請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/15876
完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 王暉(Huei Wang) | |
dc.contributor.author | Che-Chung Kuo | en |
dc.contributor.author | 郭哲均 | zh_TW |
dc.date.accessioned | 2021-06-07T17:54:16Z | - |
dc.date.copyright | 2012-08-19 | |
dc.date.issued | 2012 | |
dc.date.submitted | 2012-08-17 | |
dc.identifier.citation | [1] H. Wang, K.-Y. Lin, Z.-M. Tsai, L.-H. Lu, H.-C. Lu, C.-H. Wang. J.-H. Tsai, T.-W. Huang, Y.-C. Lin, “MMICs in the millimeter-wave regime,” IEEE Microwave Magazine, vol.10, issue 1, pp. 99-107, Feb. 2009.
[2] S.-M. Yim, T. Chen, K. O. Kenneth, 'The effects of a ground shield on the characteristics and performance of spiral inductors,' IEEE Journal of Solid-State Circuits, vol. 37, no. 2, pp. 237-244, Step. 2002. [3] J. Zeng, C. Wang, A. J. Sangster, 'Theoretical and experimental studies of flip-chip assembled high-Q suspend MEMS inductors,' IEEE Trans. Microwave Theory and Tech., vol. 55, no. 6, pp. 1171-1181, June 2007. [4] R. R. Tummala, 'Moore's law meets its match', IEEE Spectrum magazine, June 2006. [5] J. Long, 'Monolithic transformer for silicon RFIC design,' IEEE Journal of Solid-State Circuits, vol. 35, no. 9, pp. 1368-1382, Step. 2000. [6] T. Wang, C.-H. Chen, Y.-S. Lin, S.-S. Lu, “A Micromachined CMOS Distributed Amplifier by CMOS Compatible ICP,” IEEE Electron Device Letters, vol. 27, no. 4, pp.291-293, Apr. 2006 [7] T. Wang, Y.-S. Lin, and S.-S. Lu, “An Ultra-Low-Loss and Broadband Micomachined RF Inductor for RFIC Input-Matching Application,” IEEE Trans. on Electron Devices, vol. 53, no.3, pp.568-570, Mar. 2006 [8] D. M. Pozar, Microwave Engineering, 2nd ed. New York: Wiley, 1998.. [9] Che-Chung Kuo, Chung–Lin Kuo, Che-Jia Kuo, S.A. Maas and Huei Wang, “Novel miniature and board-band monolithic star mixers,” IEEE Trans. Microwave Theory and Tech., vol. 56, no. 4, pp. 793-801, Apr. 2008. [10] C.-C. Kuo, C.-L. Kuo and H. Wang, 'Miniaturized multilayer hybrid-phase signal splitter circuit,' U.S. Patent 8013686, Feb. 24, 2009. [11] C.-C. Kuo and H. Wang, “Miniaturized dual-balanced mixer circuit based on a multilayer double spiral layout architecture,' U.S. Patent 8064871, Feb. 24, 2009. [12] C.-C. Kuo and H. Wang, “Miniaturized dual-balanced mixer circuit based on a trifilar layout architecture,' U.S. Patent 8112058, Feb 24, 2009. [13] C.-C. Kuo and H. Wang, “Miniaturized dual-balanced mixer circuit based on a multilayer double spiral layout architecture,' U.S. Patent 8064871, Feb 24, 2009. [14] C.-S. Lin, P.-S. Wu, M.-C. Yeh, J.-S. Fu, H.-Y. Chang, K.-Y. Lin and H. Wang, 'Analysis of multiconductor coupled-line Marchand baluns for miniature MMIC design' IEEE Trans. on Microwave Theory and Techniques, vol.55, no. 6 pp. 1190-1199, June. 2007. [15] P.-S. Wu, C.-H. Wang, T.