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DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 吳文中(Wen-Jong Wu) | |
dc.contributor.advisor | 吳文中(Wen-Jong Wu | wjwu@ntumems.net | ), | |
dc.contributor.author | Yi-Yen Liu | en |
dc.contributor.author | 劉亦晏 | zh_TW |
dc.date.accessioned | 2023-03-20T00:14:32Z | - |
dc.date.copyright | 2022-09-30 | |
dc.date.issued | 2022 | |
dc.date.submitted | 2022-09-26 | |
dc.identifier.citation | [1] Cellular Networks for Massive IoT: Enabling Low Power Wide Area Applications, Stockholm, Sweden, pp. 1-13, 2016. [2] K. Shafique, B. A. Khawaja, F. Sabir, S. Qazi and M. Mustaqim, 'Internet of Things (IoT) for Next-Generation Smart Systems: A Review of Current Challenges, Future Trends and Prospects for Emerging 5G-IoT Scenarios,' in IEEE Access, vol. 8, pp. 23022-23040, 2020, doi: 10.1109/ACCESS.2020.2970118. [3] R. Amirtharajah and A. P. Chandrakasan, 'Self-powered signal processing using vibration-based power generation,' in IEEE Journal of Solid-State Circuits, vol. 33, no. 5, pp. 687-695, May 1998, doi: 10.1109/4.668982. [4] Onianwa, P., Fakayode, S. Lead Contamination of Topsoil and Vegetation in the Vicinity of a Battery Factory in Nigeria. Environmental Geochemistry and Health 22, 211–218 (2000). [5] Roundy, S., Wright, P. K., & Rabaey, J. (2003). A study of low level vibrations as a power source for wireless sensor nodes. Computer communications, 26(11), 1131-1144. [6] Roundy, S., & Wright, P. K. (2004). A piezoelectric vibration based generator for wireless electronics. Smart Materials and structures, 13(5), 1131. [7] Lin, S. C., & Wu, W. J. (2013). Piezoelectric micro energy harvesters based on stainless-steel substrates. Smart Materials and Structures, 22(4), 045016. [8] Tu, King-Ning, and Yingxia Liu. 'Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology.' Materials Science and Engineering: R: Reports 136 (2019): 1-12. [9] 柯冠宇.”具可調頻功能之微型壓電能量擷取器真空封裝設計開發.” 臺灣大學工程科學及海洋工程學研究所學位論文 (2021): 1-80 [10] Kiele, Patrick, et al. 'Design of experiment evaluation of sputtered thin film platinum surface metallization on alumina substrate for implantable conductive structures.' 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC). IEEE, 2017. [11] Jaafar, Norhanani Binte, and Chong Ser Choong. 'Comprehensive Study of Tin-Silver-Copper Lead-Free Alloys on Various Bond Pad Metallisation.' 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC). IEEE, 2019. [12] Ebersberger, B., & Lee, C. (2008, May). Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects. In 2008 58th Electronic Components and Technology Conference (pp. 59-66). IEEE. [13] Shih, T. I., Lin, Y. C., Duh, J. G., & Hsu, T. (2006). Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests. Journal of electronic materials, 35(10), 1773-1780. [14] Curie, J., & Curie, P. (1880). Développement par compression de l'électricité polaire dans les cristaux hémièdres à faces inclinées. Bulletin de minéralogie, 3(4), 90-93. [15] Hankel, W. G. (1881). Über die aktino-und peizoelektrischen Eigenschaften des Bergkrystalles und ihre Beziehung zu den thermoelektrischen. S. Hirzel. [16] Dineva, P., Gross, D., Müller, R., & Rangelov, T. (2014). Piezoelectric materials. In Dynamic fracture of piezoelectric materials (pp. 7-32). Springer, Cham. [17] Lippmann, G. (1881). Principe