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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 管傑雄 | |
dc.contributor.author | Ping-Feng Lee | en |
dc.contributor.author | 李秉峰 | zh_TW |
dc.date.accessioned | 2021-06-13T05:44:20Z | - |
dc.date.available | 2011-07-19 | |
dc.date.copyright | 2006-07-19 | |
dc.date.issued | 2006 | |
dc.date.submitted | 2006-07-14 | |
dc.identifier.citation | (1)J.Alan Roden,”Analysis of printed circuit board structures using the finite difference time domain technique and the PML absorbing boundary condition,”IEEE International Symposium on Electromagnetic Compatibility, 2000. pp. 319 – 325
(2)Myung-Kul Kim, “Crosstalk control for microstrip circuit on PCBs at microwave frequencies,” IEEE International Symposium on Electromagnetic Compatibility, 1995. pp. 459 – 464 (3)Ponchak, G.E.; Chun Donghoon, Yook Jong-Gwan, Katehi, L.P.B.,”The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages, “ IEEE Transactions on Advanced Packaging Vol. 23, pp. 88-99, Feb. 2000 (4)Y. Ko,.K. Ito, J. Kudo, T. Sudo, “Electromagnetic radiation properties of printed circuit board with a slot in ground plane,”IEEE international Symposium on Electromagnetic Compatibility 1999, pp. 576 - 579 (5)C.Icheln et. Al. “Computer simulation and near-field measurements for the prediction of radiated OHM” , IEEE Int. Symp. EMC, Denver, pp. 878-881,August, 1998. (6)Maxwell Eminence User’s Reference, May,1994,Ansoft Corporation, Pittsburgh, PA (7)T.Kubota, et. Al “Influence on the transmission characteristics of a slot made on ground conductor of microstrip line”,Technical Report of IEICE EMCJ94-8, 1994. (8)Mark I. Montrose “Print Circuit board Design Techniques for EMC Compliance” (9)Raplph Morrison ‘Grounding and Shielding Techniques In Instrumentation 3Ed.” (10)謝明金 “高速數位電路設計暨雜訊防治技術” (11)Talgat R. Gazizov “Far-End Cross-talk Reduction in Double Layered Dielectric Interconnects”, IEEE Transactions on Electromagnetic Compatibility, Vol43, No.4 November 2001 (12)D. Moongilan, “Skin-effect modeling of radiated emissions from backplanes.” IEEE 1996 International symposium on EMC, pp 332-337 (13)R.E. Matick, “Transmission lines for digital and communication networks”, IEEE press 1995, p116-124 (14)R.F. German, H.W. Ott, and C.R.Paul, “Effect of an image plane on print circuit board radiation”, IEEE 1990 international EMC symposium, pp228-291 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/33664 | - |
dc.description.abstract | 一般電路板的設計,接地是將一些不需要的雜訊和突波消除或降低的一個方法之ㄧ,對於電路的設計者而言,必須詳細的考慮接地的方式。此次實驗將針對如何避免串音現象的發生以傳輸線的形式作一個探討與分析,並在傳輸線之間以接地的方式以及孔洞的週期性變化做一個詳細探討。
本論文是以IE3D模擬軟體進行模擬,來探討接地的方式以及數量,進而對於模擬結果以實際量測的方式進行驗證。我們將針對兩個主題進行討論,首先是對於兩條傳輸線之間的地平面進行孔洞的週期性變化,其次是針對接地的數目逐一做一個探討。 在一般PCB板的設計時,串音的干擾是相當嚴重的問題。一般解決方式會在兩傳輸線之間加上大量的接地點,藉由大量的接地點方式來降低線路之間彼此的耦合效應。我們希望能藉由一連串的實驗來驗證,希望能減少接地點的使用,以及藉由兩傳輸線之間孔洞的變化達到一定的效果。 | zh_TW |
dc.description.abstract | Generally, grounding is the primary way to reduce and eliminate the noise and pulse in design PCB. The problem of the grounding way needs to be carefully considered by a designer. Therefore, in this study, we discuss the grounding way and the change of via which can prevent the cross talk effect with the transmission line.
In this study, we use the IE3D to do this simulation, and find the way and numbers of grounding. We also do experiment to contrast the result of simulation and experiment. And we use the change between with two transmission line including via of cycle and ground. Crosstalk is quit critical problems at generally design of print circuit board. We usually use a large numbers of grounding to solve the problem. We hope we can use this study to reduce the numbers of grounding or change the number of via and to reach the equal result. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T05:44:20Z (GMT). No. of bitstreams: 1 ntu-95-P92943014-1.pdf: 2506307 bytes, checksum: 99044b5cecd6c293127c9cf99e8222b1 (MD5) Previous issue date: 2006 | en |
dc.description.tableofcontents | 目錄
第一章 序論 1 1-1 引言 1 1-2 研究動機 1 1-3 研究目標 2 第二章 應用理論 3 2-1接地方式 3 2-2 阻抗控制 5 2-3 貫穿孔 7 2-3-1 貫穿孔的電容雜散效應 7 2-3-2 貫穿孔的電感雜散效應 9 2-4 傳輸線原理 11 2-5 串音 16 2-6 臨界頻率 ( ) 20 2-7 共平面波導 21 第三章 設計原理 23 3-1 設計概念 23 3-2 測試基板的基本型態 24 3-2-1 四層板的堆疊方式: 24 3-2-2 六層板的堆疊方式: 24 3-2-3 八層板的堆疊方式: 25 3-3 模擬基板及實際基板的設計情況 28 3-3-1 模擬基板的設計情況 28 3-3-2 實際基板的設計情況 32 第四章 模擬與實驗結果分析 43 4-1 模擬結果分析 43 4-2 實際量測結果分析 46 第五章 結論及未來發展方向 60 參考文獻 62 | |
dc.language.iso | zh-TW | |
dc.title | 以共平面波接地形式探討傳輸線的耦合效應 | zh_TW |
dc.title | To discuss the crosstalk of transmission line via CPWG | en |
dc.type | Thesis | |
dc.date.schoolyear | 94-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 呂學士,林明星,李春和 | |
dc.subject.keyword | 串音,傳輸線, | zh_TW |
dc.subject.keyword | crosstalk,transmission, | en |
dc.relation.page | 63 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2006-07-17 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電子工程學研究所 | zh_TW |
顯示於系所單位: | 電子工程學研究所 |
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