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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 梁文傑 | |
dc.contributor.author | Yu-Ming Lee | en |
dc.contributor.author | 李佑茗 | zh_TW |
dc.date.accessioned | 2021-06-08T00:27:15Z | - |
dc.date.copyright | 2013-07-18 | |
dc.date.issued | 2013 | |
dc.date.submitted | 2013-07-10 | |
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/17642 | - |
dc.description.abstract | 由於銅本身具有很好的導熱和導電性,因此在化學和微電子工業中被廣泛的應用。然而在含氧等腐蝕環境中,銅是相當不穩定的。針對這些現象,有許多相關的腐蝕抑制劑被開發出來。有鑑於銅的重要性與日俱增,因此我們合成一系列含苯并三氮唑(benzotriazole, BTAH)的衍生物,並提供一些新的方法,以期許這些方式可以保護銅免被腐蝕。
在第4-1章中,我們利用自縮合和自組裝的概念合成出一個新型的聚合物,命名為BTA-poly,聚合物的一端可以利用化學吸附的方式與銅作用,另一端則可以保護銅不被腐蝕,與目前最好的腐蝕抑制劑苯并三氮唑(BTAH)相比,BTA-poly具有較好的保護能力。 近年來,有許多的研究是利用自組裝分子來達到保護金屬的目的。然而,當施加的外加電壓過高時,自組裝分子會有剝落的情形發生,而會導致金屬可能被腐蝕。在第4-2章,我們合成苯并三氮唑的衍生物,命名為5-BTACH2OH,分子本身在含氯的環境中就具有良好的抑制效果。此外,我們也可以使用光激發聚合的方法來避免自組裝膜在高電壓環境下剝落的問題。通過這種方式,我們能運用一系列官能基轉換的方式,以提高金屬表面的疏水性和控制抑制劑的抑制效率。 | zh_TW |
dc.description.abstract | Copper is an essential metal in the chemical and microelectronic industry because of its high thermal and electrical conductivities, however, copper is unstable in the oxygen-containing electrolytes. Thus, many relative researches have been focus on the substantial improvement of copper corrosion stability and have been achieved by the use of inhibitors. Based on the importance of copper and relative study, we synthesize novel inhibitors and provide new methods to protection of copper.
In chapter 4-1, we connect self-condensation and self-assembly concepts to devise a novel poly(5-methylenebenzotriazol-N-yl), a polymer also named as BTA-poly herein. The unique polymer contains a terminal benzotriazole (BTA) moiety to serve as an anchor to be adsorbed onto the copper surface and a hydrophobic tail from condensation polymerization of 5-chloromethylbenzotriazole to protect the copper surface against solution or air diffusion for anticorrosion/antioxidation. Compared with benzotriazole, which is one of the best corrosion inhibitors for copper, BTA-poly achieves better protection under the same test condition. Using self-assembly monolayers (SAMs) is a smart and rapid method to protect copper, however, if we apply higher potential on metal surface, SAMs may be peeling and cause metal corrosion in corrosive medium. In chapter 4-2, we synthesize 5-hydroxymethylbenzotriazole (donated as 5-BTACH2OH), which itself has better inhibitory efficiency in chloride medium. Moreover, we can use photoinduced polymerization method to control its inhibitory activity and avoid the SAMs flaking off copper surface on extra potential. By this way, we can perform a series of functional transformation steps to improve wettability of metal surface and control inhibitory efficiency well. | en |
dc.description.provenance | Made available in DSpace on 2021-06-08T00:27:15Z (GMT). No. of bitstreams: 1 ntu-102-D96223120-1.pdf: 8393190 bytes, checksum: e92172d8ceea1e9417cdc6d8754db92e (MD5) Previous issue date: 2013 | en |
dc.description.tableofcontents | Table of Contents
Abstract……………………………………………………………….I 中文摘要………………………………………………………………III List of Figures…………………………………………………….IV List of Tables………………………………………………………XI List of Schemes……………………………………………………XIII Chapter 1 Introduction and Objective..……………………….1 Chapter 2 Literature Review……………………………….....3 2-1 Introduction……………………………………………………3 2-2 Metal corrosion……………….………………………………4 2-2-1 Definition……………………….………….……4 2-2-2 The electrochemical nature of aqueous corrosion……4 2-2-3 Forms of corrosion………………………………8 2-3 Corrosion inhibition..………………………...…………10 2-3-1 Principles……………………………...…….10 2-3-2 Liquid phase inhibitors………………….. 