1735~1748. 24. Zhau, C.Y., Lu, T.J.,” Analysis of microchannel heat sinks for electronics cooling”, International Journal of Heat and Mass Transfer 45(2002) 4857~4869. 25. Anjun, Jiao, Reigler, R., Ma, H., Peterson, G. P.,” Groove geometry effects on thin film evaporation and heat transport capability in a grooved heat pipe”, 13th International Heat Pipe Conference(13th IHPC), Shanghai, China, September 21-25, 2004. 26. Quintard, M., Whitaker, S.,” Local thermal equilibrium for transient heat conduction : theory and comparison with numerical experiments”, Int. J. Heat Mass Transfer. Vol.38, No.15, pp.2779-2796, 1995. 27. Landereau, P., Noetinger, B., Quintard, M.,” Quasi-steady two-equation models for diffusive transport in fractured porous media : large-scale properties for densely fractured systems”, Advance in Water Resources 24(2001) 863-876. 28. Kim, S. J., Jang, S. P.,” Effects of the Darcy number, the Prandtl number, and the Reynolds number on local thermal non-equilibrium”, International Journal of Heat and Mass Transfer 45(2002) 3885~3896. 29. Leong, K.C., Liu, C.Y., Sun, K.H.,” Vapor pressure distribution of a flat plate heat pipe”, Int. Comm. Heat Mass Transfer, Vol.23, No.6, pp.789-797, 1996. 30. Tan, B.K., Huang, X.Y., Wong, T.N., Ooi, K.T.,” A study of multiple heat sources on a flat plate heat pipe using a point source approach”, International Journal of Heat and Mass Transfer 43(2000) 3755-3764. 31. Xuan, Y., Hong, Y., Li, Q.,” Investigation on transient behaviors of flat plate heat pipes”, Experimental Thermal and Fluid Science 28(2004) 249~255. 32. Mochizuki, M., Nguyen, T., Mashiko, K., Staito, Y., Nguyen, T., Wuttijumnong, V. and Wu, X.,” Practical Application of Heat Pipe and Vapor Chamber for Cooling High Performance Personal Computer”, 13th International Heat Pipe Conference (13th IHPC), Shanghai, China, September 21-25, 2004. 33. Levy, S.,” Generalized Correlation of Boling Heat Transfer,” Journal of Heat Transfer, February 37-42, 1959. 34. Engelberg-forster, K., and GREIF, R., “Heat Transfer to a Boiling Liquid – Mechanism and Correlation”, Journal of Heat Transfer, February 43-53, 1959. 35. Wuttijumnong, V., Nguyen, T., Mochizuki, M., Mashiko, K., Saito, Y., and Nguyen, T.,” Overview Latest Technologies Using Heat Pipe And Vapor Chamber For Cooling Of High Heat Generation Notebook Computer”, 20th IEEE SEMI-THERM Symposium, 2004. 36. Joseph, M.W., and Chang, W.S.,” EFFECTIVE THERMAL CONDUCTIVITY OF SINTER METAL FIBERS”, IEEE 1989. 37. Tavman, I.H., “EFFECTIVE THERMAL CONDUCTIVITY OF GRANULAR POROUS MATERIALS”, Int. Comm. Heat Mass Transfer, Vol. 23, No. 2, pp.169-176, 1996. 38. Carson, J.K., Lovatt, S.J., Tanner, D.J., Cleland, A.C., “An analysis of the influence of material structure on the effective thermal conductivity of theoretical porous materials using finite element simulations”, international Journal of Refrigeration 26 (2003) 873-880. 39. Lee, S.L. and Yang, J.H.,” Modeling of effective thermal conductivity for a non-homogeneous anisotropic porous medium”, Int. J. Heat Mass Transfer, Vol.41, Nos6-7, pp.931-937, 1998. 40. Belova, I.V., Murch, G.E., “Monte Carlo simulation of the effective thermal conductivity in two-phase material”, Journal of Materials Processing Technology 153—154(2204)741-745. 