Please use this identifier to cite or link to this item:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/35789Full metadata record
| ???org.dspace.app.webui.jsptag.ItemTag.dcfield??? | Value | Language |
|---|---|---|
| dc.contributor.advisor | 陳立仁 | |
| dc.contributor.author | Guo-Lung Luo | en |
| dc.contributor.author | 羅國隆 | zh_TW |
| dc.date.accessioned | 2021-06-13T07:10:13Z | - |
| dc.date.available | 2005-07-30 | |
| dc.date.copyright | 2005-07-30 | |
| dc.date.issued | 2005 | |
| dc.date.submitted | 2005-07-26 | |
| dc.identifier.citation | 1. http:www.toppoly.com
2.松本正一，角田市良合著，劉瑞祥譯，液晶之基礎與應用，國立編譯館， 2000. 3. Xia, Y.; Whitesides, G. M., Angew. Chem. Int. Ed., 37, 550, 1998. 4. Huang, Z.; Wang, P. C.; MacDiarmid, A. G.; Xia, Y.; Whitesides, G.M., Langmuir, 113, 6480, 1997. 5. Hidber, P.W.; Helbig, E.; Whitesides, G. M., US Patent No. 6,060,121, 2000. 6. Murarka, S. P.; Gutmann, R. J.; Kaloyeros, A. E.; Lanford, W.A., Thin Solid Films, 236, 257, 1993. 7. 尤志州,碩士學位論文,半導體製程之無電極鍍銅成長晶種層特性研究,國立台灣大學化學工程研究所。 8. Pompe, T.; Herminghaus, S., Langmuir, 15, 2398, 1999. 9. Geissler, M.; Bernard, A.; Bietsch, A.; Schmid, H.; Michel, B.; Delamarche, E. J., Am. Chem.Soc., 122, 6303, 2000. 10. Xia, Y.; Whitesides, G. M., Langmuir, 13, 2059, 1995. 11. Delamarche, E.; Michel, B.; Biebuyck, H. A.; Gerber, C., Adv. Mater,, 8, 719, 1996. 12. Ulman, A., Chem. Rev., 96, 1533, 1996. 13. Ulman, A., “An Introduction to Ultrathin Organic Films”, Academic Press, San Diego, 1991. 14. Libioulle, L.; Bietsch, A.; Schmid, H., Langmuir, 15, 300, 1999. 15. Koura, N., chapter17 in “Electroless plating: fundamentals and applications”, Mallory, G. O.; Hajdu, J. B. editors, American Electroplaters and Surface Finishers Society, Orlando, 1990. 16. Rieger, P. H., Electrochemistry, Chapman & Hall, New York, 1993. 17. Dubin, V. M.; Shacham-Diamand, Y., J.Electrochem. Soc., 144, 898, 1997. 18. Murarka, S. P.; Gutmann, R. J.; Kaloyeros, A. E.; Lanford, W.A., Thin Solid Films 236, 257, 1993. 19. Straus, M., US Patent No. 5,387,332, 2000. 20. 謝重仁,碩士學位論文,鈀金屬奈米粒子應用於印刷電路板無電鍍金屬層,國立清華大學化學工程研究所 21. Schnur, J. M.; Schoen, P. E.; Peckerar, M. C.; Marrian, C. R. K.; Calvert, J. M.; Georger, Jr.; Jacque, H., US Patent No. 5,079,600, 1992. 22. Andry, P. S.; Flake, J. C.; Michel, B.; Tsujimura, T., US Patent No. 6,767,828, 2003. 23. Das, B.; Swisher, R. G., US Patent No. 5,264,288, 1992. 24. Weber, L.; Brinz, T.; Eisele, U.; Kling, D., US Patent No. 6,274,241, 2001. 25.莊達人，錫鈀膠體(Ⅱ)，電路板資訊，第十七期，P46.，1989. 26. Shacham - Diamand, Y.; Dubin, V. M., Microelectronic Engineering 33, 47, 1997. 27. Dubin, V. M.; Shacham-Diamand, Y.; Ting, C. H.; Zhao, B.; Vasudev, P. K., US Patent No. 5,891,513, 1999. 28. H. T. Ng; S. F. Y. Li; L. Chan; F. C. Loh; K. L. Tan, J.Electrochem.Soc.,145, 3301, 1998. 29. Dubin, V. M.; Shacham-Diamand, Y.; Angyal, M., Thin Solid Film, 262, 93, 1995. 30. 洪愛娜，化學鍍銅簡介，電路板會刊第十期，2000. 31. Charles, Q.; Buckwalter, Jr., US Patent No. 4,285,992, 1981. 32. Bahls, H., US Patent No. 3,983,266, 1976. 33. Sivertz, C.; Soltys, J. F., US Patent No. 3,776,740, 1976. 34. Aonuma, H., US Patent No. 6,398,854, 2002. 35. Endo, M.; Kawaguchi, A.; Nishio, M.; Hashimoto, S., US Patent No. 5,645,628, 1997. 36. Laroche, P.; Boulanger, P.; Dauby, C., US Patent No. 6749307, 2004. 37. Joshi, N.H., US Patent No. 6645557, 2003. 38. Liu, Z. C.; He, Q. G.; Xiao, P. F.; Lu, Z. H., Materials Chemistry and Physics, 82, 301, 2003. 39. Hao T.; Li Z., Electrochimica Acta 48, 2473, 2003. 40. Xia, Y., Langmuir, 14, 363, 1998. 41. Khang, D.Y.; Lee, H. H., Langmuir, 20, 2445, 2003. 42. Marzolin, C.; Smith, S. P.; Prentiss, M.; Whitesides, G. M., Adv. Mater., 10, 571, 1998. 43. Wasserman, S. R.; Whitesides, G. M.; Tidswell, I. M.; Ocko, B. M.; Pershan, P. S.; Axe, J. D., J. Am. Chem. Soc., 111, 5852, 1989. 44. Shipley, C. R., US Patent No. 3,011,920, 1961. 45. Shipley, C. R.; Gulla, M., US Patent No. 3,562,038, 1971. 46. Delamarche, E.; Donzel, C.; Kamounah, F. S.; Wolf, H.; Geissler, M.; Stutz, R.; Schmidt-Winkel, P.; Michel, B.; Schaumburg, K., Langmuir, 19, 8749, 2003. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/35789 | - |