-W. Huang and H. Wang, “Compact and broad-band millimeter-wave monolithic transformer balanced mixers” IEEE Trans. Microwave Theory Tech. vol. 53, no.10, pp. 3106 – 3114, Oct. 2005. [16] J. R. Long, “A low-voltage 5.1-5.8-GHz image-reject down converter RF IC” IEEE J. Solid-State Circuits, vol. 35, no. 9, pp.1320 – 1328, Sept. 2000. [17] S. A. Maas, Microwave Mixers, 2nd ed. Norwood, MA: Artech House,1993. [18] R. B. Mouw “A broad-band hybrid junction and application to the star modulator,” IEEE Trans. Microwave Theory Tech., vol.16, pp.154 – 161, Nov. 1968. [19] S. Basu and S. A. Maas, design and performance of a planar star mixer,” IEEE Trans. Microwave Theory Tech., vol. 41, no. 11, pp. 2028–2030, Nov. 1993. [20] Y.-I. Ryu, K. W. Kobayashi, and A.-K. Oki, “A monolithic broadband doubly balanced EHF HBT star mixer with novel microstrip baluns,” in IEEE Microwave Millimeter-Wave Monolithic Circuit Symp. Dig., pp. 119–122, 1995. [21] C.-Y. Chang, C.-W. Tang, and D.-C. Niu, “Ultra-broad-band doubly balanced star mixers using planar Mouw’s hybrid junction,” IEEE Trans. Microwave Theory Tech., vol. 41, pp. 1077–1085, June 2001. [22] H.-K. Chiou, Y.-R. Juang, H.-H. Lin,” Miniature MMIC star double balanced mixer using lumped dual balun” Electronics Letters ,vol. 33, no. 6, pp. 503 – 505 Mar. 1997 [23] K. W. Yeom, D.H. Ko,” A novel 60-GHz monolithic star mixer using gate-drain-connected pHEMT diodes” IEEE Tran. Microwave Theory Tech. vol. 53, no. 7, pp.2435-2440, July 2005. [24] S. S. Kim, J. H. Lee, K. W. Yeom,” A novel planar dual balun for Doubly Balanced star mixer” IEEE Microw. Wireless Compon. Lett. vol. 14, no. 9, pp. 440 – 442, Sept. 2004. [25] W.-C. Chen, S.-Y. Chen, J.-H. Tsai, T.-W. Huang and H. Wang, “A 38-48 GHz miniature MMIC subharmonic mixer,“ Gallium Arsenide and Other Semiconductor Application Symposium., pp.437-440, Oct. 2005. [26] Y.-A. Lai, C.-M. Lin, C.-P. Chang, C.-H. Lin and Y.-H. Wang, 'A compact ka-band doubly balanced sub-harmonic mixer,' IEEE Electron Devices and Solid-State Circuits, pp. 437-440, 2007. [27] M. Varonen, M. Karkkainen, M. Kantaen and M. Halonen, 'Millimeter-wave integrated circuits in 65-nm CMOS' IEEE Journal of Solid-State Circuits, vol. 43, no. 9, pp. 1991-3003, 2008. [28] L. Sheng, J. C. Jensen, and L. E. Larson, “A wide-bandwidth Si/SiGe HBT direct conversion sub-harmonic mixer/downconverter,” IEEE Journal of Solid-State Circuits, vol. 35, no. 9, pp. 1329–1337, Sep. 2000. [29] M. Goldfarb, E. Balboni, and J. Cavey, “Even harmonic double-balanced active mixer for use in direct conversion receivers,” IEEE Journal of Solid-State Circuits, vol. 38, no. 10, pp. 1762–1766, 2003. [30] P.-S. Wu, C.-H. Wang, T.-W. Huang and H. Wang, “Compact and broad-band millimeter-wave monolithic transformer balanced mixers,” IEEE Transaction on Microwave Theory Tech., vol. 53, no. 10, pp. 3106-3114, Oct. 2005. [31] J.-H. Tsai and T.-W. Huang,” 35-65 GHz CMOS broadband modulator and demodulator with sub-harmonic pumping for MMW wireless gigabit applications,” IEEE Transaction on Microwave. Theory Tech., vol. 55, no. 10, pp. 2075-2085, Oct. 2007. [32] C.-C. Kuo, H.