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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/103297| 標題: | 中小型設備商技術發展與動態策略評估: 以暉盛科技為例 Technology Development and Dynamic Strategy Evaluation of Small and Medium-Sized Equipment Manufacturers: A Case Study of NEMS Technology |
| 作者: | 許嘉元 Chia-Yuan Hsu |
| 指導教授: | 劉啟群 Chi-Chun Liu |
| 共同指導教授: | 尤琳慧 Lin-Hui Yu |
| 關鍵字: | 中小型設備商; 高密度電漿; 先進封裝; 製程即服務; 協同開發; 動態能力; 暉盛科技 small and medium-sized equipment manufacturers; high-density plasma; advanced packaging; Process as a Service; joint development; dynamic capabilities; NEMS Technology |
| 出版年 : | 2026 |
| 學位: | 碩士 |
| 摘要: | 台灣高科技設備產業在全球半導體、先進封裝、IC 載板與高階印刷電路板供應鏈中扮演重要角色,然而多數本土設備商仍屬中小型企業,普遍面臨資源有限、客戶集中、國際大廠競爭與產業景氣循環波動等挑戰。近年人工智慧、高效能運算、5G 通訊、車用電子與 ESG 綠色製造需求快速成長,使傳統濕式製程逐漸受到微細化、環保與成本壓力限制,也提高乾式電漿製程設備在表面清潔、去膠渣、蝕刻、表面活化與低損傷處理上的戰略價值。
本研究採單一個案研究法,以暉盛科技股份有限公司為研究對象,探討中小型設備商如何在有限資源下,透過核心技術累積、平台化設計、製程服務化與動態策略調整,建立長期競爭優勢。暉盛科技成立於 2002 年,係以高密度電漿表面處理技術為核心之專業製程設備商,其應用範圍涵蓋 PCB、IC 載板、半導體先進封裝、晶圓再生、感測元件及 ESG 綠色製程等領域。公司於 2024 年 3 月 18 日登錄興櫃,並已於 2025 年 11 月 4 日正式在上市創新板上市。此一資本市場進程不僅提升公司治理透明度與國際客戶信任,也有助於支撐長週期研發投入、強化人才吸引力,並提高公司於全球高階製程設備市場之能見度。 研究發現,暉盛科技之競爭優勢主要來自四項能力。第一,透過完全自主研發掌握電漿源、腔體設計、氣體流場、真空控制、電控軟體與製程參數,建立不依賴外部授權的技術自主性。第二,藉由「核心平台+應用模組」的模組化架構,將高密度電漿技術延伸至 ABF 載板乾式蝕刻、Hybrid Bonding 前處理、FOPLP、晶圓再生與甲烷裂解等應用,降低單一產業景氣波動風險。第三,透過製程即服務(PaaS)與國際 Tier-1 客戶協同開發(JDP),由單純設備銷售轉向客戶製程開發夥伴,形成技術綁定與較高轉換成本。第四,在智財策略上,暉盛採取專利、營業秘密與ERP、PLM系統化管控並行之方式,並逐步強化國際專利與海外市場防禦能力。 整體而言,本研究指出,中小型高科技設備商不必然以規模取勝,而可透過「技術專精、平台延伸、客戶共創、制度升級與動態調整」建立不可替代性。暉盛科技個案顯示,當企業能將單一核心技術平台持續延伸至高成長應用市場,並結合公開市場治理、國際客戶認證與全球供應鏈布局,即能在景氣波動與國際競爭中形成兼具技術深度與策略彈性的成長模式。 Taiwan’s high-tech equipment industry plays an important role in the global supply chains of semiconductors, advanced packaging, IC substrates, and high-end printed circuit boards. However, most domestic equipment manufacturers remain small and medium-sized enterprises, commonly facing challenges such as limited resources, customer concentration, competition from international corporations, and fluctuations in industry cycles and capital expenditures. In recent years, the rapid growth of artificial intelligence, high-performance computing, 5G communications, automotive electronics, and ESG-oriented green manufacturing has increasingly subjected traditional wet processes to the constraints of miniaturization, environmental requirements, and cost pressures. These trends have also enhanced the strategic value of dry plasma process equipment in surface cleaning, desmearing, etching, surface activation, and low-damage treatment. This study adopts a single-case study approach, using NEMS Technology Co., Ltd. as the research subject to examine how small and medium-sized equipment manufacturers can establish long-term competitive advantages under resource constraints through the accumulation of core technologies, platform-based design, process servitization, and dynamic strategic adjustment. Founded in 2002, NEMS Technology is a professional process equipment manufacturer centered on high-density plasma surface treatment technology. Its applications cover PCB, IC substrates, semiconductor advanced packaging, wafer reclaim, sensing components, and ESG-oriented green processes. The company was registered on the Emerging Stock Board on March 18, 2024, and was officially listed on the Taiwan Innovation Board on November 4, 2025. This capital market progression not only enhances corporate governance transparency and international customer trust, but also supports long-cycle R&D investment, strengthens talent attraction, and increases the company’s visibility in the global high-end process equipment market. The findings indicate that NEMS Technology’s competitive advantages are mainly derived from four capabilities. First, through fully independent R&D, the company has mastered plasma sources, chamber design, gas flow fields, vacuum control, electrical control software, and process parameters, thereby establishing technological autonomy independent of external licensing. Second, through a modular architecture of “core platform plus application modules,” it has extended high-density plasma technology to applications such as ABF substrate dry etching, Hybrid Bonding pretreatment, FOPLP, wafer reclaim, and methane cracking, reducing the risks associated with fluctuations in a single industry cycle. Third, through Process as a Service (PaaS) and joint development programs (JDPs) with international Tier-1 customers, the company has shifted from pure equipment sales to becoming a customer process development partner, creating technology lock-in and higher switching costs. Fourth, in its intellectual property strategy, NEMS Technology adopts a parallel approach combining patents, trade secrets, and systematic ERP and PLM controls, while gradually strengthening its international patent portfolio and overseas market defense capabilities. Overall, this study argues that small and medium-sized high-tech equipment manufacturers do not necessarily have to compete through scale. Instead, they can establish irreplaceability through technological specialization, platform extension, customer co-creation, institutional upgrading, and dynamic adjustment. The case of NEMS Technology shows that when a company can continuously extend a single core technology platform into high-growth application markets while integrating public market governance, international customer certification, and global supply chain deployment, it can develop a growth model that combines technological depth and strategic flexibility amid industry volatility and international competition. |
| URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/103297 |
| DOI: | 10.6342/NTU202601986 |
| 全文授權: | 同意授權(全球公開) |
| 電子全文公開日期: | 2026-08-11 |
| 顯示於系所單位: | 會計與管理決策組 |
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| ntu-114-2.pdf | 3.11 MB | Adobe PDF | 檢視/開啟 |
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