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  1. NTU Theses and Dissertations Repository
  2. 工學院
  3. 機械工程學系
請用此 Handle URI 來引用此文件: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/32118
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dc.contributor.advisor陳湘鳳(Shana Smith)
dc.contributor.authorWei-Shu Hungen
dc.contributor.author洪偉書zh_TW
dc.date.accessioned2021-06-13T03:32:31Z-
dc.date.available2014-08-03
dc.date.copyright2011-08-03
dc.date.issued2011
dc.date.submitted2011-07-28
dc.identifier.citation[1] Kevin C. Tseng, 'Implementing and Planning ICT Strategy for Sustainable Development in Electrical/Electronics Goods Manufacture,' icma, 2010 International Conference on Manufacturing Automation, pp.30-36, 2010.
[2] RoHS Regulations – Government Guidance Notes, Department of Business Innovation and Skills, 2010.
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[4] Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on Waste Electrical and Electronic Equipment (WEEE), Official Journal of the Europen Union, 2003.
[5] Organization for Economic Co-operation and Development, 2001, Extended Producer Responsibility: A Guidance Manual for Governments, Renouf Publishing Co. Ltd., Ogdensburg, NY.
[6] S. Smith and C. C. Yen, 'Green product design through product modularization using atomic theory,' Robotics and Computer-Integrated Manufacturing, 26 (6), pp. 790-798, 2010.
[7] E. Van der Laan and M. Salomon, 'Production planning and inventory control with remanufacturing and disposal,' European Journal of Operational Research, 102 (2), pp. 264-278, 1997.
[8] R. Zuidwijk and H. Krikke, 'Strategic response to EEE returns: Product eco-design or new recovery processes?,' European Journal of Operational Research, 191 (3), pp. 1206-1222, 2008.
[9] A. Xanthopoulos and E. Iakovou, 'On the optimal design of the disassembly and recovery processes,' Waste Management, 29 (5), pp. 1702-1711, 2009.
[10] M. A. Ilgin and S. M. Gupta, 'Environmentally conscious manufacturing and product recovery (ECMPRO): a review of the state of the art,' Journal of environmental management, 91 (3), pp. 563-591, 2010.
[11] DSMweb.org
[12] A. A. Yassine, 'An introduction to modeling and analyzing complex product development processes using the design structure matrix (DSM) method,' Urbana, 51 (9), pp. 1-17, 2004.
[13] A. J. D. Lambert, 'Linear programming in disassembly/clustering sequence generation,' Computers & industrial engineering, 36 (4), pp. 723-738, 1999.
[14] A. J. D. Lambert, 'Automatic determination of transition matrices in optimal disassembly sequence generation,' Proceedings of the IEEE International Symposium on Assembly and Task Planning, Fukuoka, Japan, pp.220-225, 2001.
[15] S. Behdad, M. Kwak, H. Kim, and D. Thurston, 'Simultaneous Selective Disassembly and End-of-Life Decision Making for Multiple Products That Share Disassembly Operations,' Transactions-ASME Journal of Mechanical Design, 132 (4), 041002, 2010.
[16] P. J. Newcomb, B. Bras, and D. W. Rosen, 'Implications of modularity on product design for the life cycle,' Transactions-ASME Journal of Mechanical Design, 120 (3), pp. 483-490, 1998.
[17] M. E. Sosa, S. D. Eppinger, and C. M. Rowles, 'Identifying modular and integrative systems and their impact on design team interactions,' Transactions-ASME Journal of Mechanical Design, 125 (2), pp. 240-252, 2003.
[18] T. U. Pimmler and S. D. Eppinger, “Integration analysis of product decompositions,” International Conference on Design Theory and Methodology, 68 , pp. 343-351, 1994.
[19] K. T. Ulrich and K. Tung, “Fundamentals of product modularity,” Issues in Design/Manufacturing Integration, 39, pp.73-79,1991.
[20] A. Kusiak and C. C. Huang, 'Development of modular products,' IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 19 (4), pp. 523-538, 1996.
[21] A. Kusiak and C. C. Huang, 'Design of modular digital circuits for testability,' IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, 20 (1), pp. 48-57, 1997.
[22] C. C. Huang and A. Kusiak, 'Modularity in design of products and systems,' IEEE Transactions on Systems, Man and Cybernetics, Part A: Systems and Humans, 28 (1), pp. 66-77, 1998.