| dc.description.abstract | 摘要
在印刷電路板產業中，使用化學電鍍沈積法進行銅導線製備，已廣泛被採用。本研究計畫擬在玻璃基材上運用微觸印刷技術製備化學鍍沈積法所需之種晶層，再進行化學鍍沈積法在玻璃基板上獲得微米級的金屬圖案，目前已可成功的使用化學電鍍沈積法製作線寬2微米的銅圖案和線寬0.8微米的銀圖案。未來希望能改善電鍍液和金屬鍍層的品質並進一步的縮小金屬導線的線寬。此外我們使用壓印與溶膠凝膠法製作可控制粗糙度的玻璃表面以探討粗糙度對化學電鍍銅層黏著性的影響。 | zh_TW |
| dc.description.abstract | ABSTRACT
Autocatalytic electroless copper plating is widely applied in the printed circuit board industry. In this study, the micro-contact printing technique is applied to directly fabricate the seeding layer for electroless deposition on glass substrate. Now, we can successfully fabricate copper pattern with feature size 10µm lines and separated by 10µm on glass substrate by micro - contact printing, and silver pattern with feature size 0.8µm lines and separated by 0.8µm on glass substrate. We also use the methods of soft embossing and sol-gel to fabricate glass substrate with specific roughness which could be controlled and discuss the relations between roughness of glass substrate and the adhesion of copper layer. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-13T07:10:13Z (GMT). No. of bitstreams: 1 ntu-94-R92524021-1.pdf: 5447352 bytes, checksum: 8e927d495543460c0f05a9789fd06472 (MD5) Previous issue date: 2005 | en |
| dc.description.tableofcontents | 目錄
中文摘要………………………………………………………… I 英文摘要………………………………………………………II 目錄……………………………………………………………… III 表目錄………………………………………………………… ……….V 圖目錄…………………………………………………………………VII 第一章 緒論…………………………………………………………….1 第二章 文獻回顧.………………………………………………………6 1.微觸印刷………………………………………………………….. .6 2.化學鍍沈積法……………………………………………………….12 3.使用微觸印刷與化學鍍製作金屬圖案…………………………...19 4.使用溶膠凝膠法(sol-gel)製作具有粗糙度的表面……………..20 第三章 實驗部分……………………………………………………..35 1.藥品器材…………………………………………………………….35 2.實驗設備…………………………………………………………….36 3.實驗步驟…………………………………………………………….38 4.表面分析技術……………………………………………………….49 第四章 結果與討論……………………………………………………57 化學鍍銅……………………………………………………………...57 基材表面粗糙度對化學鍍銅層的黏著性影響……………………...63 化學鍍銀……………………………………………………………...64 第五章 結論與未來工作…………………………………………….101 參考文獻……………………………………………………………..105 | |
| dc.language.iso | zh-TW | |
| dc.subject | 微觸印刷 | zh_TW |
| dc.subject | 化學鍍 | zh_TW |
| dc.subject | 種晶層 | zh_TW |
| dc.subject | 壓印 | zh_TW |
| dc.subject | 溶膠凝膠法 | zh_TW |
| dc.subject | sol- gel | en |
| dc.subject | microcontact printing | en |
| dc.subject | electroless deposition | en |
| dc.subject | seeding layer | en |
| dc.subject | masking layer | en |
| dc.subject | molding | en |
| dc.title | 使用化學鍍與微觸印刷法製作微米級金屬圖案 | zh_TW |
| dc.title | Application of Microcontact Printing to the Electroless Plating for the Fabrication of Microscale Metal Patterns | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 93-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 顏溪成,黃炳照,尹庚鳴 | |
| dc.subject.keyword | 化學鍍,微觸印刷,種晶層,壓印,溶膠凝膠法, | zh_TW |
| dc.subject.keyword | microcontact printing,electroless deposition,seeding layer,masking layer,molding,,sol- gel, | en |
| dc.relation.page | 108 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2005-07-27 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 化學工程學研究所 | zh_TW |
| Appears in Collections: | 化學工程學系 | |
Files in This Item:
| File | Size | Format | |
|---|---|---|---|
| ntu-94-1.pdf Restricted Access | 5.32 MB | Adobe PDF |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.