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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 楊申語 | |
dc.contributor.author | Huei-Wun He | en |
dc.contributor.author | 何慧文 | zh_TW |
dc.date.accessioned | 2021-05-20T21:49:35Z | - |
dc.date.available | 2013-05-06 | |
dc.date.available | 2021-05-20T21:49:35Z | - |
dc.date.copyright | 2010-08-09 | |
dc.date.issued | 2010 | |
dc.date.submitted | 2010-08-02 | |
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/10681 | - |
dc.description.abstract | 軟性電子元件具有可撓性、輕薄短小且易於攜帶,其製造需以有機薄膜電晶體作為顯示器開關,如何將其製作在塑膠薄膜基材上是一大挑戰。微轉印製程簡單、快速且無須昂貴設備,可直接製作無殘留層之微結構。本論文建立微轉印製程技術應用於有機薄膜電晶體製程,包括:一、轉印模具的製作;二、微轉印製程的開發;三、有機薄膜電晶體的製程。
首先轉印模具製作方面,本研究以乾膜光阻搭配塑膠基材定義圖案來製作梳狀微結構母模,再利用PDMS翻鑄技術製作軟模,可完整複製母模微結構,且軟模頂部平整。 接著微結構轉印製程開發部分,首先探討材料表面能的影響與控制機制,再以光學顯微鏡觀察PDMS軟模實際受力變形的狀態。利用微結構轉印製程轉印導電銀膠,以不同的製程參數如轉印壓力、溫度和時間等來控制轉印結果。實驗結果發現:以低溫轉印時,銀膠未能受到足夠加溫而過濕;若加熱溫度過高時,銀膠溶劑揮發太快,銀膠附著於PDMS 上無法轉印。壓力過低則PDMS 無法均勻接觸於基材,壓力過大則會造成模具變形過大,輪廓破碎。轉印時間過短,則未接觸完全;但若過久,銀膠附著於PDMS上,導致轉印失敗。本研究找出適當的製程組合,將銀膠梳狀電極成功轉印至PMMA基材上,且無殘留層。 最後,關於有機薄膜電晶體製程方面,先以旋塗方式製作PMMA介電層,同時探討在不同製程參數下介電層的電容品質與漏電流等特性,接著在介電層上應用微轉印技術直接轉印銀膠製作源極/汲極,驗證可成功轉印微結構電極;最後以液滴塗佈P3HT半導體材料,完成全套有機薄膜電晶體製程。 | zh_TW |
dc.description.abstract | Soft electronics devices based on organic thin-film transistors (OTFTs) possess a lot of advantages, such as flexibility, light weight and portability. The key to fabricate organic thin-film transistors on plastic substrate is one of the biggest challenges. Micro-transfer stamping technique is a simple and low-cost process to directly fabricate microstructure without residual layer. This study develops the micro-transfer stamping technique for the fabrication of OTFTs, including: 1. Investigation and fabrication of stamping mold; 2. Development of micro-transfer stamping process; 3. Implementation of complete process for fabrication of organic thin-film transistors.
