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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 廖英志 | zh_TW |
| dc.contributor.advisor | Ying-Chih Liao | en |
| dc.contributor.author | 郭芳辰 | zh_TW |
| dc.contributor.author | Fang-Chen Kuo | en |
| dc.date.accessioned | 2024-08-09T16:14:31Z | - |
| dc.date.available | 2024-08-10 | - |
| dc.date.copyright | 2024-08-09 | - |
| dc.date.issued | 2024 | - |
| dc.date.submitted | 2024-07-17 | - |
| dc.identifier.citation | 1. Mu, G., et al., Low Temperature Cu/Ga Solid–Liquid Inter-Diffusion Bonding Used for Interfacial Heat Transfer in High-Power Devices. Metals, 2020. 10(9): p. 1223.
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/93892 | - |
| dc.description.abstract | 隨著對於具有高度人體相容性的穿戴式裝置的需求增加，對軟性印刷電路板（FPCB）的需求也持續增加。然而，傳統焊接工藝的高操作溫度會對多數軟性高分子基材與部分電子元件帶來熱損傷，也會造成多層封裝結構中焊點再融化的問題。因此，在低溫下仍具有流動性與基材潤濕性的液態金屬（LM）作為傳統焊接合金的替代方案被提出，透過固液相擴散機制（SLID bonding）接合金屬基材與元件金屬接腳。但液態金屬焊料同時也存在一些問題，包括液體滲漏和低機械性能等等。為了解決上述問題，本研究引入了一種仿汞齊合金的方法來實現液態金屬焊料的完全固化與機械性能強化。本研究通過將紅銅粉末與鎵銦錫（GaInSn）液態金屬混合，直至銅粉完全被液態金屬濕潤，來製備GaInSn/Cu複合焊料。GaInSn/Cu複合焊料在低溫下（70℃）即自發性發生化學反應，在內部產生固態的鎵銅與錫銅界金屬化合物，以及銦錫固溶體，達成焊接層固化。DSC分析顯示，在固化反應後，GaInSn/Cu複合焊料的熔點從約61.4℃提高到約106.3℃。證實了本研究的製程成功解決了焊點液體滲漏問題。為了優化GaInSn/Cu複合焊料，提升焊接點機械強度與縮短焊料固化時間，本研究參考了Ga-In-Sn三元相圖來調整GaInSn/Cu複合焊料的組成。從固化後的焊接點剪切焊接強度結果顯示，其剪切強度達到約19.5MPa，比組成調整前的的強度高出三個數量級。與其他液態金屬焊料研究[1]相比，本研究的焊料在小30℃的操作溫度下，達成約3倍的強度。此外，試與塗佈了拉伸導電膠的軟性基板PET及PE纖維進行低溫焊接製程，經過功能性與彎折拉伸耐受性測試，驗證本研究開發的GaInSn/Cu複合焊料在低溫焊接製程的可行性，推進了FPCB的表面貼裝技術。 | zh_TW |
| dc.description.abstract | As the demand for wearable devices with high human compatibility increases, so does the demand for Flexible Printed Circuit Boards (FPCBs). However, the high operating temperatures of traditional soldering processes can cause thermal damage to most flexible polymer substrates and some electronic components, and can lead to re-melting of solder joints in hierarchy packaging structures. Therefore, as an alternative to conventional solder alloys, liquid metal (LM) with fluidity and reactive-wettability at low temperatures has been proposed. This approach, known as Solid-Liquid Interdiffusion (SLID) bonding, bonds metal substrates and electronic components using LM, avoiding the issues associated with high-temperature soldering.
