請用此 Handle URI 來引用此文件：
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/18978完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 陳亮嘉(Liang-Chia Chen) | |
| dc.contributor.author | Chien-Wei Lee | en |
| dc.contributor.author | 李建緯 | zh_TW |
| dc.date.accessioned | 2021-06-08T01:41:22Z | - |
| dc.date.copyright | 2016-11-02 | |
| dc.date.issued | 2016 | |
| dc.date.submitted | 2016-08-18 | |
| dc.identifier.citation | [1] L.-C. Chen, Y.-W. Chang, and H.-W. Li, “Full-field chromatic confocal surface profilometry employing digital micro-mirror device correspondence for minimizing lateral cross talks,” Opt. Eng., vol. 51, no. 8, pp. 81507–81510, 2012.
[2] T. Tanaami, S. Otsuki, N. Tomosada, Y. Kosugi, M. Shimizu and H. Ishida, “High-speed 1-frame/ms scanning confocal microscope with a microlens and Nipkow disks, ”Applied Optics, Vol. 41, Issue 22, pp. 4704-4708, 2002. [3] C. H. Lee and J. Wang, “Noninterferometric differential confocal microscopy with 2-nm depth resolution ,” Optics Communications, Volume 135, Issue 4-6, pp. 233-237, 1998. [4] J. B. Tan, J. Liu and Y. H. Wang, “Differential confocal microscopy witha wide measuring range based on polychromatic illumination,” Meas. Sci. Technol. 21, 054013 (6pp), 2010. [5] W. Zhao, Q, Jiang, L, Qiu and D. Liu , ” Dual-axes differential confocal microscopy with high axial resolution and long working distance ,” Optics Communications 284, pp. 15–19 ,2011. [6] L.C Chen, C. N. Chen and Y. W. Chang,” Development of a new multi-wavelength confocal surface profilometer for on-line automatic optical inspection (AOI), ” Asian Symposium for Precision Engineering and Nanotechnology, 2009. [7] G. Molesini, G. Pedrini, P. Poggi and F. Quercioli, 'Focus-wavelenght encoded optical profilometer, ' Opt. Comm. 49 (4),229-233 (1984) [8] G. J. Tearney, R. H. Webb and B. E. Bouma, 'Spectrally encoded confocal microscopy', Optics letters (1998) [9] L. C. Paul, S. P. Chen, Z. Lijun and F. Yeshaiahu, 'Single-shot depth-section imaging through chromatic slit-scan confocal microscopy,' Applied Optics, Vol. 37, No. 28, 6764-6770 (1998) [10] H. J. Tiziani, R. Achi and R. N. Kramer, 'Chromatic confocal microscopy with microlenses,' J. of Mod. Opt. 43 (1), 155-163 (1996) [11] M. A. Browne, O. Akinyemi, F. Crossley and Duncan T.B. Stacey ,” Stage-Scanned Chromatically Aberrant Conlocal Microscope for 3D Surface Imaging,” SPIE Vol. 1660, 532-541 ,1992. [12] H. Perrin, P. Sandoz and G. Tribillon ,” Profilometry spectral encoding of the optical axis,” SPIE, Vol. 2340, 366-374,1994. [13] R. Jusˇ kaitis and T. Wilson, “A method for characterizing longitudinal chromatic aberration of microscope objectives using a confocal optical system ,” Journal of Microscopy, Vol. 195, pp. 17–22, 1999. [14] P. M. Lane, R. P. Elliott and C. E. MacAulay, “Confocal Microendoscopy with Chromatic Sectioning, ” Proceedings of SPIE Vol. 4959, pp. 23-26, 2003. [15] J. Garzón R, J. Meneses, A. Plata, G. Tribillon and T. Gharbi, “Axial resolution of a chromatic dispersion confocal microscopy,” Proc. of SPIE Vol. 5622, pp. 766-771, 2004. [16] J. Garzón R, J. Meneses, A. Plata, G. Tribjilon and T. Gharbi,” Chromatic confocal method for determination of the refractive index and thickness,” Proc. of SPIE Vol. 5622 , pp. 805-810. [17] K. Shi, P. Li, S. Yin and Z. Liu, ” Chromatic confocal microscopy using supercontinuum light,” Applied Optics, Vol. 12, No. 10, pp. 2096-2101, 2004. [18] K. Shi, P. Li, S. Yin, and Z. Liu,” Surface profile measurement using chromatic confocal microscopy,” Proceedings of SPIE Vol. 5606, pp. 124-131, 2004. [19] E. Behroodi, A. Mousavian and H. Latifi, “Simulation and fabrication of white light confocal microscope to attain the surface profile using CCD and image processing techniques,” Proc. of SPIE Vol. 7389, pp. 73892U, 2009. [20] G.g-M. Zhang, D.M. Harvey, and D.R. Braden, Advanced acoustic microimaging using sparse signal representation for the evaluation of microelectronic packages. IEEE Trans Adv Pack, 2006. 29(2): p. 271-283. [21] Semmens, J.E. and L.W. Kessler, Application of Acoustic Frequency Domain Imaging for the Evaluation of Advanced Micro Electronic Packages. Microelectronics Reliability, 2002. 42(9–11): p. 1735-1740. [22] Chiu, S.H. and C. Chen, Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy. Applied Physics Letters, 2006. [23] Zhenhui, H., W. Quan, and H. Xiaojie. Inspection of miniaturised interconnections in IC packages with nanofocus X-ray tubes and nanoCT. in Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. 