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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 楊申語 | |
dc.contributor.author | Tsung-Fu Yao | en |
dc.contributor.author | 姚宗甫 | zh_TW |
dc.date.accessioned | 2021-06-13T06:09:48Z | - |
dc.date.available | 2011-08-02 | |
dc.date.copyright | 2011-08-02 | |
dc.date.issued | 2011 | |
dc.date.submitted | 2011-07-25 | |
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[49] Tsung-Fu Yao, Ping-Han Wub, Tzong-Ming Wub, Chung-Wei Cheng, Sen-Yeu Yang, “Fabrication of anti-reflective structures using hot embossing with a stainless steel template irradiated by femtosecond laser”, Microelectronic Engineering, Uncorrected proofs. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/34462 | - |
dc.description.abstract | 由於塑膠質輕、成本低及成型易等優點,是應用於檢測晶片微元件最佳材料。在微晶片製造中,封裝技術關係到保護內部結構與流道的密封性,是關鍵技術。
先前研究發現利用二氧化碳滲入PMMA表面,在玻璃轉折溫度(Tg)之下即可進行低溫接合。本研究為了提升接合強度,在PMMA材料表面製作奈米孔洞結構,以增加二氧化碳滲入與接合接觸面積,使PMMA接合介面間在分子擴散糾纏及結構嵌合的雙重作用下,提升接合強度。本研究實驗結果證實有表面奈米孔洞結構之PMMA薄膜,二氧化碳輔助接合強度提升至1.22 MPa,遠比無奈米結構接合的800 kPa為強。 本研究比較將相同尺寸的奈米孔洞或奈米圓柱製作於待接合之PMMA一面對二氧化碳輔助接合強度的優勢,發現奈米圓柱效果沒有奈米孔洞好,原因是在二氧化碳滲入後,全根奈米圓柱皆軟化,後續接合時受壓塌陷而無法提供結構嵌合效果,因此接合強度比有奈米孔洞結構者差。本研究也以飛秒雷射技術製作微米尺寸微結構,並探討該微結構用於PMMA接合效果,結果顯示當表面結構尺寸達微米級大小時效果不好,因基材中受二氧化碳滲入軟化的深度僅至奈米級,輕化塑料無法深入至微米級微結構深處,使介面間材料接觸面積過低,接合強度大幅遜於奈米結構。 本研究也探討奈米結構二氧化碳輔助熱融接合應用至PC與PMMA異質材料之接合。本研究先在PC表面製作奈米圓柱,二氧化碳滲入後,後續在低於PMMA Tg之溫度下受壓接合時,此結構深入PMMA軟化層中,PC奈米圓柱與PMMA藉分子擴散與結構嵌合提升接合強度。PC與PMMA間異質材料的接合強度也達1.20 MPa,遠比無奈米結構接合PC/PMMA的接合強度400 kPa為強,顯示以表面奈米結構於二氧化碳輔助熱融接合製程對提升接合強度的效果。 | zh_TW |
dc.description.abstract | Through the multi advantages of light weight, low cost, and easy-to-manufacture, plastic material has become a widely-used engineering material. Plastic material has been used for micro-fluidic devices. In the manufacture of micro-fluidic devices, bonding and packaging is critical for sealing of the devices and protecting the microstructures.
This research focuses on enhansing the bonding strength of PMMAs by carbon-dioxide-assisted below-Tg thermal fusion bonding process. In this study, surface nano-pore will be pre-made on one of the PMMA before CO2-assisted thermal fusion bonding. Experimental results show that the bonding strength between PMMAs achieve 1.22MPa; it is much higher than that between plain PMMAs, which is 800 kPa. Due to the nano-pore structures, there will more contact areas, more mutual molecular chain diffusion and structure inter lock after bonding. This research also investigates the effect of nano-pillar and nano-pore structures on bonding strength. Experimental results show that the bonding strength of PMMAs with nano-pillar structures on PMMA surface is inferior to that of PMMAs with nano-pore structures after carbon-dioxide-assisted bonding fusion. By the influence of CO2, the whole nano-sized pillars had been softened and collapsed under holding pressure. They fail to provide the effect of inter-lock at the interface, resulting in inferior bonding strength. As far as the effect of all micro-sized structures on the bonding, this research also used femtosecond laser to fabricate the micro structures, and then applied the microstructure to PMMA bonding process. The experiment showed inferior results either. When structures’ size comes to micro order, the PMMAs will not be able to be in conform contact and inter-lock