Skip navigation

DSpace

機構典藏 DSpace 系統致力於保存各式數位資料(如:文字、圖片、PDF)並使其易於取用。

點此認識 DSpace
DSpace logo
English
中文
  • 瀏覽論文
    • 校院系所
    • 出版年
    • 作者
    • 標題
    • 關鍵字
    • 指導教授
  • 搜尋 TDR
  • 授權 Q&A
    • 我的頁面
    • 接受 E-mail 通知
    • 編輯個人資料
  1. NTU Theses and Dissertations Repository
  2. 電機資訊學院
  3. 光電工程學研究所
請用此 Handle URI 來引用此文件: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/30881
完整後設資料紀錄
DC 欄位值語言
dc.contributor.advisor林清富(Ching-Fuh Lin)
dc.contributor.authorKuo-Wei Leeen
dc.contributor.author李國瑋zh_TW
dc.date.accessioned2021-06-13T02:19:21Z-
dc.date.available2012-02-01
dc.date.copyright2007-02-01
dc.date.issued2007
dc.date.submitted2007-01-31
dc.identifier.citation[1]Curtis Helena and Barnes N. Sue., Invitation to Biology, Fifth Edition, Worth
Publishers, New York(1994)
[2]F. K. Yam and Z. Hassan,” Innovative advances in LED technology,”
Microelectronics Journal 36,pp.129-137 (2005)
[3]S. J. Pearton, J. C. Zolper, R. J. Shul, and F. Ren,” GaNǺProcessing, defects, and
devices,” J. Appl. Phys., Vol.86, No.1,pp.1-78(1999)
[4]E. Fred Schubert, Light-Emitting Diodes, Cambridge University Press, UK(2003)
[5]E. F. Schubert, N. E. J. Hunt, M. Micovic, R. J. Malik, D. J. Sivco, A. Y. Cho, and
G. J. Zydzik,” Highly efficient light-emitting diodes with microcavities,”
Science 265,pp.943-945(1994)
[6]H. De Neve, J. Blondelle, P. Van Daele, P. Demeester, R. Baets, and G.
Borghs, ”Recycling of guided mode light emission in planar microcavity light
emitting diodes,” Appl. Phys. Lett. 70,pp. 799-801(1997)
[7]D.L. Bullock, C. Shih, R.S. Margulies,J. Opt. Soc. Am. B10 399(1993)
[8]J.D. Joannopoulus, R.D. Meade, J.N.Winn, Photonic Crystals, PrincetonUniversity
Press(1995)
[9]M. R. Krames and H. Amano, J. J. Brown, and P. L. Heremans, “High-efficiency
light-emitting diodes,” IEEE J. Select. Topics Quantum Electronics 8,185(2002)
[10] 劉斡中,金屬光子盒之製作及光電特性分析(2004)
[11] Chen, Y., Vieu, C. & Launois, H., 'High Resolution X-ray Lithography and
Electron-beam Lithography : Limits and Prospectives', Condensed Matter News,
Vol. 6, pp. 22-30. (1998)
[12] Technology Review, February 2003
[13] V. Grigaliunas, S. Tamulevicius, R. Tomasiunas , V. Kopustinskas, A. Guobiene,
D. Jucius, “Laser pulse assisted nanoimprint lithography”, Thin Solid Films
453 –454 13–15(2004)
[1] Ching-Fuh Lin,“ Metallic photonic boxes on Si to enhance visible spectrum
of black-body radiation,” The Croucher Advanced Study Institute on
Frontiers of Photonics Research nanophotonic, Femtosecond Photonics
and Biophotonics, Chinese University of Hong Kong, Hong Kong, Dec.
