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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 王安邦(An-Bang Wang) | |
| dc.contributor.author | Yu-Ju Liu | en |
| dc.contributor.author | 劉祐汝 | zh_TW |
| dc.date.accessioned | 2021-06-07T18:06:47Z | - |
| dc.date.copyright | 2012-07-26 | |
| dc.date.issued | 2012 | |
| dc.date.submitted | 2012-07-24 | |
| dc.identifier.citation | 1. Beguin, A.E., Method of Coating Strip Material. US Patent 2,681,694 1954.
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Chazono, Base-metal electrode-multilayer ceramic capacitors: Past, present and future perspectives. Japanese Journal of Applied Physics Part 1-Regular Papers Short Notes & Review Papers, 2003. 42(1): p. 1-15. 26. 何建成, 蔡., 積層陶瓷電容器製程技術簡介(1)生胚製程. 化工期刊, 2004. 第51卷第4期: p. pp. 43-52. 27. 韋文誠, 精密陶瓷膠粒製程講義. 台灣大學材料科學與工程學系暨研究所, 2011. 28. Krieger, I.M.a.D., T.J., Concentration Dependence of the Viscosity of Suspensions. Trans. Soc. Rheol., 1959. 3: p. 137-152. 29. Andrade, E.N., Phil.Mag., 1934. 17: p. 497. 30. Peterson, K.E.B.a.B.C., Cellulose ethers in tape casting formulation. Ceramic Transactions, 1991. 26: p. pp.191-196. 31. Moreno, R., The role of slip additives in tape casting technology 2. binders and plasticizers. American Ceramic Society Bulletin, 1992. 71(11): p. 1647-1657. 32. 林建邦, 何., 蔡聰麟, 積層陶瓷電容器製程技術簡介(2)熟胚製程. 化工期刊, 2004. 第51卷第5期: p. pp. 93-99. 33. Paik, U., Kang, K. M.,Jung, Y. G.,Kim, J., Binder removal and microstructure with burnout conditions in BaTiO3 based Ni-MLCCs. 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N., Dispersion of nano-sized BaTiO3 powders in nonaqueous suspension with phosphate ester and their applications for MLCC. Journal of the European Ceramic Society, 2008. 28(6): p. 1205-1212. 41. Roman Nava, S.G.-F., Juan Aguilar-Gariba, Edgar Reyes and Bernard Durand, The thickness of BaTiO3 tape castings as function of the slip system. Ceramic Processing Research, 2012. 13(2): p. pp.101~104. 42. Song, H.D.K.a.J.T., The effects of sintering conditions and Ni powder size on the dielectric properties of a X7R multilayer ceramic capacitor. Ceramic Processing Research, 2011. 12(4): p. pp.477~482. 43. Brennecka, G.L., Parish, C. M.,Tuttle, B. A.,Brewer, L. N., Multilayer thin and ultrathin film capacitors fabricated by chemical solution deposition. Journal of Materials Research, 2008. 23(1): p. 176-181. 44. Ding, X., Li, Y. X.,Wang, D.,Yin, Q. R., Fabrication of BaTiO3 dielectric films by direct ink-jet printing. Ceramics International, 2004. 30(7): p. 1885-1887. 45. Keat, Y.C., Sreekantan, S.,Hutagalung, S. D.,Ahmad, Z. A., Fabrication of BaTiO3 thin films through ink jet printing of TiO2 sol and soluble Ba salts. Materials Letters, 2007. 61(23-24): p. 4536-4539. 46. Suzuki, M. and J. Akedo, Temperature Dependence of Dielectric Properties of Barium Titanate Ceramic Films Prepared by Aerosol Deposition Method. Japanese Journal of Applied Physics, 2010. 