41. Wei, J., Chan, A., and Copeland, D., “Measurement of Vapor Chamber Performance” 19th IEEE SEMI-THERMAL Symposium, 2003. 42. Sauciuc, I., Chrysler, G., Mahajan, R. and Prasher, R., “Spreading in the Heat Sink Base: Phase Change System or Solid Metals??,” IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 25, NO.4, DECEMBER 2002. 43. Chaudri, I. H. and McDougall, I. R., 'Aging Studies in Nucleate Pool Boiling of Isopropyl Acetate and Perchlorethylene, ' Int. J. Heat Mass Transfer, vol.12, pp.681-688,1969. 44. Jacob, M., 'Heat Transfer,' Wiley, New York, pp.636-638,1949. 45. Kurihari, H. M. and Myers, J. E., 'Effects of Superheat and Roughness on the Boiling Coefficients,' AIChE J., vol. 6, no. 1, pp. 83-91, 1960. 46. Griffith, P. and Wallis, J. D., 'The Role of Surface Conditions in Nucleate Boiling,' Chem. Eng. Prog. Symp. Ser., vol.55, no.29, pp.103-110,1959. 47. Benjamin, J. E. and Westwater, J. W., Bubble Growth in Nucleate Boiling of a Binary Mixture, International Development in Heat Transfer, ASME, New York, pp. 212-218, 1961 48. Yatabe, J. M. and Westwater, J. W., Bubble Growth Rates for Ethanolwater and Ethanol-isoproponal Mixtures, Chem. Eng. Prog. Symp. Ser., vol.62, no. 64, pp.17-23, 1966. 49. Kravchenko, V. A. and Ostrovsky, Y. N., Effect of Surface Roughness on Boiling Heat Transfer to Light Hydrocarbons and Nitrogen, Heat Transfer Sov. Res., vol. 11, no.1, pp. 133-137, 1979. 50. Bonilla, C. F., Grady, J. J., and Avery, G. A., 'Pool Boiling Heat Transfer from Scored Surfaces, ' Chem. Eng. Prog. Symp. Ser., vol. 61, no. 57, pp.280-288,1965. 51. Marto, P. J. and Rohsenow, W. M., Effects of Surface Conditions on Nucleate Pool Boiling of Sodium, J. Heat Transfer, vol. 88, pp. 196-204, 1966. 52. Bliss, F. E., Hsu, S. T., and Crawford, M., An Investigation into the Effects of Various Platings on the Film Coefficient during Nucleate Boiling from Horizontal Tubes, Int. J. Heat Mass Transfer, vol. 12, pp. 1061-1072, 1969. 53. Albertson, C. E., Boiling Heat Transfer Surface and Method, U.S. Patent 4,018,264, April 19, 1977. 54. Gottzmann, C. F., Wulf, J. B., and O’Neill, P. S., Theory and Application of High Performance Boiling Surfaces to Components of Absorption Cycle Air Conditioners, Proc. Conf. Nat’l Gas Res. Tech., Session V, Paper 3, Chicago, February 28, 1971. 55. O’Neill, P. S.,Gottzman, C. F., and Terbot, J. W., 'Novel Heat Exchanger Increases Cascade Cycle Efficiency for Natural Gas Liquefaction,in Advances in Cryogenic Engineering, ' ed. K. D. Timmerhaus, pp.420-437,Plenum,New York, 1972. 56. Moore, F. D. and Mesler, R. B., ”The Measurement of Rapid Surface Temperature Flucturations During Nucleate Boiling of Water,” AIChE J., vol7,pp.620-624, 1961. 57. Chu, H. D., Delaney, L. J. and Eagleton, L. C., “The Rate of Vaporization of Deuterium Oxide,” Chem. Eng. Science, 20(6), 601-605(1965) 58. Swanson, J. L. and Bowman, H. F., “Transient Surface Temperature Behavior in Nucleate Pool-Boiling Nitrogen,” Proc. 5th Int. Heat Trans. Conf., Hemisphere, 1974. 59. Subbotin, V. I., Sorokin, D. N., Tzyganok, A. A., and Gribor, A. A., “Investigation of Vapor Bubble Effect on Temperature of Heat Transfering Surface at Nucleate Boiling,” ibid, 1974, pp. 55-59. 60. Cooper, M. G. and Lloyd, A. J. P., “Transient Local Heat Flux in Nucleate Boiling,” Proc. 3rd Int. Heat Trans Conf., Vol.3, 1966. pp. 193-203. 