[2] 劉斡中,金屬光子盒之製作及光電特性分析, (2004)
[3] David K. Cheng, Field and Wave Electromagnetics, second Edition,
Chapter 10,pp.623-627(1996)
[4] J. D. Joannopoulos, R. D. Meade, J. N. Winn, Photonic Crystals Molding
the Flow of Light, Princeton, September(1995)
[5] Ching-Fuh Lin,” Resonating cavity system system for broadly tunable
multi-wavelength,” US patent, US6687275,Feb.(2004)
[6] Ching-Fuh Lin, Cha-Hsin Chao, L. A. Wang and Wei-Chung Cheng,”
Black-body radiation modified to enhance spectrum,', Journal of Optical
Society of America, 22, 1517-1520(2005)
[1] AB-M, Inc. http://www.maskaligner.com/company.html
[2] C.Y. Chang, S. M. Sze, ULSI technology, McGraw-Hill, (1996)
[3] Peter E. Gise, Richard Blanchard ; prepared by the Fairchild Management and
Career Development Center, Semiconductor and integrated circuit fabrication
techniques, Reston Pub. Co., (1979)
[4] Allen Holberg, CMOS Analog Circuit Design, OxFord University Press, (2002)
[5] 莊達人VLSI 製造技術,第五版。台北:高立(2002)
[6] 柯富祥,光學微影術中光阻的發展趨勢,毫微米通訊, 3(5),42(1998)
[7] Menz, W., J. Mohr, and O. Paul. Microsystem Technology. p134. Weinheim:
WILEY-VCH (2001)
[8] Hong Xiao, Introduction to Semiconductor Manufacturing Technology, Prentice
Hall, New Jersey, pp.330-342(2001)
[9] Stanley Wolf and Richard N. Tauber, Silicon processing for the VLSI Era, Volumn
1 – processing Technology, Second Edition, Lattice Press, Sunset Beach,
California(2000)
[10] Stephen A. Campbell, The Science and Engineering of Microelectronic
Fabrication, Oxford University Press, New York, pp.269-272(1996)
[11] C. Y. Chang and S. M. Sze, ULSI Technology, McGraw-Hill, New York,
p.343(1996)
[12] Osamu Wada and Hideki Hasegawa, InP-Based Materials and Devices – Physics
and Technology, John Wiley & Sons, New York, pp.289-338(1999)
[13] 張勁燕,半導體製程設備,第二版,五南,台北市,p.259(2001)
[14] 施繼正,奈米壓印之印器與壓印,(2006)
[1] Stephen Y. Chou, Chris Keimel, and Jian Gu, “Ultrafast and direct imprint of
nanostructures in silicon,” Nature, vol. 417, pp. 835-837, June (2002)
[2] Danel, J. S. and G. Delapierre. 1991. Quartz: a material for micordevices.J.
Micromech. Microeng. 1, p187-198.
[3] 李英群,石英基材之奈米加工技術及其在壓印上的應用, (2005)
[4] Dahm, G.., I. W. Rangelow, P. Hudek, H. W. Koops. 1995. Quartz etching for
phase shifting masks. Microelectronic Engineering 27, p263-266.
[5] Komuro, M., J. Taniguchi, S. Inoue, N. Kimura, Y. Tokano, H. Hiroshima, and S.
Matsui. 2000. Imprint Characteristic by Photo-Induced Solidification of Liquid
Polymer. Jpn. J. Appl. Phys. 39, p7075-7079.
[6] Resnick, D. J., D. Mancini, M. J. Dauksher, K. Nordquist, T. C. Bailey, S. Johnson,
S. V. Sreenivasan, J. G. Ekerdt, and C.G. Willson. 2003. Improved step and flash
imprint lithography templates for nanofabrication. Microelectronic Engineering 69,
p412-419.
[7] B.J. Choi, S.V. Sreenivasan, S. Johnson, M. Colburn, C.G. Wilson, “Design of
orientation stages for step and flash imprint lithography”, Precision Engineering
Journal of the International Societies for Precision Engineering and
Nanotechnology, 25 (2001) 192–199
[8] 王湧鋒, 奈米直寫儀光學頭奈米壓印製作方法的光導性研究,國立台灣大學應用力學研究所碩士論文, pp. 51 (2004)
[9] Takamichi Iida, Roderick I L. The Properties of Liquid Metals M .