[23] “Genetic algorithm.”, from http://en.wikipedia.org/wiki/Genetic_algorithm.2011
[24] E. Falkenauer, 1998, Genetic algorithms and grouping problems, John Wiley & Sons, Inc., Hoboken, NJ.
[25] H. E. Tseng, C. C. Chang, and J. D. Li, 'Modular design to support green life-cycle engineering,' Expert systems with applications, 34 (4), pp. 2524-2537, 2008.
[26] S. Fukushige, K. Tonoike, Y. Inoue ,and Y. Umeda, 'Scenario Based Modularization and Evaluation for Product Lifecycle Design,' Proceeding of the ASME international design engineering technical conferences and computers and information in engineering conference, San Diego, California, 8, pp. 303-311, 2009.
[27] X. Lai and J. K. Gershenson, 'DSM-Based Product Representation for Retirement Process-Based Modularity,' Proceeding of the ASME international design engineering technical conferences and computers and information in engineering conference, San Diego, California, 8, pp. 59-72, 2009.
[28] S. Sosale, M. Hashemian ,and P. Gu, 'Product modularization for reuse and recycling,' ASME DES ENG DIV PUBL DE, ASME, FAIRFIELD, NJ,(USA), 1997, 94, pp. 195-206, 1997.
[29] P. Gu, S. Sosale, and M. Hashemian, 'An integrated modular design methodology for life-cycle engineering,' CIRP Annals-Manufacturing Technology, 46 (1), pp. 71-74, 1997.
[30] P. Gu and S. Sosale, 'Product modularization for life cycle engineering,' Robotics and Computer-Integrated Manufacturing, 15 (5), pp. 387-401, 1999.
[31] P. Gu, M. Hashemian, and A. Y. C. Nee, 'Adaptable design,' CIRP Annals-Manufacturing Technology, 53 (2), pp. 539-557, 2004.
[32] A. Ericsson and G. Erixon, Controlling design variants: Modular product platforms, SME, 1999.
[33] X. Lai and J. K. Gershenson, 'Representation of Similarity and Dependency for Manufacturing Process-Based Product Modularity,' Proceeding of the ASME international design engineering technical conferences and computers and information in engineering conference, Las Vegas, Nevada, 4, pp. 791-805, 2007.
[34] X. Lai and J. K. Gershenson, 'Representation of similarity and dependency for assembly modularity,' The International Journal of Advanced Manufacturing Technology, 37, pp. 803-827, 2008.
[35] X. Lai and J. K. Gershenson, 'DSM-based product representation for design process modularity,' Proceeding of the ASME international design engineering technical conferences and computers and information in engineering conference, New York, NY, 4, pp. 309-321, 2008.
dc.identifier.urihttp://tdr.lib.ntu.edu.tw/jspui/handle/123456789/32118-
dc.description.abstract隨著生產技術的進步加上消費者喜好的快速變化,消費性電子產品廢棄物逐年不斷地增加,大量成長的廢棄物已經造成環境上的負擔。近年來環保意識抬頭及環境保護法規的設立,要求規範廠商生產環境友好產品以滿足市場需求,在此背景之下,綠色設計成了解決問題的方法之一。模組化設計對於環境保護的改善有相當大的助益,設計人員若能在產品設計階段即考量產品綠色模組化設計,不僅可以幫助廠商降低生產成本、製造出滿足客戶功能需求的產品,同時產品也能符合日漸嚴苛的環境保護相關法規、減少產品廢棄物對於環境的衝擊及影響。
本論文以原子理論為基礎,根據產品零件的接觸矩陣及距離矩陣描述零件間相依程度與接觸關係,找出零件於模組內的重要程度、產生構造性模組化設計;基於產品構造性模組化設計,加入生命週期末期相對價值等綠色設計概念,重新設計產品模組構造,使產品構造簡化、方便產品於組裝製造階段能快速生產,有利產品生命週期末期的後續處理程序,如回收、重複使用或是維護升級。
本研究方法兼顧產品原有的物理性質(模組構造)及功能性質之外,同時成功地產生產品綠色模組化設計。設計人員可藉由本研究方法提前於設計階段驗證產品模組化設計之可行性,確認產品模組設計是否滿足綠色設計。最後,我們以檯燈及行動電話為實例,實際驗證本論文所介紹的綠色模組化設計方法。
zh_TW
dc.description.abstractIn recent years, short product cycle times and rapid changes in consumer demand have caused an increasing amount of consumer electronics product waste. Increasing product waste has, in turn, put a growing burden on the environment. Environmental concerns have led to regulations that require manufacturers to produce environmentally friendly products that meet both market and regulatory demands.
