半導體供應鏈合作開發新產品設備個案研究

Abstract

台灣半導體產業擁有全球最完整之上下游整合供應鏈，供應鏈中之上游IC設計產業總產值為全球第二、中游IC製造業之晶圓代工總產值為全球第一、下游IC封裝與測試總產值為全球第一，均在全球佔有重要地位。 此研究是探討個案IC設計公司跨領域與半導體供應鏈中不同公司進行新產品設備合作開發個案研究。進行跨領域之新產品設備開發時，因公司文化不同、專業領域獨特性、規格需求認知不同而形成在合作開發期間各項挑戰，並因此形成延宕使開發成本上升。本研究希望經此研究探討並思考對於個案IC設計公司更具效率與更符合需求之跨領域合作新產品開發流程。 首先探討各主要之新產品開發流程理論與新產品開發方法。其次經由個案資料收集與整理，檢視跨領域合作時所面臨之各項挑戰。最後，建構符合個案IC設計公司從事跨領域時之新產品設備開發新流程。

Taiwan's semiconductor industry has the world's most complete integrated supply chain, the supply chain, IC design industry for the world's second, the IC manufacturing foundry for the world's first, IC assembly and Testing for the world's first, all in the world occupies an important position. This study is to explore case study of IC design company in cross-domain and semiconductor supply chains for different companies to develop new equipment. The development of new equipment in the field of cross-cutting, due to the different culture of the company, the unique field of expertise, different needs of the formation of different needs in the development of cooperation during the development of the challenges, and thus the formation of delays in the development costs. This study hopes to explore and consider the new product development process for cross-domain cooperation with more efficient and more demand for case IC design company. First explore the major new product development process theory and new product development methods. Followed by the collection and collation of case data to examine the challenges faced by cross-cutting cooperation. Finally, the construction conforms to the case IC design company engaged in cross-field new product equipment development process.