Browsing by Author 陳孟歆
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| Publication Year | Title | Author(s) | Department |
|---|---|---|---|
| 2014 | 3D IC 封裝中銅基材與無鉛銲料接點之介面反應 Interfacial Reactions Between Cu Substrates and Lead Free Solder for 3D IC Applications | Meng-Hsin Chen; 陳孟歆 | 材料科學與工程學研究所 |