2009. [24] Kong, L., et al., 3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy. Microelectronic Engineering, 2012. 92(0): p. 24-28. [25] Li, Y., et al., Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. Microelectronics Reliability, 2014. 54(9–10): p. 1949-1952 [26] Gao, F., et al., Smooth silicon sidewall etching for waveguide structures using a modified Bosch process. Journal of Micro/Nanolithography, MEMS, and MOEMS, 2014. 13(1): p. 013010-013010 [27] Ku, Y.S., et al. 3D interconnect metrology in CMS/ITRI. 2011. [28] Ku, Y.-S. and F.S. Yang, Reflectometer-based metrology for high-aspect ratio via measurement. Optics Express, 2010. 18(7): p. 7269-7280 [29] Fujimori, Y., et al., New methodology for through silicon via array macroinspection. Journal of Micro/Nanolithography, MEMS, and MOEMS, 2013. 12(1): p. 013013-013013 [30] C. J. R. Sheppard and X. Q. Mao, ” Confocal microscopes with slit apertures,” Journal of Modern Optics, No. 35, 1988, pp. 1169-1185 [31] “Electromagnetic spectrum” https://en.wikipedia.org/wiki/Light [32] Marinissen, E.J. and Y. Zorian. Testing 3D chips containing through-silicon vias. in Test Conference, 2009. ITC 2009. International. 2009 [33] M. Ishihara and H. Sasaki, “High-speed surface measurement using a nonscanning multiple-beam confocal microscope,” Optical Engineering, Vol. 38, Issue 6, pp. 1035-1040, 1999. [34] S. K. Nayar and Y. Nakagawa, “Shape from focus: an effective approach for rough surfaces,” Robotics and Automation, 1990. Proceedings., 1990 IEEE International Conference on, Vol. 2, pp.218-225, 1990. [35] A. K. Ruprecht, K. Korner, T. F. Wiesendanger, H. J. Tiziani and W. Osten, “Chromatic confocal detection for high Speed micro topography measurements,” Proceedings of SPIE, Vol. 5302. pp.53-60, 2004. [36] Y. Wang, C. Kuang, P. Xiu, S. Li, X. Hao and X. Liu, “A lateral differential confocal microscopy for accurate detection and localization of edge contours,” Optics and Lasers in Engineering, Vol. 53, pp. 12-18, 2014. [37] Y. Wang, C. Kuang, Z. Gu and X. Liu, “Image subtraction method for improving lateral resolution and SNR in confocal microscopy,” Optics & Laser Technology, Vol. 48, pp. 489-494, 2013. [38] H. Perrin, P. Sandoz and G. M. Tribillon, “Profilometry by spectral encoding of the optical axis, ” In: Proc. SPIE, Vol. 2340. pp.366-374, 1994. [39] “Prism.” http://en.wikipedia.org/wiki/Prism [40] “3-Axis Submodules.” http://www.raylase.de/products/3-achsensubmodule/ [41] “Keyence5VK-9700.”http://www.keyence.com/products/microscope/laser-microscope/vk-8700_9700_generationii/index.jsp [42] “UMAP vision system type2”http://ecatalog.mitutoyo.com/UMAP-Vision-System -TYPE2-Series-364-Micro-Form-Measuring-System-C1577.aspx. [43] “OLS4100 laser confocal microscopy”http://www.olympus-ims.com/en/ metrolog/ols4100. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/18978 | - |
| dc.description.abstract | 本研究應用彩色共焦顯微技術為基礎，進一步發展成為適合量測矽穿孔之光學色散鏡頭及單擊式(one-shot)光學量測探頭系統，矽穿孔(Via)是連接三維積體電路各層的通道孔，但其深寬比值一般為3或5，甚至更高，已接近高深寬比，很難以傳統光學量測的架構，以斜向反射的方式接收光源訊號進行，本研究的目的為開發一套高量測速度、高準確度及高精度且不須垂直掃描或複雜計算之自動化光學檢測系統，藉由光纖來連接所有系統元件，可以減少因組合零件而產生的系統誤差，且同時縮小探頭體積使其易於組裝與調整。
本研究發展的系統屬單點式檢測，不適用於大區域的全域掃描，且同時因配合高深寬比的矽蝕刻深孔來設計色散物鏡之數值孔徑，最高的量測深寬比可達5:1，可以接收到的反射光角度較小(約為正負4度)，故不適用於大傾角的曲面量測，也因為同一個原因，對於會使光散射到不同角度的散射面，也不適合使用此探頭作為大傾角曲面量測檢測工具。 本研究使用深350 μm、直徑為60 μm之矽蝕刻深孔來測試開發的系統，經過30次的重複量測實驗並計算後，其結果的量測標準差約為0.07微米，可以小於全量測深度範圍的0.1個百分比，此證明本系統具備足夠之穩定性，並且能和線上檢測機台進行整合與應用。 | zh_TW |
| dc.description.abstract | In this thesis, a chromatic confocal microscopic system using fiber coupler for silicon via depth inspection is proposed and implemented. Through silicon via (TSV) plays an important role in integrated circuit connect between layers. The high aspect ratio of TSV makes it difficult to be measured by traditional measurement methods. This research develops one confocal microscopic system that is designed for high speed, accuracy and precision single point automatic optical inspection without scanning and time consuming calculation. The system is connected only by fibers. The potential measurement error that may occur in system construction can be effectively eliminated. It also reduces the volume of whole system and makes it easier for industrial application.
