請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/15483
完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 吳瑞北(Ruey-Beei Wu) | |
dc.contributor.author | Yu-Sheng Lin | en |
dc.contributor.author | 林裕盛 | zh_TW |
dc.date.accessioned | 2021-06-07T17:41:03Z | - |
dc.date.copyright | 2020-07-22 | |
dc.date.issued | 2020 | |
dc.date.submitted | 2020-07-17 | |
dc.identifier.citation | [1] Cisco Inc., Cisco Visual Networking Index: Forecast and Trends, 2017-2022 White Paper, Feb. 2019 [2] The 2019 Ethernet Roadmap [Online]. Available: https://ethernetalliance.org/the-2019-ethernet-roadmap/ [3] LightCounting Inc., High-Speed Ethernet Optics, Ed. 9, Mar. 2019 [4] R. Blum, “Scaling the compute and high speed networking needs of the data center with silicon photonics,” 43rd Euro. Conf. Optical. Comm., Sept. 2017 [5] C. Cole, “Beyond 100G client optics,” IEEE Comm Mag., vol. 50(2), Feb 2012. [6] M. Fields, “Optics vs copper for in-chassis connections@56-112Gbps: Is copper still a viable solution?” DesignCon, 2016 [7] M.Rakowski, “Silicon photonics platform for 50G optical interconnects, “ IMEC, Leuven, Belgium, Photonics Summit Workshop, 2017 [8] J. Sakai, A.Noda, M. Yamagishi, T. Ohtsuka, K.Sunaga, H.Sugita, H. Takahashi, M. Oda, H. Ono, K. Yashiki, and H. Kouta, “20Gbps/ch optical interconnection between SerDes devices over distances from chip-to-chip to rack-to-rack,” 34th Euro. Conf. Optical Comm., Sept. 2008 [9] N. Dikhaminijia, J. He, E. Hernandez, M. Tsiklauri, J. Drewniak, A. Chada, M.Zvonkin, and B. Mutnury, “High-speed serial link challenges using multi-level signaling,” IEEE 24th Electrical Perform. Electronic Packag. Syst. (EPEPS), 2015 [10] 張瑋儒,脈衝振幅調變於高速串列解串列系統中眼圖分析與等化設計,國立台灣大學碩士論文,2018年8月 [11] L. Zeng, X. Song, J. Mang, and W. Chen, ”PAM4 transmission for short reach optical interconnection,” in IEEE 14th Optical Comm. Networks (ICOCN) Conf., 2015 [12] N. C. Chen, T. H. Hsieh, J. Jinn, P. H. Chang, F. Huang, J.W. Xiao, A. Chou, and B. Lin, “A novel system in package with fan-out WLP for high speed SerDes application,” IEEE 66th Electron. Compon. Technol. Conf., pp.1496-1501, 2016 [13] 張伯瑜,晶圓級系統構裝於高速串列通訊介面的訊號完整度設計,國立台灣大學碩士論文,2017年7月 [14] 盧廷昌,王興宗,半導體雷射導論,五南圖書出版,2013年12月 [15] http://www.cybernet-ap.com.tw/zh.php?m=743 t=71 [16] Z. K. Weng, Y. C. Chi, H. Y. Wang, C. T. Tsai, and G. R. Lin, “75-km Long reach dispersion managed OFDM-PON at 60Gbit/s with quasi-color-free LD,” IEEE J. Lightw. Technol., vol. 36, no.12, pp. 2394-2408, June. 2018 [17] A. Mutig, G. Fiol, K. Potschke, P. Moser, D. Arsenijevic, V. A. Shchukin, N. N. Ledentsov, S. S. Mikhrin, I. L. Krestnikov, D. A. Livshits, A. R. Kovsh, F. Hopfer, and D. Bimberg, ”Temperature-dependent small-signal analysis of high-speed high-temperature stable 980-nm VCSELs,” IEEE J. Quantum Electronics, vol. 15, no.3, pp. 679-686, Feb. 2009 [18] J. Lee, P. C. Chiang, P. J. Peng, L. Y. Chen, and C. C. Weng, “Design of 56Gb/s NRZ and PAM4 SerDes transceivers in CMOS technologies,” IEEE J. Solid-State Circuits, vol. 50, no.9, pp. 2061-2073, Sept. 2015 [19] 張仲傑,以光濾波器實現光學等化改善高速光傳輸系統,國立台灣科技大學碩士論文,2017年7月 [20] F. Gardes, G. Mashanovich and G. Reed, “Evolution of optical modulation in silicon-on-insulator devices,” SPIE Newsroom, 2007 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/15483 | - |