61. Handricks, R. C. and Sharp, R. R., 'Initiation of Cooling Due to Bubble Growth on a Heating Surface, 'NASA TND-2290, April 1964 62. Hospeti, N. and Mesler, R. B., “Deposits Formed Beneath Bubbles During Nucleate Boiling of Radioactive Calcium Sulfate Solution,” University of Kansas, Center for Research in Engineering Science, September 1964. 63. Sharp, R. R., “The Nature of Liquid Film Evaporation During Nucleate Boiling,” NASA TND-1997, Oct. 1964. 64. 潘欽，「沸騰熱傳與雙相流」，國立編譯館，俊傑書局，民國九十年六月（2001）。 65. Renk, F., Wayner, P.C., 1979, “An Evaporating Ethanol Meniscus Part I：Experimental Studies,”; “An Evaporating Ethanol Meniscus Part II：Analytical Studies,” ASME Journal of Heat Transfer, Vol. 101, pp.55-62 66. Mizamoghadam, A. and Catton, I., 1988, “A Physical Model of the Evaporating Meniscus,” ASME Journal of Heat Transfer, Vol. 101, pp.201-207 67. Schonberg, J. A. and Wayner, P. C., 1992, “Analytical Solution for the Integral Contact Line Evaporative Heat Sink,” Journal of Thermophysics, Vol. 6, pp. 128-134 68. DasGupta, S., Schonberg, J. A., and Wayner, P. C.,1993, “Investigation of an Evaporating Extended Menisus Based on the Augmneted Young-Laplace Equation,” ASME Journal of Heat Transfer, Vol. 115, pp. 201-208 69. Chi, S.W., “Heat Pipe Theory and Practice”, McGraw-Hill, New York, 1976. 70. Lee, S., “Calculating Spreading Resistance in Heat Sink, Electronics Cooling”, Vol.4, No.1, pp.30-33, January 1998. 71. Cengel, Y.A., “Heat Transfer A Practical Approach”, pp.177-192, 350-363, 1998. 72. Yeh, L.T. and Chu, R.C., “Thermal Management of Microelectronic Equipment,” ASME Press Book Series on Electronic Packaging, New York, 2002. 73. 張顥瀚，「迴路式熱虹吸蒸氣腔體之研究」，碩士論文，國立臺灣大學機械工程學研究所，民國九十三年六月（2004）。 74. Farber, E. A. and Scorah, E. L., 'Heat Transfer to Water Boiling under Pressure,' Trans. ASME, Vol. 70, pp. 369, 1948. E. A. Farber and E. L. Scorah, 'Heat Transfer to Water Boiling under Pressure,' Trans. ASME, Vol. 70, pp. 369, 1948. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/36037 | - |
| dc.description.abstract | 隨著電子產業的發展，電子產品不斷朝高性能、小尺寸方向邁進，伴隨而來的問題則是電子產品發熱量日趨愈高，傳統散熱方式已無法滿足未來高功率電子元件需求，有鑑於此；本研究藉由微結構蒸氣腔體，並以水做為工作流體，藉由工作流體於蒸氣腔體內沸騰(蒸發)與冷凝的兩相熱傳機制，而達到快速傳遞熱量的目的。本研究首先以實驗量測與理論分析方式進行微結構蒸氣腔體熱傳性能研究，接著並針對微結構蒸氣腔體於各種不同之應用進行討論與分析。研究結果發現；四種不同沸騰表面(光滑、蝕刻、溝槽與燒結表面)，燒結板於填充量15%時：有最佳性能表現，且此時是以薄膜蒸發之熱傳機制進行熱傳遞，其餘沸騰表面之性能表現依序為溝槽、蝕刻與光滑平板。接著並以O’Neill所建立的理論，預測燒結板之沸騰熱傳係數，研究結果發現，理論與實驗值有相當吻合之趨勢，但在最佳填充量下，理論與實驗值有較大之誤差，探討其原因為燒結板在最佳填充量下之熱傳機制為薄膜蒸發，而O’Neill的理論為針對核沸騰熱傳機制所建立。最後則是針對毛細結構進行毛細極限實驗，並藉由實驗結果得到毛細結構之孔隙率(ε)、有效半徑（reff）與滲透度(K)。最後則是將微結構蒸氣腔體應用於各種不同之領域，包含了電子熱傳、LED散熱與PCB鑽孔機散熱系統之應用。於電子熱傳應用上，研究發現；微結構蒸氣腔體等效熱傳係數最大可達到銅的1.6倍，且均溫性較銅表現優異。於LED燈散熱應用上，研究發現；藉由蒸氣腔體優異的均溫性，的確可減少溫度集中現象，並使鋁基板的溫度維持在45℃。最後則是以微結構蒸氣腔體製作成一熱交換模組，並應用於PCB鑽孔機散熱系統，研究結果顯示，藉由此熱交換器模組可有效的回收冷卻空氣之能量，以減少系統所需冷凍能力，達到節約能源目的。 | zh_TW |
| dc.description.abstract | With the advance of the electronics industry, electronic products are getting higher performance and smaller size themselves. What happens is that the heat is generated accordingly. Traditional heat dissipation method can’t be satisfied the need of high-power electronic components. Therefore, this research makes use of the Vapor Chamber and with the water as the working fluid to transmit the heat; with the mechanism of Boiling (evaporation) and Condense of the working fluid in the Vapor Chamber to achieve the goal of rapid heat transmission.