-C. Lu and H. Wang, “The new topology sub-harmonically mixer using Marchand dual balun in 0.18 mm technology,’ to be appeared in IEEE, International Microwave Symp. 2012. [33] B. Razavi. RF microelectronics, Prentice-Hall, 1998. [34] X. Guan and A. Hajimiri, ‘‘A 24 GHz CMOS front-end,’’ IEEE Journal of Solid State Circuits, vol. 39, no. 2, pp. 368-373, Feb. 2004. [35] A. Ghazinour, P. Wennekers, J. Schmidt, Y. Yi, R. Reuter, and J. Teplik, 'A fully-monolithic SiGe-BiCMOS transceiver chip for 24 GHz applications,' in IEEE BCTM, 2003, pp. 181-184. [36] Natarajan, A. Komijani, and A. Hajimiri, 'A fully integrated 24-GHz phased-array transmitter in CMOS,' IEEE Journal of Solid-State Circuits, vol. 40, no. 12, Dec. 2005. [37] A. Komijani and A. Hajimiri, “A 24 GHz, +14.5 dBm fully-integrated power amplifier in 0.18um CMOS,” in Proc. IEEE Custom Integrated Circuits Conf., Oct. 2004, pp. 561-56. [38] H. Shigematsu, T. Hirose, F. Brewer, and M. Rodwell, “Millimeter Wave CMOS circuit design,” IEEE Trans. Microwave Theory Tech., vol.53, no. 2, Feb. 2005. [39] C. Cao, H. Xu, Y. Su , and K. K. O, “An 18 GHz, 10.9 dBm fully integrated power amplifier with 23.5% PAE in 130-nm CMOS.” in Proceeding of ESSCIRC, Grenoble, France, 2005, pp. 137-140. [40] A. V. Vasylyev, P. Weger, W. Bakalski, and W. Simbuerger, “17 GHz 50-60 mW power amplifier in 0.13-um standard CMOS.” IEEE Microwave and Wireless Components Letter, vol. 16, no.1, Jan. 2006. [41] J. P. Comeau, J. M. Andrews, and J. D. Cressler, “A monolithic 24 GHz, 20 dBm, 14% PAE SiGe HBT power amplifier,” in Proceeding of the 36th European Microwave Conference. Sept. 2006, pp. 149-146. [42] N. Kinayman, A. Jenkins, D. Helms, and I. Gresham, “Design of 24 GHz SiGe HBT balanced power amplifier for system-on-a-chip ultra-wideband applications,” in Radio Frequency Integrated Circuit symposium (RFIC), 2005, pp. 91-94. [43] J.-L. Kuo, Z.-M. Tsai and H. Wang “A 19.1-dBm fully -integrated 24 GHz power amplifier using 0.18-μm CMOS technology,” in Proceeding of the European Microwave Conference. Oct. 2008, pp. 558-561. [44] Y.-N. Jen, J.-H. Tsai, C.-T. Peng, and T.-W. Huang, “A 20 to 24 GHz 16.8 dBm fully integrated power amplifier using 0.18-μm CMOS process,” IEEE Microwave and Wireless Components Letter, vol. 19, no. 1, pp. 42- 44, Jan. 2005. [45] P.-C. Huang, J.-L. Kuo, Z.-M. Tsai and H. Wang, 'A 22-dBm power amplifier using 0.18 um CMOS technology,' in Microwave Symposium Digest (MTT), 2010, pp.248-251. [46] C.-C. Hung, J.-L. Kuo, K.-Y. Lin and H. Wang, 'A 22.5-dB gain, 20.1-dBm output power K-band power amplifier in 0.18 um CMOS,' in Radio Frequency Integrated Circuits Symposium (RFIC), 2010, pp. 557-560. [47] I. Aoki, S.D. Kee; D.B. Rutledge and A. Hajimiri, “Fully integrated CMOS power amplifier design using the distributed active-transformer architecture,” IEEE Journal of Solid-State Circuits, vol.37, no.3, pp.371-383, Mar 2002. [48] Y. Kawano, A. Mineyama, T. Suzuki, M. Sato, T. Hirose and K. Joshin 'A fully-integrated K-band CMOS power amplifier with Psat of 23.8 dBm and PAE of 25%,' in Radio Frequency Integrated Circuits Symposium, 2011. [49] A. Jentzsch and W. Heinrich, “Optimization of flip chip interconnects for millimeter wave frequencies,” IEEE MTT-S Int. Microwave Symp. Dig., pp. 