NTU Theses and Dissertations Repository: Browsing DSpace

Showing results 1 to 4 of 4

Publication Year	Title	Author(s)	Department
2012	3D IC 封裝中接點空間受限誘發之界面反應關鍵效應 Critical Issues in Soldering Reactions Arising from Space Confinement in 3D IC Packages	Hsin-Yi Chuang; 莊鑫毅	材料科學與工程學研究所
2012	熔融鉛與鉛錫合金穿透鎳基材晶界行為之研究 Grain Boundary Penetration of Various Types of Ni layers by Molten Pb and PbSn alloy	Chia-Yuan Chang; 張珈源	材料科學與工程學研究所
2010	覆晶封裝中銲料組成對兩界面反應之影響 The Effects of the Solder Composition on Interfacial Reactions in Flip-Chip Solder Joints	Chih-Chiang Chang; 張智強	材料科學與工程學研究所
2012	錫銅銲料與鎳基材之銲接反應研究：介金屬化合物的剝離防治、織構控制以及成長改質 Study on Soldering Reaction between Sn-Cu Solder and Ni UBMs: Prevention of Spalling, Control of Texture, and Modification of Growth of Intermetallics	Wei-Ming Chen; 陳偉銘	材料科學與工程學研究所

Showing results 1 to 4 of 4

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