However, LM soldering composite also presents challenges such as liquid leakage and low mechanical performance. To address these issues, this study introduces amalgamation-inspired method to achieve complete solidification and enhanced mechanical properties of LM soldering composite. By mixing copper powders with GaInSn until the copper powders are fully wetted by LM, the GaInSn/Cu soldering composite is prepared. The GaInSn/Cu soldering composite undergoes a spontaneous reaction at low temperatures (70°C), forming Ga-Cu and Sn-Cu intermetallic compounds and In-Sn solid solution, thereby solidifying the solder joint. Differential Scanning Calorimetry (DSC) analysis shows that after solidification, the melting point of GaInSn/Cu soldering composite shifts from 61.4°C to 106.3°C, confirming the successful prevention of solder liquid leakage issues. Additionally, X-ray Diffraction (XRD) analysis verifies the compositional changes within the GaInSn/Cu composite solder. To optimize the GaInSn/Cu soldering composite for improved shear strength of solder joints and shortened solder solidification time, this study adjusts the composition of GaInSn/Cu soldering composite based on the Ga-In-Sn ternary phase diagram. The shear strength of solder joints in this study reaches approximately 19.5 MPa, which is three orders of magnitude higher after composition adjustment. Compared to the LM solder in other studies, the shear strength of solder joint in this study achieves about three times higher with an operating temperature 30°C lower. Furthermore, the feasibility of the GaInSn/Cu soldering composite in low-temperature soldering processes is validated through functional and endurance tests on flexible substrates such as PET (Polyethylene Terephthalate) and PE (Polyethylene) fibers coated with stretchable conductive adhesive. The result confirms advancements in surface-mount technology for FPCBs driven by this study. | en |
| dc.description.provenance | Submitted by admin ntu (admin@lib.ntu.edu.tw) on 2024-08-09T16:14:31Z No. of bitstreams: 0 | en |
| dc.description.provenance | Made available in DSpace on 2024-08-09T16:14:31Z (GMT). No. of bitstreams: 0 | en |
| dc.description.tableofcontents | 致謝 i
摘要 ii Abstract iii 目次 v 圖次 viii 表次 xi 第1章 緒論 1 1.1 研究背景與動機 1 1.2 研究目的 2 1.3 論文架構 2 第2章 文獻回顧 3 2.1 軟性電子 3 2.1.1 軟性印刷電路基板的熱損害 3 2.1.2 多層封裝技術的熱損害 6 2.1.3 電子元件的熱損害 7 2.2 軟性印刷電路板元件封裝技術 8 2.2.1 壓力型連接器 9 2.2.2 金屬線車縫 (Embroidery) 9 2.2.3 接著膠 (Adhesive) 10 2.2.4 焊接 (Soldering) 12 2.3 液態金屬基底焊料 25 2.3.1 鎵基底液態金屬性質 25 2.3.2 固液相擴散接合機制 27 2.3.3 仿汞齊合金之鎵基底合金膠 28 2.3.4 液態金屬應用於元件焊接之實例 30 2.4 肌電感測穿戴式裝置 33 第3章 實驗系統程序 36 3.1 實驗藥品與儀器介紹 36 3.1.1 實驗藥品 36 3.1.2 實驗儀器 37 3.2 實驗流程 38 3.2.1 液態金屬低溫焊接膠製備與固化反應步驟 38 3.2.2 基板潤濕性測試 39 3.2.3 相變化檢測 40 3.2.4 機械性質測試 40 3.2.5 電性質測試 42 3.2.6 焊接膠塗佈與應用 42 第4章 結果與討論 44 4.1 表面處理提升液態金屬潤濕性 44 4.2 優化焊接膠配方提升焊接強度 46 4.2.1 共晶液態金屬作為焊接膠的固化困難 46 4.2.2 添加銅粉對於焊接點強度之提升 49 4.2.3 液態金屬配方調整 53 4.2.4 銅粉與液態金屬比例調整 61 4.3 優化固化反應參數提升焊接強度 64 4.3.1 反應時間參數調整 64 4.3.2 反應溫度參數調整 65 4.4 焊接膠應用 67 4.4.1 功能性測試 67 4.4.2 彎折耐受性測試 68 4.4.3 穿戴式肌電感測腿套 70 第5章 結論與未來展望 73 參考資料 74 | - |
| dc.language.iso | zh_TW | - |
| dc.subject | 低溫焊接膠 | zh_TW |
| dc.subject | 元件表面黏貼技術 | zh_TW |
| dc.subject | 軟性印刷電路板 | zh_TW |
| dc.subject | 液態金屬 | zh_TW |
| dc.subject | Liquid metal | en |
| dc.subject | Low-temperature soldering paste | en |
| dc.subject | Surface-mount technology | en |
| dc.subject | Flexible printed circuit board | en |
| dc.title | 應用於軟性印刷電路板表面貼焊技術之超低回焊溫度液態金屬基底焊料 | zh_TW |
| dc.title | Liquid Metal Soldering Composite with Ultra-low Reflow Temperature for Surface-mount Technology of Flexible Printed Circuit Board | en |
| dc.type | Thesis | - |
| dc.date.schoolyear | 112-2 | - |
| dc.description.degree | 碩士 | - |
| dc.contributor.oralexamcommittee | 高振宏;陳志銘 | zh_TW |
| dc.contributor.oralexamcommittee | Chen-Hung Kao;Chih-Ming Chen | en |
| dc.subject.keyword | 軟性印刷電路板,元件表面黏貼技術,液態金屬,低溫焊接膠, | zh_TW |
| dc.subject.keyword | Flexible printed circuit board,Surface-mount technology,Liquid metal,Low-temperature soldering paste, | en |
| dc.relation.page | 82 | - |
| dc.identifier.doi | 10.6342/NTU202401853 | - |
| dc.rights.note | 同意授權(全球公開) | - |
| dc.date.accepted | 2024-07-18 | - |
| dc.contributor.author-college | 工學院 | - |
| dc.contributor.author-dept | 化學工程學系 | - |
| dc.date.embargo-lift | 2029-07-16 | - |
| 顯示於系所單位： | 化學工程學系 | |
文件中的檔案：
| 檔案 | 大小 | 格式 | |
|---|---|---|---|
| ntu-112-2.pdf 此日期後於網路公開 2029-07-16 | 5.63 MB | Adobe PDF |
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