Oxford:147-199(1993)
[10] http://www.gequartz.com/en/thermal.htm
[1] R. J. Warmack and S. L. Humphrey,” Observation of two surfaceplasmon mode on
gold particles,” Physical review B, Vol.34,pp.2246-2252(1986)
[2] Daniel Huang, Frank Liao, Steven Molesa, David Redinger, and Vivek
Subramania,” Plastic-compatible low resistance printable gold nanoparticle
conductors for flexible electronics,” Journal of The Electrochemical
Society,150(7)G412-G417(2003)
dc.identifier.urihttp://tdr.lib.ntu.edu.tw/jspui/handle/123456789/30881-
dc.description.abstract在電燈被發明那一刻起,照明就成為人類生活中不可或缺的一部份,人類的發展也從此邁向新的紀元,隨著科技不斷的發展燈泡的壽命越來越長,同時也越來越亮,不過卻改變不了一個事實,那就是在燈泡發光的同時,大部分的能量是被轉換成熱能消耗掉了。傳統燈具,採用專用鎢絲燈為光源,壽命與耗能已漸不符合能源效益,為了使能量運用的效率提高,我們思考一個可以增強傳統黑體輻射特定波長的微結構,名為『金屬盒子』。
我們在矽晶片上設計並製作由金屬包覆介電質的金屬盒子結構,利用電磁學中空腔共振的原理,我們可以計算出元件增益的訊號。允許在共振腔內的電磁波稱為共振模態,而相應的波長稱為共振波長。
我們嘗試了壓印技術來製作元件,包括以熱壓印及以雷射輔助微米壓印,整個過程包括了曝光、顯影、蝕刻、蒸鍍等標準半導體製程。但最後並無法正確的製作出金屬盒子結構。故我們採用微影製程的方式完成金屬盒子的結構
為了使模擬更容易,我們也設計結構簡單的金屬盒子,尺寸包括1μm、2μm、3μm見方,高度分別為150nm、200nm。我們以這樣的尺寸做模擬所得的結果,初步印證了金屬盒子的可行性
我們模擬藉由改變元件的尺寸,可以調變加熱頻譜的增益訊號,在紅外光波段的實驗與模擬結果也能吻合,以這樣的構想,期望在可見光波段也能有增益的效果,這樣將可因應各種照明或光學應用上的需要。
zh_TW
dc.description.abstractSince light bulb was invented, lighting has become an essential part of the human civilization advancing towards a new century. Accompany with the unceasing development and advancement of science and technology, light-bulb’s life-span is extended and its brightness is increases. However, the great part of energy from the light bulb is heat. Traditional lights, which use tungsten lamp as the source of light, are not energy efficient in terms of life span and energy consumption. To make efficient use of energy for light, we investigate a microstructure to enhance specific signal of thermal radiation spectrum, named “metallic box”.
We design and fabricate metallic box structures with dielectric cube wrapped by metal on the silicon wafer. Applying the theorem of cavity resonance through Maxwell’s equations and boundary conditions, we can calculate the specific spectrum of the component. The allowable EM waves are called resonance modes and the corresponding wavelengths are called resonance wavelengths.
We had tried the imprint technology to fabricate the metallic box, including hot embossing and Laser pulse assisted imprint lithography, the whole process made by standard VLSI process such as exposure, development, dry etch, and evaporation. We could not fabricate the metallic box accurately by the imprint technology. So we use the conventional lithography technology to accomplish the metallic box.
Our metallic boxes have simple resonant cavity structure for a complete simulation for verification of our design. The dimension of the dielectric cubes is designed to be 1μm、2μm、3μm in square, and their height is 150nm or 200nm. After simulating the metallic box with such dimensions, we prove the feasibility of metallic box preliminarily
We can vary the dimension of metallic box to change the spectrum of thermal radiation. In infrared band, we can approximately match the experiment and the simulation. It is expected that we can enhance the signal in visible light band for future illumination and optical applications using this concept.