637-640, June 1999. [50] Y. Arai, M. Sato, H.T. Yamada, T. Hamada, K. Nagai and H. I. Fujishiro, “60 GHz flip chip assembled MIC design considering chip-substrate effect,” IEEE Trans. on Microwave Theory and Techniques, vol.45, pp. 2261-2266, Dec. 1997. [51] T. Hirose, K. Makiyama, K. Ono, T. M. Shimura, S. Aoki, Y. Ohashi, S. Yokokawa and Y. Watanabe, “ A flip chip MMIC design with CPW technology in the W-band,” IEEE MTT-S Int. Microwave Symp. Dig., pp. 525-528, June 1998. [52] N.-H. Huynh, W. Heinrich, K. Hirche, W. Scholz, M. Warth and W. Ehrlinger, “Optimized flip chip interconnect for 38GHz thin-film microstrip multichip modules,” IEEE MTT-S Int. Microwave Symp. Dig., pp. 69-72, June 2004. [53] S. Song, Y. Kim, J. Maeng, H. Lee, Y. Kwon and K.-S. Seo, “A millimeter-wave system-on-package technology using a thin-film substrate with a flip chip interconnection,” IEEE Trans. on Advanced Packaging, vol. 32, pp. 101-108, Feb. 2009. [54] A. Jentzsch and W. Heinrich, “Theory and measurements of flip chip interconnects for frequencies up to 100 GHz,” IEEE Trans. on Microwave Theory Tech., vol. 49, no. 5, pp. 871–878, May 2001. [55] A. M. Niknejad and H. Hashemi. mm-Wave Silicon Technology, 60GHz and Beyond, Spriner, 2008. [56] R. C. Hansen. Phased array antennas, 2nd ed. New York: Wiley, 2009. [57] K. Van Caekenberghe, 'RF MEMS on the radar,' IEEE microwave magazine, vol. 10, no.6, pp. 99-116, Oct. 2009. [58] D.-W. Kang, J.-G. Kim, B.-W. Min and G. M. Rebeiz, 'Single and four-elements Ka-band transmitter/receiver phased-array silicon RFICs with 5-bit amplitude and phase control,' IEEE Transactions on Microwave Theory and Techniques, vol. 57, no. 12, pp. 3534-3543, Dec. 2009. [59] K.-J. Koh and G. M. Rebeiz 'An X- and Ku-band 8-elements phased-array receiver in 0.18 um SiGe BiCMOS technology,' IEEE Journal of Solid-State Circuits, vol. 43, no. 6, pp. 1360-1371, June 2008. [60] H. Hashemi, X. Guan, A. Komijani and A. Hajimili, 'A 24-GHz SiGe phased-array receiver-LO phase shifting approach,' IEEE Transactions on Microwave Theory and Techniques, vol. 53, no. 2, pp. 614-626, Feb. 2005. [61] A. Natarajan, A. Komijano, X. Guan, A. Babakhani and A. Hajimili, 'A 77-GHz phased-array transceiver with on-chip antenna in silicon: transmitter and local LO-path phase shifting,' IEEE Journal of Solid-State Circuits, vol. 41, no. 12, pp. 2807-2819, Dec. 2006. [62] T.-S. Chu and H. Haschemi, 'A true time-delay-base bandpass multi-beam array at mm-waves supporting instantaneously wild bandwidths,' in IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2000, pp. 38-39. [63] T.-Y. Chin, S.-F. Chang, J.-C. Wu and C.-C. Chang, 'A 25-GHz compact low-power phased-array receiver with continuous beam steering in CMOS technology,' IEEE Journal of Solid-State Circuits, vol. 45, no. 11, pp.2273-2282, Nov. 2010. [64] A. Valdes-Garcia, S. T. Nicolson, J.-W. Lai, A. Natarajan, P.-Y. Chen, S. K. C. Zhan, D. G. Kam, D. Liu and B. Floyd, 'A fully integrated 16-element phase-array transmitter in SiGe BiCMOS for 60-GHz communications,' IEEE Journal of Solid-State Circuits, vol. 45, no. 12, pp. 2757-2773, Dec. 2010. [65] A. Valdes-Garcia, S. T. Nicolson, J.