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NTU Theses and Dissertations Repository
Browsing by Author 莊東漢(Tung-Han Chuang)
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Showing results 3 to 17 of 17
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Publication Year
Title
Author(s)
Department
2011
Si/Ni/In與Cu/Ag引腳架固晶接合研究
Die Bonding of Si/Ni/In with Cu/Ag Lead Frame
Yu-Jen Lin; 林育任
材料科學與工程學研究所
2022
功率模組晶背金屬層及銀奈米孿晶鍍膜開發與優化
Development and Optimization of Backside Metallization and Ag Nanotwinned Films for Power Modules
Po-Ching Wu; 吳柏慶
材料科學與工程學研究所
2014
固液擴散接合製作熱電模組之界面反應及其電性之研究
Interfacial Reactions and Electrical Properties of Thermoelectric Modules Manufactured with Solid-Liquid Interdiffusion Bonding
Wei-Ting Yeh; 葉威廷
材料科學與工程學研究所
2008
添加鍺對於含稀土錫銀銅銲錫之特性影響研究
The Effect of Germanium Additions on the Properties of SnAgCu-RE Solder
Chih-Chien Chi; 紀志堅
材料科學與工程學研究所
2013
熱電材料與銅電極之固液擴散接合研究
Thin Film Solid-Liquid Interdifusion Bonding of Thermoelectric Materials with Cu Electrode
Chung-Lin Yang; 楊忠霖
材料科學與工程學研究所
2019
純銀與高銀合金帶材對不同基板之超音波接合
Ultrasonic Bonding of Pure Ag and High Silver Alloy Ribbons on Various Substrates
Heng-Ming Chang; 張恆銘
材料科學與工程學研究所
2015
退火孿晶銀鈀合金線之熱穩定性及電遷移現象研究
Thermal Stability and Electromigration Durability of Annealing Twinned Ag-Pd alloy Wires
Hsin-Jung Lin; 林欣蓉
材料科學與工程學研究所
2016
鈀含量對銀合金銲線離子遷移之影響
Effect of Pd Content on Ion Migration of Ag-alloy Bonding Wires
Yu-Zhen He; 何禹箴
材料科學與工程學研究所
2014
銀合金銲球凸塊覆晶組裝可行性評估
Evaluations of the Applicability of Ag-alloy Stud Bump on Flip-Chip Assembly
Yu-Ting Shih; 施昱廷
材料科學與工程學研究所
2017
銀銲線之離子遷移與電化學腐蝕研究
Research for Ion Migration and Electrochemical Corrosion of Ag Bonding Wire
Chia-Tzu Tsai; 蔡佳恣
材料科學與工程學研究所
2018
電子封裝Ag-4Pd銀合金銲線之退火處理及電遷移材料特性與晶粒結構研究
Material Characteristics and Grain Structure of Electronic Packaging Ag-4Pd Bonding Wire under Electromigration and Annealing Treatment
Chun-Hao Chen; 陳俊豪
材料科學與工程學研究所
2013
電子封裝銀合金線之電遷移與退火晶粒結構研究
Electromigration and Annealing Grain Structure of Ag Alloy Wires for Electronic Packaging
Hsi-Ching Wang; 王璽清
材料科學與工程學研究所
2020
電子封裝高銀合金線材與帶材通電流及退火之晶粒結構研究
Study on the Grain Structure of Electronic Packaging of High Ag alloy Wire and Ribbon under Current Stressing and Annealing
Ju-Hui Chuang; 莊如慧
材料科學與工程學研究所
2006
電鍍鎳膜及Ni3Sn4介金屬化合物之反算測定
Characterization of Mechanical Properties of Electroplated Nickel Film and Ni3Sn4 Intermetallic Compound
Li-Jung Tai; 戴禮榮
應用力學研究所
2018
高溫超導體/錳氧化物異質結構之合成與特性研究
Synthesis and Characterization of High-Tc Superconductor/Manganite Heterostructure
Su Ling Cheng; 鄭淑齡
材料科學與工程學研究所