First, in the topic of “Investigation and fabrication of stamp mold”, we used dry-film photoresist to rapidly define the interdigitated micro-patterns on the PET substrates, and after developing, the microstructured dry-film photoresist was used as the master mold for casting PDMS mold. The PDMS mold has faithful duplication of micro-patterns in the master mold with smooth bottom surface. Second, in the topic of “Development of micro-transfer stamping process”, we investigated the effect of surface energy of materials and developed mechanism for effective stamping. The real deformation of PDMS mold was observed using optical microscopy. We demonstrated the micro-transfer stamping technique can be used to transfer conductive silver paste on PMMA substrate, and with different process conditions (pressure, temperature and transfer time), the stamping results can be obtained. It was found that: Under low temperature, the silver paste cannot be adequately heated and the viscosity is too low; but if the temperature is too high, the solvent will quickly evaporate causing the silver paste adhere to PDMS mold. Too low pressure fails to ensure the PDMS in uniform contact with the substrate, while excessive pressure will lead to severe deformation of PDMS mold, crumbling the contour of silver paste. PDMS will fail to be in complete contact with the substrate if the transfer time is too short; on the other hand, if the duration is too long, the silver paste will attach to PDMS mold causing the transfer failure. Under proper process parameters, we have succeeded in directly patterning the interdigitated electrode of silver paste without residual layer. In the last topic of “Fabrication of organic thin-film transistors (OTFTs)”, the PMMA was spin coated for the dielectric layer on the ITO/PET flexible film that serve as gate/substrate, and the characteristics of dielectric such as capacitance and leakage under various conditions were discussed. We also proved that the stamping technique can apply to directly transferring source/drain structure of OTFTs. The P3HT semiconductive layer was then coated on source/drain electrode by drop casting to complete the fabrication of OTFTs. | en |
dc.description.provenance | Made available in DSpace on 2021-05-20T21:49:35Z (GMT). No. of bitstreams: 1 ntu-99-R97522703-1.pdf: 14444720 bytes, checksum: 0a8f0f4316a02d849df2fab0d9d321a0 (MD5) Previous issue date: 2010 | en |
dc.description.tableofcontents | 誌謝 I
摘要 II Abstract III 目錄 V 圖目錄 VIII 表目錄 XIV 第一章 導論 1 1.1 前言 1 1.2 微結構製作技術介紹 1 1.3 應用軟式模具轉印 2 1.4 有機薄膜電晶體 2 1.5 研究動機與研究方向 3 1.6 論文架構 4 第二章 文獻回顧 7 2.1 微結構轉印技術 7 2.2 有機薄膜電晶體介紹 9 2.2.1 有機半導體材料 9 2.2.2 有機薄膜電晶體元件 10 2.3 有機薄膜電晶體製程相關文獻 12 2.3.1 電極製作 12 2.3.2 半導體層製作 14 2.3.3 轉印墨水材料 15 2.4 文獻總體回顧與研究創新 16 第三章 實驗流程與初步製程探討 31 3.1 實驗流程與方法 31 3.2 微結構圖案母模製作 31 3.2.1 光罩設計 31 3.2.2 實驗使用之乾膜光阻 32 3.2.3 製作微結構母模 33 3.2.4 微結構圖案母模製作結果與討論 34 3.3 PDMS軟模製作 35 3.3.1 PDMS基本性質與介紹 35 3.3.2 翻製PDMS軟模 36 3.3.3 PDMS翻模結果討論 38 3.4 塑膠微熱壓成型複製微結構圖案母模 38 3.5 實驗儀器 39 第四章 軟模轉印製程之開發研究 55 4.1 軟模轉印製程開發與介紹 55 4.1.1 軟模轉印製程介紹 55 4.1.2 軟模轉印機制 55 4.1.3 實驗使用之材料表面能討論 56 4.1.4 加壓方式介紹 57 4.1.5 轉印之墨水 58 4.1.6 轉印製程步驟 58 4.2 PDMS模具轉印過程變形探討 58 4.3 銀膠電極轉印製程參數探討 60 4.4 轉印結果與討論 63 第五章 有機薄膜電晶體之元件製作 89 5.1 有機薄膜電晶體各層材料介紹 89 5.1.1 基材與閘極層材料 89 5.1.2 介電層材料 89 5.1.3 源極/汲極材料 90 5.1.4 半導體層材料 90 5.2 介電層製作 91 5.2.1 接觸角量測 92 5.2.2 PMMA膜厚與表面粗糙度量測 92 5.2.3 電容值量測 93 5.2.4 漏電流量測 95 5.3 源極/汲極製作 96 5.4 半導體層製作 96 5.5 有機薄膜電晶體製作總結 97 第六章 結論與未來展望 111 6.1 結論 111 6.2 原始貢獻 112 6.3 未來研究方向與展望 112 參考文獻 116 | |
dc.language.iso | zh-TW | |
dc.title | 應用微接觸轉印技術於有機薄膜電晶體製作 | zh_TW |
dc.title | Application of micro transfer stamping technique on the
fabrication of organic thin-film transistor | en |
dc.type | Thesis | |
dc.date.schoolyear | 98-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 謝國煌,鄭榮偉 | |
dc.subject.keyword | 微轉印技術,銀膠,PMMA,P3HT,有機薄膜電晶體, | zh_TW |
dc.subject.keyword | soft electronics,micro-transfer stamping,silver paste,PMMA,P3HT,OTFTs, | en |
dc.relation.page | 119 | |
dc.rights.note | 同意授權(全球公開) | |
dc.date.accepted | 2010-08-02 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
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