11 2-3-3 Gas phase inhibitors…………………………13 2-3-4 The estimation of inhibitory efficiency…14 2-4 The basic properties of copper…………………………18 2-4-1 Physical properties……………………………………18 2-4-2 Chemical properties……………………………………19 2-4-3 The behavior of copper within sodium chloride solutions............................................20 2-4-4 Potential/pH (Pourbaix) Diagrams……………………23 2-5 Benzotrizole………………………………………….....26 2-5-1 Related research on benzotriazole as a corrosion inhibitor for copper..................................27 2-6 An introduction of self-assembled monolayers (SAMs)…………………….......................................33 2-7 Polymers as corrosion inhibitors………………………38 2-7-1 The corrosion inhibiting properties of polymer coatings.…………….....................................40 Chapter 3 Experimental Section………………………………44 3-1 Experimental Instruments and Chemical…………………44 3-1-1 Experimental instruments…………………………………44 3-1-2 Chemicals: solvents and reagents………………………46 3-2 Synthesis procedures…………………………………………47 3-3 Experimental procedures……………………………………51 3-3-1 Copper surface preparation………………………………51 3-3-2 Modification of copper surface…………………………51 3-3-3 Surface characterization……………………………………52 3-3-4 Contact angle measurements…………………………………53 3-3-5 Electrochemical measurements……………………………53 3-3-6 Weight loss measurements in immersion tests…………54 3-3-7 Scanning electron microscopy (SEM)……………………55 Chapter 4 Results and Discussion………………………………56 4-1 Surface Protection of Copper by the Self-Assembly of Novel Poly (5-methylenebenzotriazol-N-yl)…………………………………………….....................56 4-1-1 Introduction……………………………………………..56 4-1-2 Preparation of BTA-poly………………………………59 4-1-3 XPS analysis……………………………………………61 4-1-4 Contact angle experiments……………………………65 4-1-5 The basic study of copper……………………………66 4-1-6 Cyclic voltammetric measurements………………………73 4-1-7 Tafel polarization curves measurements……………76 4-1-8 Immersion tests………………………………………………79 4-1-9 SEM measurements……………………………………………82 4-1-10 Summary……………………………………………………...86 4-2 Control of the Inhibitory Activity of Benzotriazole Derivatives by Photoinduced Polymerization for Protection of Copper………………….................................88 4-2-1 Introduction…………………………………………………..88 4-2-2 The modification of copper electrodes………………90 4-2-3 Surface characterization……………………………………91 4-2-4 Contact angle experiments…………………………………99 4-2-5 The electrochemical behavior of pretreated copper electrodes in a 3.5 wt.% NaCl solution……………………...100 4-2-6 Weight loss measurements………………………………...108 4-2-7 SEM measurements……………………………………………110 4-2-8 The possible surface modification reaction mechanism on copper surface…………………………………………………114 4-2-9 Summary……………………………………………………………….118 Chapter 5 Conclusions and Suggestions for Future Work…..119 5-1 Conclusions……………………………………………………119 5-2 Suggestions for future work………………………………121 Chapter 6 References…………………………………………………………122 Appendix………………………………………………….....…..134 | |
dc.language.iso | en | |
dc.title | 含苯并三氮唑聚合物的合成及其在銅保護的應用 | zh_TW |
dc.title | Synthesis of Benzotriazole Based Polymers and the Applications on Surface Protection of Copper | en |
dc.type | Thesis | |
dc.date.schoolyear | 101-2 | |
dc.description.degree | 博士 | |
dc.contributor.coadvisor | 胡啟章 | |
dc.contributor.oralexamcommittee | 萬其超,邱文英,戴子安,詹益慈 | |
dc.subject.keyword | 苯并三氮唑,銅,電化學,抗腐蝕,抑制劑, | zh_TW |
dc.subject.keyword | Benzotriazole,copper,electrochemistry,anticorrosion,inhibitor, | en |
dc.relation.page | 152 | |
dc.rights.note | 未授權 | |
dc.date.accepted | 2013-07-10 | |
dc.contributor.author-college | 理學院 | zh_TW |
dc.contributor.author-dept | 化學研究所 | zh_TW |
顯示於系所單位: | 化學系 |
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