The research starts from the experimental measurement and the theoretical analysis of the heat transmission capability of the Vapor Chamber to the various applications of the Vapor Chamber. The result of the research on four different boiling surfaces, flat surface, grooved surface, etched surface, and sintered surface, it is discovered that sintered surface outperform the other three surfaces. The etched surface is second, the grooved surface is third, and the flat surface is the last. The sintered surface achieves the best performance while the fill ratio is 15%. And in the meanwhile its mechanism of the heat transmission is the Film Evaporation. Then O’Neill’s theory is used to predict the Boiling heat transfer coefficient while the sintered surface is used. The result of the research matches the theory and the experiment. However, under best fill ratio, there is a serious deviation between the theory and the experiment. The reason is that under best fill ratio the heat transfer mechanism of the sintered board is Film Evaporation while the heat transfer mechanism of O’Neill’s theory is for nucleate boiling heat transfer mechanism. Finally, we test the Capillary Limit on the sintered board. With this experiment, we get to know about the effective pore radius (reff) and permeability (k). Regarding to the applications, different applications of the Vapor Chamber are studied. In the respect of the electronic heat transfer application, effective thermal conductivity of the Vapor Chamber can be as 1.6 times high as copper and uniform temperature of the top and under surfaces of the Vapor Chamber outperform that of copper. In the respect of the LED heat dissipation application, because of the excellent uniform temperature of the Vapor Chamber, it did reduce the phenomenon of the thermal centralization and make the temperature of the aluminum board maintain at 45℃. Finally the Vapor Chambers are used in a heat exchange module and applied to the cooling system of the PCB driller. With the heat exchange module, the heat can be efficiently exchanged so as to reduce the power consumption of the cooling system and the energy conservation purpose can be also achieved. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-13T07:50:08Z (GMT). No. of bitstreams: 1 ntu-94-D90522022-1.pdf: 4784829 bytes, checksum: 4a3df0ba842d2f869a62854c208f117d (MD5) Previous issue date: 2005 | en |
