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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 吳瑞北 | |
| dc.contributor.author | Kuan-Wei Li | en |
| dc.contributor.author | 李冠緯 | zh_TW |
| dc.date.accessioned | 2021-06-13T00:22:37Z | - |
| dc.date.available | 2011-08-10 | |
| dc.date.copyright | 2011-08-10 | |
| dc.date.issued | 2011 | |
| dc.date.submitted | 2011-08-05 | |
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Smith, “A methodology for the placement and optimization of decoupling capacitors for gigahertz system,” in 13th Int Conf. VLSI Design, Science City, Calcutta, India, pp. 156-161, Jan. 2000. [13] K.-B. Wu, A.-S. Liu, G.-H. Shiue, C.-M. Lin, and R.-B. Wu, “Optimum for the locations of decoupling capacitors in suppressing the ground bounce by Genetic Algorithm,” in Prog. in Electromagn. Res. Symp.（PIERS）, Hangzhou, Zhejiang, China, pp. 411-415, Aug. 22-26, 2005. [14] J. M. Hobbs, H. Windlass, V. Sundaram, S. Chun, G. E. White, M. Swaminathan, and R. Tummala, “Simultaneous switching noise suppression for high speed systems using embedded decoupling,” in Proc. 51st Electron. Comp. Technol. Conf., Orlando, FL, USA, pp. 339-343, May 2001. [15] V. Ricchiuti, “Power bus signal integrity improvement and EMI mitigation on multilayer high-speed digital PCBs with embedded capacitance,” IEEE Trans. Mobile Comput., vol. 2, no. 4, pp. 314-321, Oct.-Dec., 2003. [16] T.-L. Wu and S.-T. Chen, “An electromagnetic crystal power substrate with efficient suppression of power/ground plane noise on high-speed circuits,” IEEE Microw. Wireless Compon. Lett., vol. 16, no. 7, pp. 413-415, July 2006. [17] J. Choi, V. Govind, M. Swaminathan, and K. Bharath, “Noise isolation in mixed-signal systems using alternating impedance electromagnetic bandgap（AI-EBG）structure-based power distribution network（PDN）,” IEEE Trans. Adv. Packag., vol. 33, no. 1, pp. 2-12, Feb. 2010. [18] S. Shahparinia, and O. M. Ramahi, “Miniaturized electromagnetic bandgap structures for ultra-wide band switching noise mitigation in high-speed printed circuit boards and packages,” in IEEE 13th Topical Meeting Elect. Perform. Electron. Packag., Portland, OR, USA, pp. 211-214, Oct., 2004. [19] C.-L. Wang, G.-H. Shiue, and R.-B. Wu, “EBG- enhanced split power planes for wideband noise suppression,” IEEE 14th Topical Meeting Elect. Perform. Electro. Packag., Austin, TX, USA, pp.61-64, Oct. 2005. [20] S. Haga, K. Nakano, and O. Hashimoto, “Reduction in radiated emission by symmetrical power-ground layer stack-up PCB with no open edge,” in Proc. IEEE Int. Symp. Electromag. Compat., Minneapolis, MN, USA, pp. 262-267, Aug. 2002. [21] K.-B. Wu, R.-B. Wu, and D. De Zutter, “Modeling and optimal design of shorting vias to suppress radiated emission in high-speed alternating PCB planes,” IEEE Trans. Comp., Packag., Manufac. Technol., vol.1, no.4, pp. 566-573, Apr. 2011. [22] Federal Communications Commission. [Online]：http://www.fcc.gov/. [23] D. K. Cheng, “Field and Wave Electromagnetics,” 2nd ed., Chapter 10, Addison-Wesley, 1989. [24] C. A. Balanis, Antenna Theory–Analysis and Design, 2nd ed., Chapter 14, John Weley & Sons, Inc., 1997. [25] M. Leone, “The radiation of a rectangular power-bus structure at multiple cavity-mode resonances,” IEEE Trans. Electromagn. Compat., vol. 45, no. 3, pp. 486-492, Aug. 2003. [26] T. Fischer, M. Leone, and M. Albach, “An analytical model for studying the electromagnetic radiation of power-bus structure,” in IEEE Int. Symp. Electrimagn. Compat., Boston, MA, USA, vol. 1, pp. 225-230, Oct. 2003. [27] H.-W. Shim, and T. H. Hubing, “A closed-form expression for estimating radiated emissions from the power planes in a populated printed circuit board,” IEEE Trans. Electromagn. Compat., vol. 48, no. 1, pp. 74-81, Feb. 2006. [28] R. F. Harrington, Time-Harmonic Electromagnetic Fields, A Classic Reissue, Chapter 5, John Wiley & Sons, Inc., 2001. [29] R. E. Collins, Field Theory of Guided Waves, 2nd ed., IEEE Press, 1991, Chapter 4. [30] 美麗基科技股份有限公司. [Online] : http://www.turboard.com.tw/. [31] C.-H. Huang, C.-Y. Hsiao, C.-D. Wang, T. Chen, K.-H. Liao, and T.-L. Wu, “Conformal shielding investigation for SiP modules,” in Elec. Design Adv. Packag. Syst. Symp.（EDAPS）, Singapore, pp.1-4, Dec. 2010. [32] 丁惠玲，Giga赫茲橫向電磁波傳輸室應用在電磁干擾量測之研究，國立台灣大學碩士論文，2008年6月. [33] Murata Manufacturing Co., Ltd.. [Online]：http://www.murata.com/. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/28785 | - |