dc.description.abstract | 由於網路交換機在速度上的持續成長,電訊號傳輸已無法滿足現今的規格,因此未來的發展趨勢為在晶片以及封裝內部極短距離的走線使用電傳輸而幾十公分以上的傳輸距離則使用光傳輸,而如何維持整條電-光互連的信號完整性正是本論文分析的重點。本論文利用是德科技(Keysight)的Advanced Design System(ADS)配合新思科技(Synopsys)的Rsoft(Optsim)完成電-光的co-simulation。在整個訊號路徑的分析包含了不同的輸入調變方式以及光學元件的選擇對整體系統輸出表現的影響。因應下一世代的交換機頻寬需求,使用PAM4輸入搭配MZM調變器達到100Gbps傳輸。 | zh_TW |
dc.description.abstract | Due to the increasing speed of Ethernet switches, electrical transmission can’t support the specifications nowadays. Therefore, the electrical transmission will be used in extremely short distance propagation such as the internal trace of IC or packages, and when it comes to long distance propagation, optical transmission will be preferred. How to maintain the signal integrity through the electro-optic interconnects is the key point in this document. The thesis completes the co-simulation between electrical and optical parts by using ADS from Keysight and Rsoft(OptSim) from Synopsys. The analysis through signal trace includes the influence on whole system performance from different input modulation and optical component selection. Furthermore, the 100Gbps transmission simulation is achieved by using PAM4 modulation and MZM modulator in response to the demand of switch bandwidth in next generation. | en |
dc.description.provenance | Made available in DSpace on 2021-06-07T17:41:03Z (GMT). No. of bitstreams: 1 U0001-1707202012061600.pdf: 7222736 bytes, checksum: e2859bcddad18bb93ec0ca7b3b1cc23e (MD5) Previous issue date: 2020 | en |
dc.description.tableofcontents | 口試委員會審定書 i 致謝 ii 摘要 iv Abstract v 第壹章 緒論 1 1.1. 研究動機 1 1.2. 文獻回顧 4 1.3. 主要貢獻 5 1.4. 章節內容概述 5 第貳章 理論 7 2.1. 電傳輸 vs 光傳輸 7 2.2. 高速SerDes含光網路的系統層架構 9 2.3. 高速SerDes晶片封裝層介紹 12 2.4. 半導體雷射(Laser Diode)操作原理與基本特性 14 2.5. 光纖傳播原理 20 2.6. 檢光器(Photo Diode)及轉阻放大器(TIA)原理 22 第參章 電光整合及等化器設計 24 3.1. Rsoft(OptSim)光學模擬軟體介紹 24 3.2. ADS和Rsoft(OptSim)之軟體整合 25 3.3. 有限脈衝響應濾波器電路(FIR)均衡原理及其選擇 33 第肆章 傳統直調雷射搭配NRZ輸入之系統分析 38 4.1. 操作在10Gbps下配合DFB之系統表現 38 4.2. 模擬和實驗結果比較 40 4.3. VCSEL基本原理與其在25Gbps下之系統表現 44 4.4. 多模光纖比較 46 第伍章 高速操作下搭配PAM4輸入之系統分析 50 5.1. PAM4 vs NRZ 50 5.2. Rsoft(OptSim)架設PAM4發射器與其配合25Gbps VCSEL之系統表現 51 5.3. 電致吸收式調變器(EAM)操作原理 55 5.4. 操作在25Gbps和50Gbps下配合EAM之系統表現 57 5.5. 使用MZM調變器操作至100Gbps之系統表現 60 5.6. 總比照表 63 第陸章 結論 65 參考文獻 66 | |
dc.language.iso | zh-TW | |
dc.title | 下一世代高速串列解串列系統在晶圓級封裝下電-光互連之訊號完整度分析 | zh_TW |
dc.title | SI Analysis of Electro-Optic Interconnects for Next Generation High Speed SerDes System in WLP-SiP | en |
dc.type | Thesis | |
dc.date.schoolyear | 108-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 林恭如(Gong-Ru Lin),吳肇欣(Chao-Hsin Wu),李三良(San-Liang Lee),邱奕鵬(Yih-Peng Chiou) | |
dc.subject.keyword | 電-光互連,晶圓級封裝,脈衝振幅調變,等化器,半導體雷射,光纖,矽光子,積體光學, | zh_TW |
dc.subject.keyword | Electro-optic Interconnects,Wafer Level Package,Pulse Amplitude Modulation,Equalizer,Semiconductor Laser,Fiber,Silicon Photonics,Integrated Optics, | en |
dc.relation.page | 67 | |
dc.identifier.doi | 10.6342/NTU202001593 | |
dc.rights.note | 未授權 | |
dc.date.accepted | 2020-07-17 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電信工程學研究所 | zh_TW |
顯示於系所單位: | 電信工程學研究所 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
U0001-1707202012061600.pdf 目前未授權公開取用 | 7.05 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。