en
dc.description.provenanceMade available in DSpace on 2021-06-13T02:19:21Z (GMT). No. of bitstreams: 1
ntu-96-J93941003-1.pdf: 2523040 bytes, checksum: a73404293ff900ae371a98865015007c (MD5)
Previous issue date: 2007
en
dc.description.tableofcontents目 錄
口試委員會審定書----------------------------------------------------------------I
誌謝---------------------------------------------------------------------------------II
中文摘要--------------------------------------------------------------------------III
英文摘要-------------------------------------------------------------------------IV
第一章 簡介-----------------------------------------------------------------------1
1.1 簡介-----------------------------------------------------------------------1
1.2 論文導覽-----------------------------------------------------------------3
1.3 參考文獻-----------------------------------------------------------------5
第二章 微米尺寸之金屬光子盒子原理--------------------------------------6
2.1 簡介-----------------------------------------------------------------------6
2.2 空腔共振器原理--------------------------------------------------------7
2.3 參考文獻----------------------------------------------------------------10
第三章 以微米壓印技術(高分子材料加熱轉印)試做-------------------12
3.1 矽母模的製備----------------------------------------------------------12
3.2 微影製程----------------------------------------------------------------13
3.3 金屬薄膜沉積----------------------------------------------------------18
3.4 lift-off母模製程-------------------------------------------------------20
3.5 反應離子蝕刻(對Si)--------------------------------------------------22
3.6 以高分子材料之微影壓印試做及其結果-------------------------27
3.7 以高分子材料進行加熱轉印製作金屬盒子之可能與討論----31
3.8 參考文獻----------------------------------------------------------------32
第四章 以微米壓印技術(雷射輔助微影壓印)試做----------------------33
4.1 石英母模之製備-------------------------------------------------------33
4.2 深紫外光微影----------------------------------------------------------35
4.3 反應離子蝕刻(對SiO2)-----------------------------------------------38
4.4 雷射輔助微影壓印之試做及其結果-------------------------------43
4.5 以雷射輔助微影壓印製作金屬盒子之可能與討論-------------49
4.6 參考文獻----------------------------------------------------------------50
第五章 以微影方式製作微米金屬盒子------------------------------------52
5.1 簡介----------------------------------------------------------------------52
5.2 微米金屬盒子的製作(以微影方式定義圖案)--------------------53
5.3 改善金屬盒子製程方式(以金蝕刻液)-----------------------------56
5.4 製作微米金屬盒子的結果-------------------------------------------58
第六章 元件加熱頻譜量測---------------------------------------------------61
6.1 加熱頻譜量測架構----------------------------------------------------61
6.2 加熱頻譜的量測結果-------------------------------------------------63
6.3 加熱頻譜與模擬比較與討論----------------------------------------67
第七章 總結---------------------------------------------------------------------71
7.1 結論----------------------------------------------------------------------71
7.2 未來展望----------------------------------------------------------------73
附錄----------------------------------------------------------------------------------i
附錄一 圖目錄-------------------------------------------------------------i
附錄二 表目錄------------------------------------------------------------iv
dc.language.isozh-TW
dc.subject微影zh_TW
dc.subject金屬盒子zh_TW
dc.subject壓印zh_TW
dc.subject空腔共振zh_TW
dc.subjectlithographyen
dc.subjectmetallic boxen
dc.subjectcavity resonanceen
dc.subjectimprinten
dc.title微米尺寸金屬盒子的製備與加熱頻譜量測zh_TW
dc.titleThe Fabrication and Thermal Radiation Spectra of Metallic box with Micrometer Scaleen
dc.typeThesis
dc.date.schoolyear95-1
dc.description.degree碩士
dc.contributor.oralexamcommittee吳志毅(Chih-I Wu),蔡睿哲(J. C. Tsai)
dc.subject.keyword金屬盒子,壓印,空腔共振,微影,zh_TW
dc.subject.keywordmetallic box,imprint,cavity resonance,lithography,en
dc.relation.page73
dc.rights.note有償授權
dc.date.accepted2007-01-31
dc.contributor.author-college電機資訊學院zh_TW
dc.contributor.author-dept光電工程學研究所zh_TW
顯示於系所單位:光電工程學研究所

文件中的檔案:
檔案 大小格式 
ntu-96-1.pdf
  未授權公開取用
2.46 MBAdobe PDF
顯示文件簡單紀錄


系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。

社群連結
聯絡資訊
10617臺北市大安區羅斯福路四段1號
No.1 Sec.4, Roosevelt Rd., Taipei, Taiwan, R.O.C. 106
Tel: (02)33662353
Email: ntuetds@ntu.edu.tw
意見箱
相關連結
館藏目錄
國內圖書館整合查詢 MetaCat
臺大學術典藏 NTU Scholars
臺大圖書館數位典藏館
本站聲明
© NTU Library All Rights Reserved