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  1. NTU Theses and Dissertations Repository
  2. 電機資訊學院
  3. 電信工程學研究所
請用此 Handle URI 來引用此文件: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/29893
完整後設資料紀錄
DC 欄位值語言
dc.contributor.advisor吳宗霖(Tzong-Lin Wu)
dc.contributor.authorYi-Che Chenen
dc.contributor.author陳沂哲zh_TW
dc.date.accessioned2021-06-13T01:23:38Z-
dc.date.available2009-07-23
dc.date.copyright2007-07-23
dc.date.issued2007
dc.date.submitted2007-07-18
dc.identifier.citation[1] T. L. Wu, Y. H. Lin, J. N. Hwang, J. J. Lin, “The effect of test system impedance on measurements of ground bounce in printed circuit boards,” IEEE Trans.Electromagn. Compat., vol. 43, pp. 600-607 May 2001.
[2] G.-T. Lei, R. W. Techentin, and B. K. Gilbert, “High frequency characterization of power/ground-plane structures,” IEEE Trans. Microwave Theory Tech., vol. 47, pp.562–569, May 1999.
[3] S. Radu and D. Hockanson, “An investigation of PCB radiated emissions from simultaneous switching noise,” in Proc. IEEE Int. Symp. Electromagn. Compat.,pp. 893–898, 1999.
[4] K. Ren, C. Y. Wu, and L. C. Zhang, “The restriction on delta-I noise along the power/ground layer in the high speed digital printed circuit board,” in Proc. IEEE Int. Symp. Electromagnetic Compatibility, Colorado, USA, Aug. 1998, pp. 511-516.
[5] S. Van den Berghe, F. Olyslager, D. De Zutter, J. De Moerloose, and W. Temmerman, “Study of the ground bounce caused by power plane resonances,” IEEE Trans. Electromagn. Compat., vol. 40, May 1998, pp. 111-119.
[6] T. L. Wu, S. T. Chen, J. N. Huang, and Y. H. Lin, “Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB,” IEEE Trans. Electromagn. Compat., vol. 46, pp. 33-45, Feb. 2004.
[7] T. Sudo, H. Sasaki, N. Masuda, and J. L. Drewniak, “Electromagnetic interference (EMI) of system-on-package (SOP),” IEEE Trans. Adv. Packag., vol. 27, pp. 304-314, May. 2004.
[8] E. R. Pillai, “Coax via—A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling,” IEEE Trans. Microwave Theory Tech., vol. 45, pp. 1981–1985, Oct. 1997.
[9] G. Cerri, R. De Leo, and V. M. Primian, “A rigorous model for radiated emission prediction in PCB circuits,” IEEE Trans. Electromag. Comp., vol. 35, pp. 102–109, Feb. 2001.
[10] W. Pinello, A. C. Cangellaris, and A. Ruehli, “Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent circuit formulation,” IEEE Trans. Microwave Theory Tech., vol. 45, pp. 1889–1896, Oct. 1997.
[11] B. Archambeault and A. E. Ruehli, “Analysis of power/ground-plane EMI decoupling performance using the partial-element equivalent circuit technique,” IEEE Trans. Electromag. Compat., vol. 43, pp. 437–445, Nov. 2001.
[12] W. D. Becker and R. Mittra, “FDTD modeling of noise in computer package,” IEEE Trans. Compon., Package., Manufact. Technol., B, vol. 17, pp. 240-247, Aug. 1994.
[13] X. Ye, M. Y. Koledintseva, M. I, J. L. Drewniak, “ DC power-bus design using FDTD modeling with dispersive media and surface mount technology components,” IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 579–587, Nov. 2001.
[14] N. Na, J. Choi, S. Chun, M. Swaminathan, and J. Srinivasan, “Modeling and transient simulation of planes in electronic packages,” IEEE Trans. Adv. Packag., vol. 23, pp. 340–352, Aug. 2000.
[15] Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, “Convergence acceleration and accuracy improvement in power bus impedance calculation with a fast algorithm using cavity modes,” IEEE Trans. Electromagn. Compat., vol. 47, no. 1, pp. 2–9, Feb. 2005.
[16] H. H. Wu, J. W. Meyer, K. Lee, and A. Barber, “Accurate power supply and ground plane pair models,” IEEE Trans. Adv. Packag., vol. 22, pp. 259–266, Aug. 1999.
[17] O. M. Ramahi, V. Subramanian, and B. Archambeault, “A Simple Finite-Difference Frequency-Domain (FDFD) Algorithm for Analysis of Switching Noise in Printed Circuit Boards and Packages,” IEEE Trans. Adv. Packag., vol. 26, no. 2, pp. 191–198, May 2003.