| dc.description.tableofcontents | 目錄
摘要 I ABSTRACT II 目錄 III 圖目錄 V 表目錄 X 符號說明 XI 第一章 緒 論 1 1-1 前言 1 1-2 文獻回顧 2 1-3 研究動機與目的 7 1-4 研究方法 9 第二章 微結構蒸氣腔體介紹 11 2-1 前言 11 2-2 微結構蒸氣腔體工作原理 12 2-3 微結構蒸氣腔體操作極限 14 第三章 微結構蒸氣腔體熱傳性能之研究 18 3-1 前言 18 3-2 理論模式 20 3-3 實驗設備建立 24 3-4 結果與討論 31 第四章 微結構蒸氣腔體毛細性能之研究 52 4-1 前言 52 4-2 理論模式 53 4-3 實驗設備建立 60 4-4 結果與討論 63 第五章 微結構蒸氣腔體於電子熱傳之應用 70 5.1 前言 70 5-2 熱阻理論模式建立 70 5-3 實驗與量測設備建立 77 5-4 研究方法 82 5-5 結果與討論 86 第六章 微結構蒸氣腔體於LED燈散熱之應用 108 6-1 前言 108 6-2 熱阻分析模式建立 110 6-3 實驗與量測設備建立 112 6-4 結果與討論 115 第七章 微結構蒸氣腔體於PCB鑽孔機散熱之應用 125 7-1 前言 125 7-2 理論模式與量測系統建立 128 7-3 實驗量測結果與分析 131 第八章 結論與建議 157 8-1 結論 157 8-2 建議 158 8-3 本研究達成之目標 159 參考文獻 160 附錄A 量測誤差分析 169 圖目錄 圖2-1 不同尺寸之發熱源造成局部溫度上升的現象 16 圖2-2 不同位置之發熱源造成局部溫度上升的現象 16 圖2-3 蒸氣腔體工作原理示意圖 17 圖3-1 氣泡形成示意圖 37 圖3-2 燒結基體示意圖 37 圖3-3 正方體排列示意圖 37 圖3-4 蒸發腔體示意圖 38 圖3-5 電熱管基本構造圖 38 圖3-6 模擬加熱源 39 圖3-7 冷凝器示意圖 39 圖3-8 風扇與熱交換裝置 40 圖3-9 實驗量測系統實體圖 40 圖3-10 切削溝槽板示意圖 41 圖3-11 蝕刻板示意圖 41 圖3-12 燒結板示意圖 42 圖3-13 燒結表面結構圖 42 圖3-14 平板於各填充量下沸騰曲線圖 43 圖3-15 溝槽板於各填充量下沸騰曲線圖 43 圖3-16 蝕刻板於各填充量下沸騰曲線圖 44 圖3-17 燒結板於各填充量下沸騰曲線圖 44 圖3-18 微液膜示意圖 45 圖3-19 微液膜蒸發時溫度的快速變化 45 圖3-20 氣泡沸騰過程 46 圖3-21 毛細結構內之微液膜蒸發示意圖 46 圖3-22 各沸騰表面於最佳充填量之比較 47 圖3-23 燒結板實驗與理論值比較 47 圖3-24 光滑平板於220秒時可視化圖 48 圖3-25 光滑平板於330秒時可視化圖 48 圖3-26 光滑平板於460秒時可視化圖 49 圖3-27 切削溝槽板於330秒時可視化圖 49 圖3-28 蝕刻板於330秒時可視化圖 50 圖3-29 燒結板於220秒時可視化圖 50 圖3-30 燒結板於300秒時可視化圖 51 圖3-31 燒結板於380秒時可視化圖 51 圖4-1 量測實體圖 67 圖5-1 穩態時一維方向之溫度梯度 92 圖5-2 蒸氣腔體熱阻模型圖 92 圖5-3 實驗分析之溫度量測點與各定義熱阻 93 圖5-4 熱源大小對於熱沈溫度分佈的關係示意圖 93 圖5-5 風扇與熱沈配置圖 94 圖5-6 熱沈相關參數示意圖 94 圖5-7 實驗設備整體圖 95 圖5-8 微結構蒸氣腔體模型圖 95 圖5-9 蒸氣腔體內部構造 96 圖5-10 銅粉末之樹枝狀微結構 96 圖5-11 量測系統示意圖 97 圖5-12 填充量5%時加熱功率與各熱阻關係圖 97 圖5-13 填充量10%時加熱功率與各熱阻關係圖 98 圖5-14 填充量20%時加熱功率與各熱阻關係圖 98 圖5-15 填充量30%時加熱功率與各熱阻關係圖 99 圖5-16 填充量40%時加熱功率與各熱阻關係圖 99 圖5-17 填充量50%時加熱功率與各熱阻關係圖 100 圖5-18 各填充量下加熱功率與介面熱阻關係圖 100 圖5-19 各填充量下加熱功率與介面熱阻關係圖 101 圖5-20 各填充量下加熱功率與對流熱阻關係圖 101 圖5-21 各填充量下加熱功率與蒸汽腔體熱阻關係圖 102 圖5-22 各填充量下加熱功率與蒸汽腔體熱阻關係圖 102 圖5-23 各填充量下加熱功率與總熱阻之關係 103 圖5-24各填充下加熱功率與總熱阻之關係 103 圖5-25 不同發熱源面積下加熱功率與蒸氣腔體熱阻圖 104 圖5-26 各加熱功率下蒸氣腔體下表面溫度分佈圖 104 圖5-27 各加熱功率下蒸氣腔體上表面溫度分佈圖 105 圖5-28 各加熱功率下銅板下表面溫度分佈圖 105 圖5-29 各加熱功率下銅板上表面溫度分佈圖 106 圖5-30 單位面積熱通量下Sv/SCu之關係圖 106 圖5-31 加熱功率影響蒸氣腔體內部工作流體相變化示意圖 107 圖5-32 池核沸騰曲線 107 圖6-1 LED燈熱傳遞方式 117 圖6-2 LED燈溫度定義圖 117 圖6-3 熱阻示意圖 118 圖6-4 實驗設備圖 