-W. Lai, A. Natarajan, P.-Y. Chen, S. K. C. Zhan, D. G. Kam, D. Liu and B. Floyd, 'A fully integrated 16-element phase-array transmitter in SiGe BiCMOS for 60-GHz communications,' in IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2010, pp.218-219. [66] S. K. Reynolds, A. S. Natarajan, M.-D. Tsai, S. Nicolson, J.-H. C. Zhan, D. Liu, D. G. Kam, O. Huang, A. Valdes-Garcia and B. A. Floyd, 'A 16 elements phase-array receiver IC for 60-GHz communications in SiGe BiCMOS,' in IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2010, pp. 461-464. [67] D. G. Kam, D. Liu, A. Natarajan, S. Reynold and B. A. Floyd, 'Low-cost antenna in package solutions for 60-GHz phased-array systems,' in IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010, pp. 93-96. [68] R. Suga, H. Nakano, Y. Hirachi, J. Hirokawa and M. Ando, 'Cost-effective 60-GHz antenna package with end-fire radiation for wireless file-transfer system,' IEEE Transactions on Microwave Theory and Techniques, vol. 58, no. 12, pp. 3989-3995, Dec. 2010. [69] William Greig. Integrated circuit packaging, assembly and interconnection, Springers, 2007. [70] John D. Kraus and Roland J. Marhefka. Antenna for all applications, 3rd ed. McGraw-Hill, 2002. [71] J.-L. Kuo, Z.-M. Tsai, K.-Y. Lin and H. Wang, 'A 50 to 70 GHz power amplifier using 90nm CMOS technology,' IEEE Microwave and Wireless Component Letter, vol. 19, no. 1, pp. 45-47, Jan. 2009. [72] J.-L. Kuo, Z.-M. Tsai, K.-Y. Lin and H. Wang, 'A V-band power amplifier in 0.13 um CMOS (invited paper),' in Asia Pacific Microwave Conference, 2008, pp. 1-4. [73] T.-P. Wang, R.-C. Liu, H.-Y. Chang, J.-H. Tsai, L.-H. Lu and H. Wang, 'A 30-GHz low-phase-noise 0.35 um CMOS push-push oscillator using micromachined inductors,' in IEEE International Microwave Symposium, 2006, pp. 569-572. [74] I.-S. Chan, H.-K. Chiou and N.-W. Chen, 'V-band on-chip dipole-based antenna,' IEEE Transactions on Antennas and Propagation, vol. 57, no. 10, pp. 2853-2861, Oct. 2009. [75] S. Kishomoto, N. Orihashi, Y. Hamada, M. Ito and K. Maruhashi, 'A 60-GHz band CMOS phased array transmitter utilizing compact baseband phase shifters,' in IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2009, pp. 215-218. [76] E. Cohen, C. Jackson, S. Ravid and D. Ritter, 'A bidirectional TX/RX four element phased-array at 60-GHz with RF-IF conversion block in 90nm process,' in IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2009, pp. 207-210. [77] C.-L. Wang and R.-B. Wu, 'Modeling and design for electrical performance of wideband flip chip transition,' IEEE Trans. on Advanced Packaging, vol. 26, pp. 385-391, Apr. 2003. [78] Y.-S. Jiang, J.-H. Tsai and H. Wang, “A 86 to 108 GHz amplifier in 90nm CMOS,” IEEE Microwave Wireless Components Letter, vol.18, no.2, pp. 124-126, Feb. 2008. [79] Y.-S. Jiang, J.-H. Tsai, and H. Wang, 'A W-Band medium power amplifier in 90nm CMOS,' IEEE Microwave Wireless Components Letter, vol.18, no.12, pp. 818-820, Dec. 2008. [80] J.