49(9). 47. Smay, J.E., S.S. Nadkarni, and J. Xu, Direct writing of dielectric ceramics and base metal electrodes. International Journal of Applied Ceramic Technology, 2007. 4(1): p. 47-52. 48. Brendan P. Farrell, D.A., Christopher M. Eastman, and Dan V. Goia, Novel Ag and AgPd Nanoparticles for MLCC's with Ultrathin Electrodes: A Case for the Revival of PM MLC Technology. CARTS USA 2005, 2005. 49. Nagata, H., Ko, S. W.,Hong, E.,Randall, C. A.,Trolier-McKinstry, S., Microcontact printed BaTiO3 and LaNiO3 thin films for capacitors. Journal of the American Ceramic Society, 2006. 89(9): p. 2816-2821. 50. M. Pope, H.P.K., P. Magnante, J., Chem. Phys., 1963. 38: p. 2042. 51. S.A. VanSlyke, C.W.T., US Patent 4,539,507, 1985. 52. T.M. Brown, J.S.K., R.H. Friend, F. Cacialli, R. Daik, W.J. Feast, Appl. Phys. Lett. , 1999. 75: p. 1679. 53. Jyh-Wen Shiu, K.-C.L., Chao-Chiun Liang,Yuan-Chang Liao,Chen-Chu Tsai,Janglin Chen, A rugged display: Recent results of flexible cholesteric liquid-crystal displays. Journal of SID, 2009. 17/10. 54. al., I.S.e., Single Substrate Coatable Multicolor Cholesteric Liquid Crystal Displays. SID Symposium Digest, 2007. 55. Jhih-Ping Lu, F.-C.C., Fu-Kang Chen,Chen-Chun Hsu,Yuan-Chang Liao and Yuh-Zheng Lee,, A single-substrate multicolor cholesteric liquid-crystal display prepared through ink-jet printing. Journal of SID, 2009. 17/10. 56. Charbonneaux, T.G., Design of Sheet Dies for Minimum Residence Time Distribution: A Review. Polymer-Plastics Technology and Engineering, 1991. 30:7: p. pp.665-684. 57. Huff, M., MEMS fabrication. Sensor Review, 2002. 22(1): p. pp.18-33. 58. Kim, D., Jeong, Sunho,Park, Bong Kyun,Moon, Jooho, Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions. Applied Physics Letters, 2006. 89(26). 59. 林怡君, 全新式精密圖案塗佈技術之開發與研究-「太極塗佈法」. 2011. 台灣大學應用力學研究所，台北，博士論文. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/16251 | - |
| dc.description.abstract | 狹縫式塗佈技術在工業界受到大量重視，由於此技術具有製程速度快、可以捲對捲(roll to roll)方式連續生產大面積塗膜與塗膜均勻性佳等優點，近年來被大量應用在半導體、平面顯示器與印刷電路板產業。
然而因傳統之狹縫式塗佈模組加工極為耗時與高成本，塗佈模組的最佳化設計常受到傳統機械加工的限制。本研究則利用微機電製程對具有高平整度之矽晶圓作加工，藉由不同的光罩圖案即可自由改變流道設計，並可將塗佈模組輕量化，此方法在狹縫式塗佈模組之開發尚未被探討及應用，因此具有新穎性。 為了驗證本實驗室所開發之毛細管塗佈技術與新式狹縫式塗佈技術在工業界應用的可行性，本研究實際將上述塗佈技術應用於膽固醇液晶顯示器與薄層化積層陶瓷電容(MLCC)的製作。在薄層化積層陶瓷電容塗佈中，吾人自行調配高固含量且低黏度之水性鈦酸鋇漿料，並以實驗定義其流量(G)-塗佈速度(V)之塗佈視窗，搭配毛細管塗佈鎳電極之技術，證實可成功塗佈出介電層厚度t=5.1μm與t=2.8μm具有五層結構之X7R MLCC，並觀察其燒結微結構與致密性，以及量測電容值與介電損失。 | zh_TW |
| dc.description.abstract | Slot die coating technology becomes more and more important for industries, due to the advantages of low time consuming, roll to roll process and high uniformity of coating film. In recent years, slot die coating technology has been applied in many fields, such as semiconductor, flat panel display and printed circuit board, and so on.