118 圖6-5 LED燈組合示意圖 119 圖6-6 LED實體圖 119 圖6-7 微結構蒸氣腔體示意圖 119 圖6-8 LED燈溫度量測圖 120 圖6-9 LED燈量測實體圖 120 圖6-10 不同空氣對流係數與鰭片面積下 溫度圖(Rj_b=12℃/W) 121 圖6-11 不同封裝熱阻與鰭片面積下 溫度圖(h=15 W/m2 K) 121 圖6-12 不同空氣對流係數與鰭片面積下 溫度圖(Rj_b=12℃/W) 122 圖6-13 不同使用情況下Rb_a圖 123 圖6-14 不同角度下 溫度圖 123 圖6-15 蒸氣腔體上板溫度分佈 124 圖6-16 銅板上板溫度分佈 124 圖7-1 現行PCB鑽孔機之冷卻方法示意圖 143 圖7-2 PCB鑽孔機量測系統圖 143 圖7-3 PCB鑽孔機量測系統實體圖 144 圖7-4 冷卻水流量20LPM時冷卻水進出Chiller溫度圖 144 圖7-5 冷卻水流量20LPM時冷卻水進出轉軸溫度圖 145 圖7-6 冷卻水流量20LPM時冷卻水進出馬達溫度圖 145 圖7-7 冷卻水流量20LPM時冷卻空氣進出轉軸溫度圖 146 圖7-8 冷卻水流量20LPM時冷卻空氣進出Dryer溫度圖 146 圖7-9 冷卻水流量改變時冷卻水進出Chiller溫度圖 147 圖7-10 冷卻水流量改變時冷卻水進出Chiller溫差圖 147 圖7-11 冷卻水流量改變時冷卻水進出轉軸溫度圖 148 圖7-12 冷卻水流量改變時冷卻水進出轉軸溫差圖 148 圖7-13 冷卻水流量改變時冷卻水進出線性馬達溫度圖 149 圖7-14 冷卻水流量改變時冷卻水進出線性馬達溫差圖 149 圖7-15 冷卻水流量改變時冷卻空氣進出轉軸溫度圖 150 圖7-16 冷卻水流量改變時冷卻空氣進出轉軸溫差圖 150 圖7-17 冷卻水流量改變時冷卻空氣進出Dryer溫度圖 151 圖7-18 冷卻水流量改變時冷卻空氣進出Dryer溫差圖 151 圖7-19 冷卻水流量改變時轉軸溫度圖 152 圖7-20 蒸氣腔體熱交換模組示意圖 152 圖7-21 蒸氣腔體熱交換模組尺寸圖 153 圖7-23 改善後冷卻系統圖 154 圖7-24 改善後冷卻系統圖 155 圖7-25 冷卻水流量20LPM時冷卻水進出新系統溫度圖 155 圖7-26 冷卻水流量20LPM時冷卻水流出新舊系統溫度圖 156 表目錄 表4-1 毛細結構參數 67 表4-2 毛細結構有效半徑 68 表4-3 毛細結構之滲透度 68 表4-4 實驗值與理論值之比較 69 表5-1微結構蒸氣腔體實驗的量測點 91 表5-2常見接觸界面之界面熱阻 91 表6-1 各實驗參數下之量測溫度 122 表7-1 量測參數設定 141 表7-2 流量改變時Chiller每次運轉與停機時間 141 表7-3 流量改變時冷卻系統帶走之總熱量 142 表7-4 改善前後冷卻系統規格 154 表7-5 新舊系統節約能源效益分析 156 | |
| dc.language.iso | zh-TW | |
| dc.subject | 微結構蒸氣腔體 | zh_TW |
| dc.subject | LED | zh_TW |
| dc.subject | 薄膜蒸發 | zh_TW |
| dc.subject | 沸騰表面 | zh_TW |
| dc.subject | Boiling Surfaces | en |
| dc.subject | Micro Structure Vapor Chamber | en |
| dc.subject | Film Evaporation | en |
| dc.subject | LED | en |
| dc.title | 微結構蒸氣腔體之研究與電子散熱應用 | zh_TW |
| dc.title | Study of Micro Structure Vapor Chamber and Its Application in Electronic Cooling | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 93-2 | |
| dc.description.degree | 博士 | |
| dc.contributor.oralexamcommittee | 洪俊卿,蘇俊傑,李雨,吳文方,馬小康 | |
| dc.subject.keyword | 微結構蒸氣腔體,沸騰表面,薄膜蒸發,LED, | zh_TW |
| dc.subject.keyword | Micro Structure Vapor Chamber,Boiling Surfaces,Film Evaporation,LED, | en |
| dc.relation.page | 170 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2005-07-26 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
| 顯示於系所單位： | 機械工程學系 | |
文件中的檔案：
| 檔案 | 大小 | 格式 | |
|---|---|---|---|
| ntu-94-1.pdf 未授權公開取用 | 4.67 MB | Adobe PDF |
系統中的文件，除了特別指名其著作權條款之外，均受到著作權保護，並且保留所有的權利。