-H. Tsai, H.-Y. Yang, T.-W. Huang and H. Wang, 'A 30-100 GHz wideband sub-harmonic active mixer in 90nm CMOS technology,' IEEE Microwave Wireless Components 1etter, vol.18, no.8, pp. 554-556, Aug. 2008. [81] L. H. Truong, Y.-H. Baek, M.-K. Lee, S.-W. Park, S.-J. Lee and J.-K. Rhee, 'High performance 94 GHz planar quasi-yagi antenna on GaAs substrate,' Microwave and Optical Technology Letters, vol. 51, no. 10, pp. 2396-2400, Oct. 2009. [82] H.-C. Lu, C.-C. Kuo, P.-A. Lin, C.-F. Tai, Y.-L. Chang, Y.-S. Jiang, J.-H. Tsai, Y.-M. Hsin, and H. Wang, 'Flip chip assembled W-band CMOS chip modules on ceramic substrate with transition compensation for millimetre-wave system-in-package integration,” IEEE Trans. Microwave Theory and Tech, vol. 60, no. 2, pp. 766-777, Jan. 2012. [83] C.-C. Kuo, H.-C. Lu, P.-A. Lin, C.-F. Tai, Y.-M. Hsin and H. Wang, “A fully SiP integrated V-band butler matrix end-fire beam switching transmitter using flip chip assembled CMOS chips on LTCC,” IEEE Transactions on Microwave Theory and Techniques, vol. 60, no. 5, pp. 1424-1436, May 2012. [84] “Design Manual of 1P6M 0.18 um CMOS,” TSMC. 2008, Hsin-Chu, R.O.C. [85] “Design Manual of 1P9M 90 nm CMOS, “TSMC. 2010, Hsin-Chu, R.O.C. [86] “Design Manual of 0.15 um power pHEMT,” WIN semiconductor. 2007, Taoyaun, R.O.C. [87] 'Sonnet User's Manual, Release 9.0,' Sonnet Software, Inc., May, 2003, Syracuse, NY. [88] B.-J. Huang, K.-Y. Lin and Huei Wang, “Millimeter-Wave Low Power and Miniature CMOS Multicascode Low-Noise Amplifiers with Noise Reduction Topology,” IEEE Transactions on Microwave Theory and Techniques, vol. 57, no. 12, pp. 3049-3059, May 2009. [89] J. Das, H. Oprins, J. Hangfeng, A. Sarua, W. Ruythooren, J. Derluyn, M. Kuball, M. Germain and G. Borghs “ Improved thermal performance of AlGaN/GaN HEMTs by an optimized flip-chip design” IEEE Transactions on electron devices, vol. 53, no. 11, pp. 2696-2702, Nov. 2006. [90] A. Tang, G. Virbila, D. Murphy, F. Hsiao, Y.-H. Wang, Q. J. Gu, Z. Xu, Y. Wu, M. Zhu, M.-C. F. Chang, 'A 144GHz 0.76cm-Resolution Sub-Carrier SAR Phase Radar for 3D Imaging in 65nm CMOS', IEEE International Solid-State Circuits Conference (ISSCC 2012), pp. 264-266, Feb. 19-23, 2012 [91] “HFSS User’s Manual, Release 5.0”, Ansys, Inc. San Jose, CA, 2008. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/15876 | - |
dc.description.abstract | 隨著無線通訊高度發展,積體化的電路對於晶片面積的需求度越趨嚴格,對於電路設計者,總是要在相同的電路特性下,挑戰最小的電路面積,這個也是電路設計者長久以來所追求的系統晶片(System on Chip, SoC) 概念。再者,系統構裝(System-in-Package, SiP)的概念,在這幾年中已經萌芽生長,系統構裝的精隨著重於特性分工,不適應用於晶片設計上的電路,將可以利用系統構裝的概念,來達到更高整合度。無論在電路特性最佳化,或是成本的考量都是系統構裝最大的優點。在此篇論文中,我們分別從系統晶片與系統構裝的角度,來探討電路設計與系統研發。本論文是國內第一篇使用封裝的角度來設計毫米波電路與系統整合的論文,並使用許多不同的封裝技術方法實現。