However, the traditional manufacture process has some limitations which make the optimization of coating die more difficult and complex, such as time consuming and high cost. The purpose of this research was to develop a novel fabrication of coating die by micro electromechanical system (MEMS) process, which can make slot die coater lighter and increase the flexibility of coating die design. Capillary coating technology and novel slot coating technology were conducted in the application of Cholesteric Liquid Crystal Display display (ChLC) and Multilayer capacitor(MLCC). 5 layers X7R MLCC with dielectric layer 5.1 μm and 2.8μm were demonstrated by the combination of these two coating technologies. The microstructure and electrical properties of MLCC were investigated in this article. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-07T18:06:47Z (GMT). No. of bitstreams: 1 ntu-101-R98543037-1.pdf: 70877474 bytes, checksum: d22f5fce4d8c8c62d5f2eca08e087378 (MD5) Previous issue date: 2012 | en |
| dc.description.tableofcontents | 目錄
口試委員會審定書 i 致謝 ii 中文摘要 iv ABSTRACT v 目錄 vi 圖目錄 xi 表目錄 xix 符號表 xx 第一章 緒論 1 1.1前言 1 1.2文獻回顧 2 1.2.1 濕式塗佈技術介紹 2 A. 面塗佈技術 3 A.1 刮刀塗佈(Blade coating) 3 A.2 狹縫式塗佈(slot die coating) 4 A.3 旋轉式塗佈(spin coating) 7 B. 圖案塗佈技術 7 B.1 噴墨技術(ink-jet printing) 7 B.2 噴射氣膠直接寫入法(Aerosol jet direct writing) 9 B.3 筆寫式塗佈(pen direct writing) 9 B.4 網印技術(screen printing) 10 B.5 微觸轉印技術(Microcontact printing) 11 1.2.2 狹縫式塗佈之應用 12 1.2.2.1 積層陶瓷電容(MLCC)之介紹 12 A. 鈦酸鋇漿料之成分與流變特性 14 B. 積層陶瓷電容之燒結特性 18 C. 積層陶瓷電容之製程技術 20 1.2.2.2 有機發光二極體(OLED)之介紹 28 1.2.3 筆寫式塗佈之應用 30 1.2.3.1 膽固醇液晶顯示器之介紹 30 1.3研究動機 34 第二章 實驗設備與方法 36 2.1實驗儀器 36 2.1.1 塗佈模具 36 A. 毛細管 36 2.1.2 流體傳輸 36 A. 針筒式幫浦(syringe pump) 36 B. 壓力調節閥(pressure regulator) 37 2.1.3 塗佈系統 37 A. 移動平台塗佈機台 37 B. 高精度滾輪塗佈機 38 2.1.4 加熱系統 39 A. 加熱板 39 B. ITO玻璃加熱片 39 C. 1000℃管型爐 40 D.可控制氣氛高溫爐(1400℃) 40 E. 可控制氣氛中溫爐 40 2.1.5 雷射雕刻機 41 2.1.6 微量天平 41 2.2量測設備 42 2.2.1 顯影系統 42 A. 倒立式顯微鏡 42 B. 顯微鏡CCD 42 C. 紅外線熱像儀 43 D. 白光干涉儀 43 E. 探針式表面分析儀 44 F. 