[18] C. L. Tsai and T. L. Wu, “An efficient FDTD approach of modeling power delivery planes with SMT decoupling capacitors,” in Proc. IEEE Int. Symp. Electromagnetic Compatibility, Boston, USA, Aug. 2003, pp. 581-584.
[19] T. H. Hubing, J. L. Drewniak, T. P. Van Doren, and D. M. Hockanson, “Power bus decoupling on multilayer printed circuit boards,” IEEE Trans. Electromag. Compat., vol. 37, pp. 155-166, May 1995.
[20] X. Minjia, T. H. Hubing, J. Chen, T. P. Van Doren, J. L. Drewniak, and R. E. DuBroff, “Power-bus decoupling with embedded capacitance in printed circuit board design,” IEEE Trans. Electromag. Compat., vol. 45, pp. 22-30, Feb. 2003.
[21] Hyungsoo Kim, Byung Kook Sun, and Joungho Kim, 'Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs,' IEEE Microwave and Wireless Comp. Letters, vol. 14, no. 2, pp. 71-73, Feb. 2004.
[22] R. Abhari, and G. V. Eleftheriades, “Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits,” IEEE Trans. Microwave Theory Tech., vol. 51, pp. 1629-1639, June 2003.
[23] T. Kamgaing, and O. M. Ramahi, “A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface,” IEEE Microwave and Wireless Comp. Letters, vol. 13, pp. 21-23, Jan. 2003.
[24] S. Shahparnia and O. M. Ramahi, “Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures, ” IEEE Trans. on Electromagn. Compat ., vol. 46, pp. 580-587, Nov. 2004.
[25] D. Sievenpiper, L. Zhang, R. F. J. Broas, N. G. Alexopolous, and E. Yablonovitch, “High-impedance electromagnetic surfaces with a forbidden frequency band,” IEEE Trans. Microwave Theory & Tech., vol. 47, pp. 2059-2074, Nov. 1999.
[26] D. F. Sievenpiper, “High-impedance electromagnetic ground planes,” Ph.D. dissertation, Dept. Elect. Eng., Univ. California at Los Angeles, Los Angeles, CA, 1999.
[27] T. L. Wu, Y. H. Lin, and S. T. Chen, “A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures,” IEEE Microwave and Wireless Comp. Letters, vol. 14, pp. 337-339, July 2004.
[28] T. L. Wu, Y. H. Lin, T. K. Wang, C. C. Wang, and S. T. Chen, “Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits,” IEEE Trans. Microwave Theory Tech., vol. 53, pp. 2935-2942, Sept. 2005.
[29] L. Brillouin, Wave Propagation in Periodic Structure; Electric Filters and Crystal Lattices. New York: McGraw-Hill, 1946.
[30] Junho Lee, Hyungsoo Kim and Joungho Kim, “Broadband Suppression of SSN and Radiated Emissions using High-DK Thin Film EBG Power Distribution Network for High-Speed Digital PCB Applications,” Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on
[31] Y. H. Lin and T. L. Wu, “Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement,” in Proc. IEEE Int. Symp. Electromagnetic Compatibility, Montreal, Canada, Aug. 2001, pp. 319-324.
[32] Tzong-Lin Wu and Sin-Ting Chen, “A Photonic Crystal Power/Ground Layer for Eliminating Simultaneously Switching Noise in High-Speed Circuit,” Microwave Theory and Techniques, IEEE Transactions on
[33] Youchul Jeong; Hyungsoo Kim; Jingook Kim; Jongbae Park; Joungho Kim, “Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system,” Electrical Performance of Electronic Packaging, 2003
[34] Jingook Kim; Heeseok Lee; Joungho Kim, “Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards,” Advanced Packaging, IEEE Transactions, Volume 28, Issue 4, Nov. 2005 Page(s):724 - 735
[35] MIT Photonic Bands http://ab-initio.mit.edu/wiki/index.php/MIT_Photonic_Bands
[36] John. D. Joannopoulos, Robert D. Meade, Joshua N. Winn, “Photonic Crystals: Molding the Flow of Light”
[37] Ansoft HFSS http://www.ansoft.com/products/hf/hfss/
[38] Mini-Circuits http://www.minicircuits.com/
dc.identifier.urihttp://tdr.lib.ntu.edu.tw/jspui/handle/123456789/29893-
dc.description.abstract本篇論文著重在探討印刷電路板中的雜訊抑制機制。首先針對各種傳統之雜訊抑制方法加以討論及優缺點分析,之後提出一種光子晶體電源層結構,藉由頻帶圖以及色散圖的分析方式,可以更準確及有效率的預測出光子晶體的截止頻帶,並設計出所需要的截止頻帶位置。論文出提了理論分析,數值模擬以及實際電路板的製做,模擬與量測結果有相當好的一致性,最後另有電路元件的實際測試,可以看出此結構確實有絕佳的雜訊抑制效果。zh_TW
