Browsing by Subject (cu,ni)6sn5,surface diffusion,3d reconstruction,voiding rate,reliability,
Showing results 1 to 1 of 1
Publication Year | Title | Author(s) | Department |
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2020 | 銅錫鎳微焊點中介金屬的演化及孔洞再分佈問題的研究 IMCs evolution and voids redistribution in Cu/Sn/Ni micro bumps | Haiyang Yu; 于海洋 | 材料科學與工程學研究所 |