掃描式電子顯微鏡(SEM) 44 2.2.2 電性量測系統 45 第三章 狹縫式塗佈頭設計與實驗架設 46 3.1塗佈模具之幾何形狀設計 46 3.2塗佈模具之製程 53 3.2.1 固定式塗佈模組 53 3.2.2 活動式塗佈模組 57 3.3塗佈頭支架設計 57 3.3.1 多管毛細管針支架 57 3.3.2 狹縫式塗佈模組支架 58 3.4 ITO玻璃加熱片性能測試 59 第四章 實驗方法與步驟 62 4.1 陶瓷生胚塗佈 62 4.1.1 塗佈視窗研究方法 62 4.1.2 膜厚量測 62 4.2 積層陶瓷電容器(MLCC)製程 64 4.2.1 陶瓷漿料配置 64 4.2.2 上下蓋製作 65 4.2.3 介電層與電極塗佈 65 4.2.4 壓合與裁切 66 4.2.5 燒結 67 4.2.6 倒角 68 4.2.7 端電極 68 4.2.8 電容電性量測 69 第五章 結果與討論 70 5.1 狹縫式塗佈 70 5.1.1 鈦酸鋇漿料之材料性質 70 5.1.1.1 沉降實驗 70 5.1.1.2 溶劑系統 71 5.1.1.2.1 溶劑:去離子水 73 5.1.1.2.2 溶劑: Butyl carbitol 74 5.1.1.2.3 溶劑:Glycerol 75 5.1.1.2.4 綜合比較 76 5.1.1.3 流變特性 77 5.1.2 塗佈視窗之建立 79 5.1.3 最小濕膜厚(T)與塗佈間距(G)之關係 80 5.2毛細管塗佈 84 5.2.1 多管塗佈測試 84 5.2.1.1 針尖直徑D=55μm 84 5.2.1.1.1 線寬(W)與塗佈速度(V)之關係 84 5.2.1.1.2 膜厚(T)與塗佈速度(V)之關係 85 5.2.1.2 針尖直徑D=30μm 86 5.2.1.2.1 線寬(W)與塗佈速度(V)之關係 86 5.2.1.2.2 膜厚(T)與塗佈速度(V)之關係 88 5.2.2 鎳電極塗佈 89 5.2.3 膽固醇液晶顯示器之電極塗佈 93 5.2.3.1 乾燥溫度(T)與線寬變化之關係 96 5.2.3.2 電漿表面改質 97 5.3 積層陶瓷電容(MLCC)製作 103 5.3.1 燒結參數之影響 103 5.3.2 MLCC之電性量測 105 5.3.2.1 微結構分析與電容量 105 5.3.2.2 溫度效應對電容量之影響 111 5.3.2.3 介電損失量測 112 5.3.2.4 崩潰電壓與絕緣阻抗 113 5.4有機發光二極體(OLED)電洞注入層塗佈 115 第六章 結論與未來展望 118 6.1結論 118 6.1.1 新式狹縫式塗佈之開發 118 6.1.2 毛細管塗佈之應用 119 6.1.3 薄層化積層陶瓷電容塗佈 120 6.2未來展望 120 參考文獻 122 作者簡介 127 | |
| dc.language.iso | zh-TW | |
| dc.subject | 毛細管塗佈 | zh_TW |
| dc.subject | 膽固醇液晶顯示器 | zh_TW |
| dc.subject | 積層陶瓷電容 | zh_TW |
| dc.subject | 微機電加工 | zh_TW |
| dc.subject | 狹縫式塗佈 | zh_TW |
| dc.subject | MEMS | en |
| dc.subject | Multilayer cermic capacitor | en |
| dc.subject | Cholesteric Liquid Crystal Display display | en |
| dc.subject | Capillary coating | en |
| dc.subject | Slot die coating | en |
| dc.title | 全新狹縫式塗佈頭製程技術之開發及其於積層陶瓷電容之應用 | zh_TW |
| dc.title | The Development of a Novel Slot Die Coater Manufacturing Technology and its Application in Multilayer Ceramic Capacitor (MLCC) | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 100-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 王錫福,韋文誠,施文彬,劉大佼 | |
| dc.subject.keyword | 狹縫式塗佈,毛細管塗佈,微機電加工,積層陶瓷電容,膽固醇液晶顯示器, | zh_TW |
| dc.subject.keyword | Slot die coating,Capillary coating,MEMS,Multilayer cermic capacitor,Cholesteric Liquid Crystal Display display, | en |
| dc.relation.page | 127 | |
| dc.rights.note | 未授權 | |
| dc.date.accepted | 2012-07-24 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 應用力學研究所 | zh_TW |
| 顯示於系所單位： | 應用力學研究所 | |
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