| dc.description.abstract | 本論文主要內容是針對於電源接地平面中所造成的電磁干擾問題，亦即在高速數位電路中影響系統穩定度的關鍵問題。在高速數位電路中，由於許多信號穿層、電源供應與跨槽線的情況，將導致接地彈跳雜訊的發生，使得激發出的電磁波於層板之間來回傳播與反射，並於平板邊緣產生等效磁流源，進而輻射出去產生雜訊，干擾其他電路或系統使之異常或故障，即電磁干擾。本論文提出在電源接地平面之四周圍，利用去耦合電容抑制板邊輻射雜訊，並提出簡化之分析方式，推導出幾何架構與去耦合電容規格以改變對板邊電場的影響；利用合理的簡化方式，找出主要影響遠場輻射雜訊抑制能力之設計參數；並透過解析方法，分析如何使用最低成本以擺放去耦合電容而達到最佳輻射抑制效果；設計步驟最後再使用本論文提出之特定頻率點無輻射之公式，設計出去耦合電容之電容值，並將此點頻率設計在系統中較強的輻射頻率點上，使遠場輻射雜訊的抑制更有效率，收事半功倍之效。最後，舉出設計範例、繪出設計曲線與設計流程圖，方便日後需要時可以直接引用，並利用全波電磁模擬軟體HFSS與GHz橫向電磁波傳輸室（GTEM）量測，以驗證此分析與設計之正確性。 | zh_TW |
| dc.description.abstract | This thesis focuses on the problem of Electromagnetic Interference（EMI）of Printed Circuit Board（PCB）power/ground planes, which is a crucial issue to the whole system stability in the high speed digital circuits. The ground bounce is the primary noise of power/ground planes which arises from the current flowing through a via or the signal trace crossing the slot lines. Bouncing back and forth from the edges of substrate, it will generate a standing wave, and give rise to the radiated emission, usually identified as EMI to the other circuits in the system. The thesis proposed the use of decoupling capacitors around the power/ground planes to suppress the edge radiation noise. A canonical problem simplified from the original structure is constructed, and based on which, the influence of decoupling capacitors on the electric field at the edge is analyzed. Analytical formulae are derived to design the decoupling capacitors with the lowest cost to achieve the best noise suppression. In addition, the analysis predicts the extremely low radiation at a certain frequency, which can be utilized to suppress the most critical noisy spectrum of the system by choosing the suitable capacitance value of decoupling capacitors. Finally, giving the illustrative examples, the design curves and flow charts are presented to facilitate the designers with the practical reference. Full-wave EM simulation and GTEM Cell measurement are used to validate the accuracy of the proposed analysis and design. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-13T00:22:37Z (GMT). No. of bitstreams: 1 ntu-100-R98942081-1.pdf: 2705214 bytes, checksum: 05f93f7b079e370285305faceeb4ed70 (MD5) Previous issue date: 2011 | en |
| dc.description.tableofcontents | 口試委員會審定書 #
致謝 i 摘要 ii ABSTRACT iii 目錄 iv 圖目錄 vi 表目錄 ix 第一章 研究動機與簡介 1 1.1 研究動機 1 1.2 文獻回顧與探討 4 1.3 章節概要 10 1.4 貢獻 11 第二章 雙層電源接地平面電磁場分析 12 2.1 電磁相容之相關法規 12 2.2 平行金屬板電磁特性簡介 15 2.3 遠場輻射機制與總輻射功率分析 17 2.4 接地連通柱散射場推導 22 2.5 加入去耦合電容之接地連通柱散射場推導 28 第三章 利用去耦合電容抑制電磁輻射之擺放分析與設計 35 3.1 去耦合電容與板邊電場之擺放分析 35 3.2 加入去耦合電容之板邊電場與遠場輻射分析 53 3.3 特定頻率無輻射之頻率分析與去耦合電容值設計 57 第四章 實驗量測與模擬比較 63 4.1 利用去耦合電容抑制板邊輻射之設計準則 63 4.2 利用去耦合電容抑制板邊輻射之擺放設計 67 4.3 利用去耦合電容達成特定頻率無輻射之擺放設計 71 4.4 遠場模擬與量測結果 75 第五章 結論與未來工作 83 5.1 結論 83 5.2 未來工作 84 參考文獻 86 | |
| dc.language.iso | zh-TW | |
| dc.subject | 去耦合電容 | zh_TW |
| dc.subject | 電源接地平面 | zh_TW |
| dc.subject | 電磁干擾 | zh_TW |
| dc.subject | 板邊輻射 | zh_TW |
| dc.subject | 接地彈跳雜訊 | zh_TW |
| dc.subject | ground bounce noise | en |
| dc.subject | decoupling capacitor | en |
| dc.subject | edge radiation | en |
| dc.subject | power/ground plane | en |
| dc.subject | electromagnetic interference（EMI） | en |
| dc.title | 利用去耦合電容抑制電源接地平面板邊輻射雜訊之分析與設計 | zh_TW |
| dc.title | Analysis and Design for Suppressing Edge Radiation of Power/Ground Planes by Decoupling Capacitors | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 99-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 黃立廷,吳宗霖,林建民,駱韋仲 | |
| dc.subject.keyword | 電源接地平面,電磁干擾,板邊輻射,接地彈跳雜訊,去耦合電容, | zh_TW |
| dc.subject.keyword | decoupling capacitor,edge radiation,electromagnetic interference（EMI）,ground bounce noise,power/ground plane, | en |
| dc.relation.page | 90 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2011-08-05 | |
| dc.contributor.author-college | 電機資訊學院 | zh_TW |
| dc.contributor.author-dept | 電信工程學研究所 | zh_TW |
| 顯示於系所單位： | 電信工程學研究所 | |
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