Green design techniques can help designers create environmentally friendly products for today’s complex market. In particular, modular design has a big impact on product environmental performance. Modular design can also help manufacturers meet customers’ functional requirements and lower production costs.
This study introduces a green design technique that uses atomic theory to generate modules based upon contact and dependency relationships between components in the product. The technique adds end of life value and environmental characteristics to a physical structural product model to redesign product modules. The study also presents case studies for a lamp and mobile phone to demonstrate the method. Results show that the method is an efficient technique for green modular design that can be used to meet increasingly stringent environmental regulations and reduce environmental impacts.
en
dc.description.provenanceMade available in DSpace on 2021-06-13T03:32:31Z (GMT). No. of bitstreams: 1
ntu-100-R98522627-1.pdf: 7528583 bytes, checksum: b0d099dbad50cdaa35081fb32546d680 (MD5)
Previous issue date: 2011
en
dc.description.tableofcontents致謝 i
摘要 ii
英文摘要 iii
目錄 v
圖目錄 viii
表目錄 x
第一章 緒論 1
1.1 研究背景與動機 1
1.2 研究內容與目的 3
第二章 文獻回顧 5
2.1 綠色設計 5
2.2 模組化設計 6
2.2.1 設計結構矩陣 6
2.2.2 過渡矩陣 10
2.2.3 材料相容矩陣 14
2.2.4 設計互動矩陣 16
2.2.5 以功能性分群產生模組化設計 19
2.2.6 利用人工智慧產生模組化設計 20
2.3 綠色模組化設計 22
2.4 小結 35
第三章 綠色模組化設計 36
3.1 原子理論 36
3.2 原子理論應用於工程設計 37
3.3 原子理論應用於模組化設計 37
3.4 接觸矩陣 39
3.5 總接觸矩陣及原子價矩陣 41
3.6 距離矩陣 43
3.7 作用力矩陣及最大作用力矩陣 44
3.8 綠色模組化設計 47
3.8.1 EOL相對價值與綠色價電子數 47
3.8.2 綠色作用力矩陣與最大綠色作用力矩陣 50
3.9 模組合併及修改 54
3.9.1第一種零件生命週期末期選項相對價值指派情形 54
3.9.2第二種零件生命週期末期選項相對價值指派情形 56
第四章 案例研究 58
4.1 案例一 檯燈 58
4.1.1 接觸矩陣 60
4.1.2 總接觸矩陣與原子價矩陣 60
4.1.3 距離矩陣 62
4.1.4 作用力矩陣與最大作用力矩陣 65
4.1.5 綠色模組化設計 69
4.1.6 模組合併及修改 73
4.1.7 討論 75
4.2 案例二 Sony Ericsson K530i 型號行動電話 76
4.2.1 接觸矩陣 77
4.2.2 總接觸矩陣與原子價矩陣 78
4.2.3 距離矩陣 79
4.2.4 作用力矩陣與最大作用力矩陣 80
4.2.5 綠色模組化設計 81
4.2.6 模組合併及修改 84
4.2.7 討論 84
第五章 結論與未來展望 86
5.1 結論 86
5.2 未來展望 87
參考文獻 88
dc.language.isozh-TW
dc.subject產品生命週期zh_TW
dc.subject原子理論zh_TW
dc.subject綠色設計zh_TW
dc.subject模組化設計zh_TW
dc.subjectatomic theoryen
dc.subjectproduct life cycleen
dc.subjectmodular designen
dc.subjectgreen designen
dc.title以原子理論為基礎建構綠色設計模組之方法zh_TW
dc.titleA Method of Green Modular Design Based on Atomic Theoryen
dc.typeThesis
dc.date.schoolyear99-2
dc.description.degree碩士
dc.contributor.oralexamcommittee劉正良(Cheng-Liang Liu),劉霆(Tyng Liu)
dc.subject.keyword原子理論,綠色設計,模組化設計,產品生命週期,zh_TW
dc.subject.keywordatomic theory,green design,modular design,product life cycle,en
dc.relation.page93
dc.rights.note有償授權
dc.date.accepted2011-07-29
dc.contributor.author-college工學院zh_TW
dc.contributor.author-dept機械工程學研究所zh_TW
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