dc.description.abstractThis thesis focuses on the isolation of power/ground bounce noise (P/GBN) and suppression of simultaneous switching noise (SSN) in high-speed circuits. A hybrid photonic crystal power/ground layer (H-PCPL) is proposed to efficiently eliminate the noise. Based on the previous PCPL design, we use two kinds of photonic crystals to synthesis several bandgaps to form a continuously broad bandgap. A sequence of designing photonic bandgaps is investigated; first we fix the radius of the dielectric discs and vary the lattice constant, which can enhance the photonic bandgap but could not get a continuous stopband. Then we use two types of dielectric discs with different radii. The bandgaps can compensate each other and get a continuous stopband ranging from 3 to 9.6 GHz. Real-frequency gapmap is used here to analyze and estimate the bandgap structure, for the hybrid PCPL. H-PCPL are fabricated on Rogers/RT Duroid 5880 and good agreement is shown between the measurement and simulation results. Two noise isolation structure, H-PCPL and the conventional split power plane, are compared here, and the H-PCPL shows better signal integrity performance than the split power plane besides wider stopband for noise isolation. Demonstration of noise isolation on digital circuits is shown in the last section.en
dc.description.provenanceMade available in DSpace on 2021-06-13T01:23:38Z (GMT). No. of bitstreams: 1
ntu-96-R94942011-1.pdf: 2086885 bytes, checksum: 429670b5e7e398033616a2d749406a8e (MD5)
Previous issue date: 2007
en
dc.description.tableofcontentsChapter 1 Introduction
1.1 Research Motivation………………………………………..……1
1.2 Simultaneous Switching Noise (SSN) in Power Distribution Network (PDN) of IC packages………………………………….1
1.3 Literature Survey and Typical Solutions to SSN Problems………4
1.4 Chapter Outline of This Paper……………………………………8
Chapter 2 Photonic Crystal Bandgap Structure
2.1 One Dimensional and Two Dimensional Photonic Structures….11
2.2 Dispersion Diagram for Bandgap Analysis……………………..12
Chapter 3 Photonic Crystal Power/Ground Layer (PCPL)
3.1 PCPL Model and Design………………………………………..19
3.2 Fabrication and Measurement…………………………………..21
3.3 Power Integrity Performance of PCPL……………………….....24
3.4 Design Diagram and Gapmap…………………………………..28
3.5 Summary………………………………………………………..31
Chapter 4 Hybrid Photonic Crystal Power/Ground Layer (H-PCPL)
Design for Broadband Noise Isolation
4.1 Continuous Stopband for Noise Isolation………………………32
4.2 Gapmap for Bandgap Design and Estimation…………………..33
4.3 Power Integrity Performance of H-PCPL………………………38
4.4 Signal Integrity Performance of H-PCPL………………………45
4.5 Ultra High DK H-PCPL………………………………………...50
4.6 Noise Isolation on Digital Circuits……………………………...57
Chapter 5 Conclusion
Reference
dc.language.isoen
dc.subject電源完整性zh_TW
dc.subject信號完整性zh_TW
dc.subject光子晶體zh_TW
dc.subject同步切換雜訊zh_TW
dc.subjectnoise isolationen
dc.subjectphotonic crystalen
dc.subjectsimultaneous switching noiseen
dc.subjectSSNen
dc.subjectpower/ground bounce noiseen
dc.subjectsignal integrityen
dc.subjectpower integrityen
dc.title具有寬頻雜訊抑制能力之混合式光子晶電源層設計及電源完整性分析zh_TW
dc.titleA Hybrid Photonic Crystal Power Ground Layer (H-PCPL) with Broadband Noise Suppressionen
dc.typeThesis
dc.date.schoolyear95-2
dc.description.degree碩士
dc.contributor.oralexamcommittee吳瑞北,莊惠如,洪子聖,薛光華
dc.subject.keyword光子晶體,同步切換雜訊,信號完整性,電源完整性,zh_TW
dc.subject.keywordphotonic crystal,simultaneous switching noise,SSN,power/ground bounce noise,signal integrity,power integrity,noise isolation,en
dc.relation.page67
dc.rights.note有償授權
dc.date.accepted2007-07-18
dc.contributor.author-college電機資訊學院zh_TW
dc.contributor.author-dept電信工程學研究所zh_TW
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