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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 高振宏 | |
dc.contributor.author | Yi-Hua Lu | en |
dc.contributor.author | 呂依樺 | zh_TW |
dc.date.accessioned | 2021-06-08T07:32:54Z | - |
dc.date.copyright | 2011-08-16 | |
dc.date.issued | 2011 | |
dc.date.submitted | 2011-08-09 | |
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/26929 | - |
dc.description.abstract | 近來,連線技術之一的打線接合,因銅線之低成本及較優越之電性,已開始逐漸地取代金線。雖然如此,在銅打線方面會有氧化及腐蝕之問題,所以我們必須引用一些特殊技術來解決這些問題,例如,使用有鍍鈀之銅線或遮蔽氣氛(N2/5%H2)。然而,銅線之可靠度仍須注重在材料或製程合理化等議題,所以現今我們在銅線應用中必須明瞭銅鋁介金屬之成長行為以避免與介金屬相關之失效之可能性發生。
在此研究中,有純銅線與鍍鈀銅線兩種銅線線材。銅線經過150、175、250及350 oC,經5分鐘至2000小時之時效處理。根據銅鋁二元相圖,頂溫選擇350 oC是為了加快反應以及穩定之介金屬種類能夠保持不變。為了避免傳統機械加工造成之破壞,故使用氬離子之離子拋光系統來對試片截面進行拋光處理;另外利用場發掃描式電子顯微鏡及場發式電子微探儀來研究介金屬之生成及界面形貌。 根據實驗結果,在初始狀態之銅鋁反應,觀察到僅有少部分之介金屬CuAl2生成。當在較低溫度並且剛開始時效處理之階段,界面上介金屬所佔的比例極少,隨著時效時間增加,介金屬生長之方向為橫向與垂直方向成長。當最低溫度150 oC,觀察到介金屬之成長極為緩慢,即使在時效時間至2000小時後,仍有部分區域之鋁未被消耗完,介金屬CuAl2與CuAl生成。介金屬之成長與溫度非常相關。當上升至最高溫度350 oC時,30分鐘可發現大部分之鋁已被消耗完,生成CuAl2與CuAl並伴隨較厚及新的相Cu3Al2之產生,所有溫度區間之介金屬種類與形貌之演變會在內文中詳細描述。而在鍍鈀銅線中,鈀原子未析出在界面區域處,在介金屬中並未測到鈀的訊號,顯示隨著介金屬之生成,鈀會被推往至介金屬前端之銅的區域中,並且對介金屬之成長速率沒有顯著之影響。 | zh_TW |
dc.description.provenance | Made available in DSpace on 2021-06-08T07:32:54Z (GMT). No. of bitstreams: 1 ntu-100-R98527012-1.pdf: 23503652 bytes, checksum: d845ad02de33c2878fd7192eeabd55c9 (MD5) Previous issue date: 2011 | en |
dc.description.tableofcontents | 致謝..............................................I
摘要..............................................II Abstract..........................................III 目錄..............................................V 圖目錄............................................VII 第一章 緒論.......................................1 1.1 微電子構裝技術.............................1 1.1.1 電子構裝的功能.............................1 1.1.2 電子構裝四層次.............................3 1.1.3 連線技術...................................6 1.2 研究動機與目的.............................8 第二章 文獻回顧...................................10 2.1 打線接合技術簡介...........................10 2.1.1 超音波接合法 ...............................11 2.1.2 熱壓接合法.................................11 2.1.3 超音波熱壓接合法...........................12 2.2 打線接合中影響接合強度之參數...............14 2.3 金銲線與銅銲線之比較.......................16 2.4 熱處理與Cu-Al之介金屬種類..................18 2.5 銅銲線製程之可靠度問題.....................22 第三章 實驗方法及步驟.............................27 3.1 實驗預備與條件.............................27 3.1.1 銲線與墊層材料.............................27 3.1.2 打線接合之製程條件.........................27 3.1.3 實驗條件...................................27 3.2 金相處理與試片分析.........................28 3.2.1 金相試片的製作.............................28 3.2.2 光學顯微鏡(OM)與掃描式電子顯微鏡(SEM)觀察..29 3.2.3 電子探測分析儀(EPMA)組成分析...............30 第四章 實驗結果與討論.............................35 4.1 銅線與鋁墊層反應之觀察.....................35 4.2 鈀對介金屬成長之影響.......................60 4.3 不同熱處理條件下銅鋁介金屬種類之演變.......62 4.4 不同熱處理條件下銅鋁介金屬分佈情形之演變...65 第六章 結論.......................................66 參考文獻..........................................67 | |
dc.language.iso | zh-TW | |
dc.title | 銅線於打線接合中銅鋁介金屬生長之觀察 | zh_TW |
dc.title | Observations on Growth of CuAl Intermetallic Compounds in Cu Wire Bonding | en |
dc.type | Thesis | |
dc.date.schoolyear | 99-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 劉正毓,顏怡文 | |
dc.subject.keyword | 打線接合,銅線,界面反應, | zh_TW |
dc.subject.keyword | wire bonding,copper wire,interfacial reaction, | en |
dc.relation.page | 72 | |
dc.rights.note | 未授權 | |
dc.date.accepted | 2011-08-09 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
顯示於系所單位: | 材料科學與工程學系 |
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