論文的第一部分晶片變壓器實現於混波器以及功率放大器。我們將晶片變壓器應於到射頻混頻器當中,與發展了馬遜雙巴倫(Marchand Dual Balun)。並且利用此馬遜雙巴倫做佈局方面的改變,進一步發明了改良式鼠競一百八十度混成器(Modified Rat Race 180° Hybrid)。在此論文中,我們展示了三個星狀混波器(Star Mixer),搭配了三種不同的馬遜雙巴倫佈局。馬遜雙巴倫的應用還可以用在一個新的雙平衡電阻性次諧波混波器上,此新架構不但可以保有原來的混頻器功能,而且改善了兩倍本地振盪訊號隔離度。我們也實現了在互補式金氧半導體的24-GHz全變壓器式功率放大器,利用變壓器的設計佈局,使其特性在所有的文獻中達到最高的功率面積比。 在此論文的第二個部份,是使用系統封裝的概念,來研發多晶片模組(Multi-Chip Module, MCM)毫米波的系統。我們以低溫共燒陶瓷(Low Temperature Co-fired Ceramic, LTCC)為作為載板(Carrier)來實現了一個V頻段巴特勒矩陣(Butler Matrix)切換式波束(Switched Beam)相位陣列發射器。此發射器整合了十多個互補式金氧半毫米波晶片,包含了振盪器,本地振盪緩衝放大器,功率放大器,相移器等。我們更實現了一個新型的立體式摺疊型單極化天線(Vertical Folded Monopole Antenna)。此發射器不但是第一個利用金氧半導體多晶片模組封裝的概念實現的V頻段發射器,也第一個使用端火(End-fire)輻射方向的發射器。 在更高頻的應用中,我們實現了W頻段金氧半導體晶片的多晶片模組封裝,在這個頻段下,覆晶柱體(Flip Chip Bump)的一些寄生效應已經相當明顯。經由簡單的公式估算下,我們可以得知整個轉接呈現了電容性的特性,所以高阻抗(電感)的補償電路就可將返回損耗的頻率漂移補償。三個W頻段的電路分別有裸晶,無補償,以及補償電路的比較。因切割(Dicing)的不準確性,而導致了等校電路中的寄生電容造成變化,所以我們也分析了改善的等效電路並以三個金氧半電路驗證。最後,本論文也採用一個陶瓷基板平面式的八木(YagiUda)天線並且展示一組簡單的W頻段的發射器與接收器。 | zh_TW |
dc.description.abstract | With the development of wireless communications, the miniature chip area of integrated circuit chip becomes more valuable, and the circuit designers always try to challenge the smallest circuit area with the same circuit characteristics. This is the reason that system on chip (SoC) concept was proposed. Furthermore, the concept of system in package (SiP) was bought up in the past few years. The essence of the SiP is chip heterogeneous processes integration. For the circuits which are not suited to be designed on chip, it will be able to use the concept of system packaging to achieve higher level integration for the circuit characteristics and cost considerations.
In the first part of dissertation, we propose miniaturization Marchand dual balun and modified rat race 180° hybrid. Three different types of star mixers are demonstrated with different dual balun. Furthermore, a new sub-harmonic mixer topology with dual blaun is proposed. This new mixer structure will not only be able to keep the original function of the mixer, but also to improve the isolation of twice LO signal. The transformer can be used for amplifier design. A 24-GHz CMOS transformer combined power amplifier is also demonstrated, which achieves the highest power to area ratio compared with all published literature. The concept of using the system package is used to develop multi-chip module (MCM) millimeter-wave system in the second part of this dissertation. A V-band Butler matrix switched beam phased-array transmitter is demonstrated. Furthermore, a new type of vertical folding type monopole antenna is proposed. This transmitter is the first MCM packaging concept demonstration in the V-band application, and the first V-band phased array with end-fire radiation direction. Regarding the higher frequency as W band, the parasitic of the flip chip bump has a significant performance effect; therefore the bump equivalent circuit is studied for W band application. Besides, the compensation of flip chip transition is also discussion. We present a W-band CMOS MCM including two amplifiers and a down converted mixer. The entire transition of the flip chip shows capacitive characteristics, so the compensation circuit of the high-impedance (inductance) is used for return loss compensation. Three W-band circuit dies are measured via wafer probing without compensation, and with compensation network. Unfortunately, the parasitic capacitor in bump equivalent circuit is sensitive in such high frequency due to the inaccuracy of dicing. Therefore, we also analyze equivalent circuit with the dicing tolerance. The new circuit model is also verified by three CMOS circuits. Finally, the W-band transmitter and receiver antenna also demonstrated with Yagi-Uda antenna on ceramic. | en |
