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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/91700完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 謝德宗 | zh_TW |
| dc.contributor.advisor | Der-tzon Hsieh | en |
| dc.contributor.author | 李明杰 | zh_TW |
| dc.contributor.author | Ming-Chieh Lee | en |
| dc.date.accessioned | 2024-02-22T16:18:10Z | - |
| dc.date.available | 2024-02-23 | - |
| dc.date.copyright | 2024-02-22 | - |
| dc.date.issued | 2024 | - |
| dc.date.submitted | 2024-02-01 | - |
| dc.identifier.citation | 1. 謝德宗(2015),《財務管理》,五南出版社,2015/10。
2. 彭茂榮等著(2017),《2017 半導體產業年鑑》,工研院產經所,2017/7。 3. 江柏風等著(2018),《2018 半導體產業年鑑》,工研院產科國際所,2018/7。 4. 江柏風等著(2019),《2019 半導體產業年鑑》,工研院產科國際所,2019/7。 5. 江柏風等著(2020),《2020 半導體產業年鑑》,工研院產科國際所,2020/7。 6. 江柏風等著(2021),《2021 半導體產業年鑑》,工研院產科國際所,2021/7。 7. 鄧靖江(2009),《中小型IC 通路商轉型策略研究-以個案公司為例》,台大管理學院碩士在職專班碩士論文,2009/5。 主要網路參考資料 1. 國際半導體協會SEMI,https://www.semi.org/zh 2. 半導體貿易統計協會WSTS,https://www.wsts.org/ 3. 台積電官網,https://www.tsmc.com/chinese 4. 公開資訊觀測站,https://mops.twse.com.tw/ 5. 科技產業資訊室,https://iknow.stpi.narl.org.tw/ 6. DIGITIMES 科技網,https://www.digitimes.com.tw/ | - |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/91700 | - |
| dc.description.abstract | 本研究藉由產業面的發展歷程與上市櫃公司財務數據,探討半導體產業上中下游公司的營運特性與差異,透過分析產業上下游公司的特性,利用財務比率與發展歷程的比較,來看面對市場競爭不同的發展策略。
結果發現,半導體高階製程龐大的資本支出雖讓一部分對手退出,但也引起國際大廠覬覦,高調宣布加入競爭。而台積電藉由在晶圓代工領先優勢,除了繼續深化技術研發,也已將本身財務體質調整至具競爭力的狀態來面對競爭。除了半導體產業上的傳統挑戰,半導體業者還須面對來自家園經濟學(Homeland Economics)、產業鏈低碳永續等外部環境的變化,以及台灣五缺:缺才、缺工、缺水、缺地、缺電等內部環境等議題。 | zh_TW |
| dc.description.abstract | This study uses the development history of the industry and the financial data of listed companies to explore the operating characteristics and differences of the upstream, midstream and downstream companies in the semiconductor industry. By analyzing the characteristics of the upstream and downstream companies in the industry, and using the comparison of financial ratios and development history, viewing the different development strategies in the face of market competition.
It was found that although the huge capital expenditures for high-end semiconductor manufacturing processes have caused some competitors to withdraw, it has also attracted the covetous attention of major international manufacturers, who have announced in a high-profile way that they will join the competition. Taking advantage of its leading position in foundry, TSMC has not only continued to deepen technology research and development, but has also adjusted its financial structure to a competitive position to face competition. In addition to the traditional challenges in the semiconductor industry, semiconductor companies must also face changes in the external environment such as Homeland Economics, low-carbon sustainability of the industrial chain, and Taiwan's five shortages: shortage of talents, shortage of workers, shortage of water, and shortage of water. Ground, lack of power and other internal environment issues. | en |
| dc.description.provenance | Submitted by admin ntu (admin@lib.ntu.edu.tw) on 2024-02-22T16:18:09Z No. of bitstreams: 0 | en |
| dc.description.provenance | Made available in DSpace on 2024-02-22T16:18:10Z (GMT). No. of bitstreams: 0 | en |
| dc.description.tableofcontents | 口試委員會審定書……………………………………………………………… i
誌謝………………………………………………………………………………. ii 中文摘要………………………………………………………………………… iii ABSTRACT ……………………………………………………………………. iv 目次………………………………………………………………………………. v 圖次…………………………………………………………………………… vii 表次…………………………………………………………………………… ix 第一章 緒論…………………………………………………………………….. 1 1.1 研究背景與動機………………………………………………………… 1 1.2 研究目的………………………………………………………………… 4 1.3 研究架構………………………………………………………………… 4 第二章 台灣半導體產業經營模式探討……………………………………….. 6 2.1 半導體產業分類與產業特性…………………………………………… 6 2.2 台灣半導體業現況與發展………………………………………………. 10 第三章 台灣半導體產業結構探討.…………………………………………… 11 3.1 半導體產業鏈結構.………………………………………………………. 12 3.2 半導體產業中的次產業分析……………………………………………. 14 3.2.1 IC 設計業…………………………………………………………… 14 3.2.2 IC 製造業…………………………………………………………… 19 3.2.3 封裝測試業………………………………………………………… 25 3.2.4 IC 通路業…………………………………………………………… 30 第四章 個案分析.……………………………………………………………… 34 4.1 個案選擇………………………………………………………………... 34 4.2 台積電公司分析………………………………………………………... 35 4.2.1 台積電與台灣晶圓廠業者營運指標分析………………………… 40 4.2.2 台積電與台灣半導體領導業者營運指標分析…………………… 44 4.3 台灣半導體產業的未來與挑戰………………………………………... 52 第五章 結論與建議……………………………………………………………. 54 參考文獻…………………………………………………………………………… 56 | - |
| dc.language.iso | zh_TW | - |
| dc.subject | 晶圓代工 | zh_TW |
| dc.subject | 半導體產業 | zh_TW |
| dc.subject | 財務比率 | zh_TW |
| dc.subject | 封裝測試 | zh_TW |
| dc.subject | IC設計 | zh_TW |
| dc.subject | IC design | en |
| dc.subject | packaging and testing | en |
| dc.subject | financial ratios | en |
| dc.subject | foundry | en |
| dc.subject | semiconductor industry | en |
| dc.title | 臺灣半導體產業結構的發展與挑戰 | zh_TW |
| dc.title | The Development and Challenges of the Structure of Semiconductor Industry in Taiwan | en |
| dc.type | Thesis | - |
| dc.date.schoolyear | 112-1 | - |
| dc.description.degree | 碩士 | - |
| dc.contributor.oralexamcommittee | 林惠玲;李顯峰;賴錦璋 | zh_TW |
| dc.contributor.oralexamcommittee | Hui-Lin Lin;Hsien-Feng Lee;Chin-Chang Lai | en |
| dc.subject.keyword | 半導體產業,晶圓代工,IC設計,封裝測試,財務比率, | zh_TW |
| dc.subject.keyword | semiconductor industry,foundry,IC design,packaging and testing,financial ratios, | en |
| dc.relation.page | 56 | - |
| dc.identifier.doi | 10.6342/NTU202400334 | - |
| dc.rights.note | 同意授權(全球公開) | - |
| dc.date.accepted | 2024-02-04 | - |
| dc.contributor.author-college | 社會科學院 | - |
| dc.contributor.author-dept | 經濟學系 | - |
| 顯示於系所單位: | 經濟學系 | |
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|---|---|---|---|
| ntu-112-1.pdf | 3.2 MB | Adobe PDF | 檢視/開啟 |
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