because the softened CO2 layer is just nanometer deep. Finally, the nanostructure inter-lock concept has also been applied to heterogeneous material bonding in this study. The research attempts to bond the two kinds of plastic, PC and PMMA, using CO2-assisted thermal fusion bonding. Results show that a bonding strength of 1.20 MPa can be achieved with nano-pillar structures on the PC, utilizing the higher material strength of PC to plug in the softened layer of PMMA surface. This research has proven that well-planed nanostructures enhance the bonding strengths of PMMAs and PMMA/PC using CO2-assisted below-Tg thermal fusion bonding. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T06:09:48Z (GMT). No. of bitstreams: 1 ntu-100-R98522737-1.pdf: 11228706 bytes, checksum: 7d9e9cac2e6f4672574bccc1e5a718d0 (MD5) Previous issue date: 2011 | en |
dc.description.tableofcontents | 誌謝 I
摘要 IV Abstract V 目錄 VII 表目錄 XI 圖目錄 XII 第一章 導 論 1 1.1 常見高分子接合技術介紹 1 1.1.1 熱融合接合 1 1.1.2 有機溶劑接合 2 1.2 二氧化碳輔助接合介紹 2 1.3 陽極氧化鋁介紹 3 1.4 熱壓成型介紹 4 1.5 研究動機與研究目標 6 1.6 論文內容與架構 7 第二章 文獻回顧 13 2.1 高分子接合技術相關文獻 13 2.1.1熱融合接合文獻 13 2.1.2 有機溶劑接合文獻 14 2.2 二氧化碳接合相關文獻 16 2.3 超臨界二氧化碳應用相關文獻 18 2.4 氣體輔助微熱壓成型相關文獻 20 2.5 陽極氧化鋁相關文獻 21 2.5.1 陽極氧化鋁發展 21 2.5.2 陽極氧化鋁奈米孔洞結構製作 22 2.6 飛秒雷射加工技術相關文獻 24 2.7 文獻回顧總體歸納與研究思考 26 第三章 實驗設置與實驗方法 48 3.1 實驗目的及流程規劃 48 3.2 微奈米孔洞結構製作之設備與流程 49 3.2.1 陽極氧化鋁製程之材料 49 3.2.2 陽極氧化電解槽與低溫循環系統 49 3.2.3 壓克力箱 49 3.2.4 加溫磁石攪拌器 49 3.2.5 直流電壓供應器 50 3.2.6 陽極氧化鋁之製作流程 50 3.3 PDMS軟模翻印 51 3.3.1 PDMS材料介紹 51 3.3.2 翻製PDMS軟模 52 3.4 氣體輔助軟模微熱壓製程 53 3.4.1 氣體輔助軟模微熱壓製程設備 53 3.4.2 氣體輔助熱壓流程 54 3.5 飛秒雷射實驗系統 55 3.6 封裝接合PMMA試片 56 3.6.1 二氧化碳輔助熱融合接合設備 56 3.6.2 二氧化碳輔助製程特性分析 57 3.6.3 二氧化碳輔助接合實驗原理與步驟 57 3.7 量測儀器介紹 58 3.7.1 光學顯微鏡 58 3.7.2 表面接觸角量測儀 58 3.7.3 場發射電子顯微鏡(FE-SEM) 58 3.7.4 材料試驗機 59 3.8 本章結論 60 第四章 微奈米結構製作與接合探討 74 4.1 表層微奈米結構PMMA製作 74 4.1.1 陽極氧化鋁模板製作 74 4.1.2 壓印PC模具 76 4.1.3 表層微奈米結構複製於PMMA薄膜 77 4.2 二氧化碳輔助熱融合接合PMMA 77 4.3 接合製程成品初步觀察結果 78 4.4 陽極氧化鋁製程參數對接合影響探討 79 4.4.1 二次陽極時間對接合製程之影響 79 4.4.2 擴孔時間對接合製程之影響 80 4.4.3 本節結論 81 4.5 二氧化碳輔助熱融合接合參數探討 82 4.5.1 二氧化碳滲入壓力及時間對接合製程之影響 82 4.5.2 本節結論 83 4.6 微奈米孔洞結構於降低製程溫度之表現 84 4.7 本章結論 86 第五章 表面微奈米結構對CO2輔助熱融合接合影響 104 5.1 高規則性奈米孔洞陣列製作與接合探討 104 5.1.1 奈米孔洞陣列製作 104 5.1.2 結構複製壓印於PMMA基材 105 5.1.3 高規則奈米孔洞對接合探討 105 5.2 奈米圓柱陣列製作與接合探討 106 5.2.1 奈米圓柱結構接合說明 106 5.2.2 奈米圓柱結構製作 107 5.2.3 奈米圓柱結構於接合探討 107 5.3 飛秒雷射製作微結構於接合探討 108 5.3.1 微米結構模具製作 108 5.3.2 飛秒雷射微米結構製作於PMMA 109 5.3.3 飛秒雷射微米結構於接合探討 109 5.4 本章結論 111 第六章 高分子異質材料接合應用 125 6.1 異質材料接合實驗配置 125 6.1.1 材料選擇 125 6.1.2 二氧化碳輔助熱融合接合製程 126 6.2 異質接合結果與探討 127 6.2.1 異質接合初步觀察 127 6.2.2 異質接合實驗探討 128 6.3 本章結論 129 第七章 結論與未來展望 133 7.1 研究總結 133 7.2 未來研究方向與展望 134 參考文獻 137 | |
dc.language.iso | zh-TW | |
dc.title | 奈米結構於二氧化碳輔助熱融合PMMA接合影響研究 | zh_TW |
dc.title | Effects of Surface Nanostructures on Bonding Using Carbon-Dioxide-Assisted Thermal Fusion Bonding Process | en |
dc.type | Thesis | |
dc.date.schoolyear | 99-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 王安邦,謝國煌,劉士榮 | |
dc.subject.keyword | 二氧化碳,PMMA,奈米結構,飛秒雷射,塑膠接合,異質接合, | zh_TW |
dc.subject.keyword | Carbon dioxide(CO2),Polymethyl methacrylate(PMMA),nanostructure,femtosecond laser,heterogeneous bonding, | en |
dc.relation.page | 142 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2011-07-26 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
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