dc.description.provenance | Made available in DSpace on 2021-06-07T17:54:16Z (GMT). No. of bitstreams: 1 ntu-101-D94942005-1.pdf: 4648696 bytes, checksum: df7de5b89e69c288784a8c964b386ba2 (MD5) Previous issue date: 2012 | en |
dc.description.tableofcontents | 誌謝 ii
中文摘要 vi ABSTRACT viii CONTENTS x LIST OF FIGURES xii LIST OF TABLES xxii Chapter 1 Introduction 1 1.1 Motivation 1 1.2 Literature Survey 3 1.2.1 Star Mixer 3 1.2.2 K-band CMOS Power Amplifier 4 1.2.3 V-band phased array 4 1.2.4 W-band Packaging Using Flip-Chip Package 5 1.3 Contribution 6 1.4 Thesis organization 8 Chapter 2 Transformer for RF and MMW Applications 9 2.1 Introduction 9 2.2 On-chip Transformer for Miniature Dual Marchand Balun and Modified Rat Race 180° Hybrids 9 2.2.1 Dual Marchand Balun and Modified Rat Race 180° Hybrid 12 2.3 On-chip Transformers for Power Amplifier Application 46 2.3.1 Introduction 46 2.3.2 Fully Integrated Miniature 24-GHz Transformer Power Amplifier in 0.18-um CMOS Process 47 2.3.3 Measurement 50 Chapter 3 System in Package for MMW Multi-Component Modules System 55 3.1 Introduction of the Flip Chip Process, Equivalent Circuit Model of Bump 55 3.2 V-band Butler Matrix Phased Array Transmitter 60 3.2.1 Introduction and Discussed of the Phased Array 60 3.2.2 The Development of the Butler Matrix Transmitter 62 3.2.3 The Embedded Vertical Folded Monopole Antenna 67 3.2.4 The Performance of Sub-circuits 72 3.2.5 Experiments and Measurements 80 3.2.6 Discussion 87 3.3 W-band CMOS Chip Sets on CIPD with Transition Compensation 89 3.3.1 Introduction 89 3.3.2 The High Impedance Compensation 90 3.3.3 CMOS Chip Modules on CIPD 93 3.3.4 W-band Flip Chip Assembled Transmitter and Receiver with Yagi-Uda Antenna on CIPD 106 Chapter 4 Conclusion and Suggested Studies 111 4.1 Conclusion 111 4.2 Suggested Studies 112 REFERENCE 114 | |
dc.language.iso | en | |
dc.title | 變壓器與系統構裝應用於微波與毫米波電路 | zh_TW |
dc.title | Transformer and System in Package for RF and Millimeter-wave Circuit Applications | en |
dc.type | Thesis | |
dc.date.schoolyear | 100-2 | |
dc.description.degree | 博士 | |
dc.contributor.coadvisor | 盧信嘉(Hsin-Chia Lu) | |
dc.contributor.oralexamcommittee | 瞿大雄(Tah-Hsiung Chu),蔡作敏(Zuo-Min Tsai),蔡政翰(Jeng-Han Tsai),張志揚(Chi-Yang Chang),辛裕明(Yue-Ming Hsin) | |
dc.subject.keyword | 混波器,功率放大器,平衡對不平衡轉換器,覆晶封裝,相位陣列,天線, | zh_TW |
dc.subject.keyword | mixers,power amplifiers,balun,flip-chip package,phased-array antenna,antenna., | en |
dc.relation.page | 126 | |
dc.rights.note | 未授權 | |
dc.date.accepted | 2012-08-17 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電信工程學研究所 | zh_TW |
顯示於系所單位: | 電信工程學研究所 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-101-1.pdf 目前未授權公開取用 | 4.54 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。