The system developed in this research is not suitable for measurement with large area. The objective lens with small numerical aperture limits the incident light that make it cannot measure things with large tilting angle or surfaces which scatter light to random direction. In experiment, high aspect ratio via with depth around 350 μm and diameter around 60μm is used as sample to verify the system. After thirty times experiment, the standard deviation of result is around 0.07μm and it is smaller than 0.1% actual value. The developed system can be cooperated with in-situ machines and applied to production inspection. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-08T01:41:22Z (GMT). No. of bitstreams: 1 ntu-105-R03522738-1.pdf: 3680816 bytes, checksum: 19ee03be64112e0ff9040397dbcdc9e0 (MD5) Previous issue date: 2016 | en |
| dc.description.tableofcontents | 摘要 I
Abstract II List of content III List of Figures VI List of Tables IX List of Symbols X 1 Introduction 1 1.1 Research background 1 1.2 Research motivations 1 1.3 Research objective 3 2 Literature review 5 2.1 Tradition confocal microscopy 5 2.1.1 Single point confocal structure 6 2.1.2 Nipkow disk system 6 2.1.3 Differential confocal structure 7 2.2 Single point chromatic confocal structure 8 2.3 Other systems for via inspection 14 2.3.1 Scanning acoustic microscopy 14 2.3.2 X – radiography 15 2.3.3 Scanning electron microscope 17 2.3.4 IR microscopy 19 2.4 Conclusions 21 3 Research methodology 22 3.1 Introduction 22 3.2 Traditional confocal system 22 3.3 Chromatic confocal system 27 3.3.1 Property of light 27 3.3.2 Light dispersion 27 3.3.3 Chromatic confocal principle 30 3.4 Lens design 33 3.5 Property of Through silicon vias 37 3.5.1 Numerical aperture 37 3.5.2 Manufacturing of Through silicon vias 38 3.5.3 Through silicon vias critical dimension 39 4 Experimental setup and result analyses 41 4.1 System structure design 41 4.2 System elements 42 4.2.1 Objective lens 42 4.2.2 Light source 44 4.2.3 Fiber coupler 45 4.2.4 Spectrometer 46 4.2.5 Scanning linear stage 46 4.2.6 Specular object 47 4.2.7 Software 48 4.3 System calibration 49 4.4 Measurement procedure 50 5 Experiment result and discussion 53 5.1 System property evaluation 53 5.1.1 Result for objective lens design 53 5.1.2 Noise detection 57 5.1.3 Repeatability 58 5.2 System measurement result 59 5.2.1 Standard gauges 59 5.2.2 Silicon via inspection 64 5.3 Result discussion and error analyses 77 6 Conclusions and future work 80 6.1 Conclusions 80 6.2 Future work 81 References 83 | |
| dc.language.iso | en | |
| dc.subject | 矽穿孔檢測 | zh_TW |
| dc.subject | 高深寬比 | zh_TW |
| dc.subject | 彩色共焦量測 | zh_TW |
| dc.subject | 自動化光學檢測 | zh_TW |
| dc.subject | Automated optical inspection | en |
| dc.subject | Through silicon via (TSV) | en |
| dc.subject | Chromatic confocal microscopy | en |
| dc.subject | High aspect ratio | en |
| dc.title | 運用於矽穿孔關鍵尺寸量測之彩色共焦顯微技術發展 | zh_TW |
| dc.title | Development of Chromatic Confocal Microscopic Technique for Measuring Key Dimension of Through Silicon Vias | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 104-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 劉正良,蕭金廷 | |
| dc.subject.keyword | 自動化光學檢測,矽穿孔檢測,彩色共焦量測,高深寬比, | zh_TW |
| dc.subject.keyword | Automated optical inspection,Through silicon via (TSV),Chromatic confocal microscopy,High aspect ratio, | en |
| dc.relation.page | 87 | |
| dc.identifier.doi | 10.6342/NTU201603181 | |
| dc.rights.note | 未授權 | |
| dc.date.accepted | 2016-08-19 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
| 顯示於系所單位： | 機械工程學系 | |
文件中的檔案：
| 檔案 | 大小 | 格式 | |
|---|---|---|---|
| ntu-105-1.pdf 未授權公開取用 | 3.59 MB | Adobe PDF |
系統中的文件，除了特別指名其著作權條款之外，均受到著作權保護，並且保留所有的權利。