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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 廖英志(Ying-Chih Liao) | |
| dc.contributor.author | Ying-Han Hung | en |
| dc.contributor.author | 洪英瀚 | zh_TW |
| dc.date.accessioned | 2021-06-13T06:36:01Z | - |
| dc.date.available | 2021-12-31 | |
| dc.date.copyright | 2011-07-29 | |
| dc.date.issued | 2011 | |
| dc.date.submitted | 2011-07-25 | |
| dc.identifier.citation | 1. 劉致中, 林國權, 王世杰, 葉仰哲, 新興印刷電子特用材料與化學品商機探索 : New opportunities for the printed electronics materials and chemicals, 2010, 工業技術研究院產業經濟與趨勢研究中心: 新竹縣竹東鎮.
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Fluids 16, 3438 (2004)]. Physics Of Fluids, 2009. 21(2): p. 1-3. 29. Fujimoto, H., T. Ogino, H. Takuda, N. Hatta, Collision of a droplet with a hemispherical static droplet on a solid. International Journal Of Multiphase Flow, 2001. 27(7): p. 1227-1245. 30. Pan, K.-L., P.-C. Chou, Y.-J. Tseng, Binary droplet collision at high Weber number. Physical Review E, 2009. 80(3): p. 1-8. 31. van Hinsberg, N.P., M. Budakli, S. Goehler, E. Berberovic, I.V. Roisman, T. Gambaryan-Roisman, C. Tropea, P. Stephan, Dynamics of the cavity and the surface film for impingements of single drops on liquid films of various thicknesses. Journal Of Colloid And Interface Science, 2010. 350(1): p. 336-343. 32. Yarin, A., Drop impact dynamics: Splashing, spreading, receding, bouncing. Annual Review Of Fluid Mechanics, 2006. 38: p. 159-192. 33. Moreira, A.L.N., A.S. Moita, M.R. Panao, Advances and challenges in explaining fuel spray impingement: How much of single droplet impact research is useful? 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Journal Of The Electrochemical Society, 2007. 154(4): p. D273-D276. 41. Koura, N., Electroless Plating of Silver, in Electroless Plating: Fundamentals and Applications, G.O. Mallory and J.B. Hajdu, Editors. 1990, William Andrew Publishing/Noyes. p. 441-462. 42. Richmond, H.H., G.S. Myers, G.F. Wright, The Reaction between Formaldehyde and Ammonia. Journal of the American Chemical Society, 1948. 70(11): p. 3659-3664. 43. Duineveld, P., The stability of ink-jet printed lines of liquid with zero receding contact angle on a homogeneous substrate. Journal Of Fluid Mechanics, 2003. 477: p. 175-200. 44. Kang, B.J., J.H. Oh, Geometrical characterization of inkjet-printed conductive lines of nanosilver suspensions on a polymer substrate. Thin Solid Films, 2010. 518(10): p. 2890-2896. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/34874 | - |
| dc.description.abstract | 噴墨印刷技術製作電子元件具有節省原料、使用可撓曲基材、易於放大面積、非接觸式、不需開模等特性,有相當潛力應用於電子產業。
金屬導線為電子元件中最基本的部份。噴墨製作金屬導線一般需要經200°C、 30分鐘以上的燒結過程,才可使其電阻率降至均相銀的三倍左右。高溫除了限制 基材的選擇,也使其無法配合不可加熱的應用。 以無電鍍銀為基礎的反應式噴墨銀可能為此問題的解決辦法。本研究以銀氨溶 液和甲醛溶液為材料,發展雙噴頭反應式噴墨製作銀導線之技術。 研究分為兩部份,我們先以計算流體力學軟體FLOW3D模擬不同之雙噴頭噴 法,評估於30°、45°、60°之斜向碰撞和撞擊液膜等過程中反應物溶液的混合 效果。我們發現於不論採取何種碰撞方式,均無助於反應物溶液混合。但碰撞後 所形成之反應物濃度分佈,使得撞擊液膜方式之後續擴散混合效果較斜向碰撞高 出一個數量級。此外,於過程中我們也發現斜向碰撞會生成非圓形的液體形狀, 可能有助於提升導線之平整性。 之後我們以MicroFab JetLab 4機台實際進行噴墨程序,探討墨水組成、甲醛 和銀氨溶液的噴墨先後次序、點距與噴法、清洗、烘烤溫度對噴墨程序的影響。 我們發現銀氨溶液的氨水含量應盡量降低以利於機台操作,先噴甲醛再噴銀氨溶 液會有較多的銀生成,噴墨後清洗可去除不純雜質。我們以點距25 μm,交錯陣 列的噴墨方式製作出長1 cm,寬250 μm,厚約200 nm的銀導線。於70、100、 150°C烘烤下,其電阻率為均相銀之15至8.7倍。 | zh_TW |
| dc.description.provenance | Made available in DSpace on 2021-06-13T06:36:01Z (GMT). No. of bitstreams: 1 ntu-100-R98524075-1.pdf: 11014680 bytes, checksum: 8e19b922bb9f61d0989311641495e468 (MD5) Previous issue date: 2011 | en |
| dc.description.tableofcontents | 口試委員審定書 ........................................................................... i
誌謝 ......................................................................................... ii 摘要 ........................................................................................ iii 英文摘要 .................................................................................. iv 目錄 ........................................................................................ vi 圖目錄 .................................................................................... vii 表目錄 ..................................................................................... ix 第１章 緒論 ............................................................................. 1 第２章 文獻回顧 ....................................................................... 8 第１節 噴墨技術 ............................................................................. 8 第２節 噴墨導線電極 ...................................................................... 13 第３節 反應式噴墨 ......................................................................... 16 第４節 液滴碰撞 ............................................................................ 16 第３章 數值模擬 ..................................................................... 22 第１節 流體力學 ............................................................................ 22 第２節 質量傳遞 ............................................................................ 24 第３節 化學反應 ............................................................................ 26 第４節 數值方法 ............................................................................ 28 第５節 參數設定 ............................................................................ 28 第６節 結果討論 ............................................................................ 33 第４章 雙噴頭噴墨製作銀導線 ................................................... 45 第１節 反應原理 ............................................................................ 45 第２節 材料與設備 ......................................................................... 46 第３節 噴墨製程 ............................................................................ 54 第４節 結果討論 ............................................................................ 55 第５章 結論 ........................................................................... 76 參考文獻 ................................................................................. 77 | |
| dc.language.iso | zh-TW | |
| dc.title | 化學還原法製作銀導線之雙噴頭噴墨製程 | zh_TW |
| dc.title | Dual-Channel Inkjet Printed Conductive Silver Lines via Chemical Reduction Method | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 99-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 徐振哲(Cheng-Che Hsu),盧彥文(Yen-Wen Lu) | |
| dc.subject.keyword | 印刷電子,無電鍍,金屬化,液滴撞擊,計算流體力學, | zh_TW |
| dc.subject.keyword | Printed Electronics,Electroless Plating,Metallization,Drop impact,CFD, | en |
| dc.relation.page | 82 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2011-07-25 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 化學工程學研究所 | zh_TW |
| 顯示於系所單位： | 化學工程學系 | |
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