de la conservation de l'électricité, ou second principe de la théorie des phénomènes électriques. Journal de Physique Théorique et Appliquée, 10(1), 381-394. [18] Brinker, C. J., & Scherer, G. W. (2013). Sol-gel science: the physics and chemistry of sol-gel processing. Academic press. [19] Barrow, D. A., Petroff, T. E., Tandon, R. P., & Sayer, M. (1997). Characterization of thick lead zirconate titanate films fabricated using a new sol gel based process. Journal of Applied Physics, 81(2), 876-881. [20] Basit N A, Kim H K 1995 J Vac. Sci. Technol. A. 13 2214-20 [21] Shilpa, G. D., Sreelakshmi, K., & Ananthaprasad, M. G. (2016, September). PZT thin film deposition techniques, properties and its application in ultrasonic MEMS sensors: A review. In IOP Conference Series: Materials Science and Engineering (Vol. 149, No. 1, p. 012190). IOP Publishing. [22] Wasa, K., Kitabatake, M., & Adachi, H. (2004). Thin film materials technology: sputtering of control compound materials. Springer Science & Business Media. [23] Morita, T. (2010). Piezoelectric materials synthesized by the hydrothermal method and their applications. Materials, 3(12), 5236-5245. [24] Walter, V., Delobelle, P., Le Moal, P., Joseph, E., & Collet, M. (2002). A piezo-mechanical characterization of PZT thick films screen-printed on alumina substrate. Sensors and Actuators A: Physical, 96(2-3), 157-166. [25] Hindrichsen, C. C., Almind, N. S., Brodersen, S. H., Lou-Møller, R., Hansen, K., & Thomsen, E. V. (2010). Triaxial MEMS accelerometer with screen printed PZT thick film. Journal of electroceramics, 25(2), 108-115. [26] Akedo, J. (2006). Aerosol deposition of ceramic thick films at room temperature: densification mechanism of ceramic layers. Journal of the American Ceramic Society, 89(6), 1834-1839. [27] Baba, S., & Akedo, J. (2009). Fiber laser annealing of nanocrystalline PZT thick film prepared by aerosol deposition. Applied surface science, 255(24), 9791-9795. [28] Lin, S. C., & Wu, W. J. (2013). Piezoelectric micro energy harvesters based on stainless-steel substrates. Smart Materials and Structures, 22(4), 045016. [29] Chen, C. T., Fu, Y. H., Tang, W. H., Lin, S. C., & Wu, W. J. (2018, March). The output power improvement and durability with different shape of MEMS piezoelectric energy harvester. In Smart Structures and NDE for Industry 4.0 (Vol. 10602, p. 106020N). International Society for Optics and Photonics. [30] Lin, S. C., & Wu, W. J. (2013). Fabrication of PZT MEMS energy harvester based on silicon and stainless-steel substrates utilizing an aerosol deposition method. Journal of Micromechanics and Microengineering, 23(12), 125028. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/86738 | - |
dc.description.abstract | 隨著科技不斷進步,文明生活中不乏許許多多的電子產品、攜帶式裝置伴隨左右,因此,能量需求亦是同步增長。壓電材料是可以將物體應變轉換成電能的一種材料,若是可以將環境中相對穩定的振動源之振動做應用,勢必是一個具有發展潛力的發電方式。 本研究使用本團隊製程技術成熟的懸臂樑式壓電能量擷取器,但根據本團隊過去研究:極化後焊接會導致輸出電壓下降44%,輸出功率下降69%。因此本研究提出先焊接後極化的方法,避免去極化的狀況發生。並且在成功焊接至PCB板後,輸出表現沒有因為焊接而下降,常壓狀況焊接後輸出電壓上升18%,輸出功率上升40%。已焊接元件匹配最佳阻抗之輸出電壓與功率為:輸出電壓為2.82V,輸出功率為9.94μW;真空狀況焊接後輸出電壓上升19%,輸出功率上升42%。已焊接元件匹配最佳阻抗之輸出電壓與功率為:輸出電壓為3.65V,輸出功率為16.7μW。為達成此目標首先需要研究電極層,突破不鏽鋼不能焊接的困難。 主要的研究脈絡首先透過改變表層電極層尋找可以焊接且穩定的電極層,測試電極層機械強度的方式為進行拉力試驗,根據國際電子工業聯接協會(Association Connecting Electronics Industries, ICP)規定推算在本應用中200gw為判斷足夠強的標準,電極層耐熱溫度標準為520度,是實際退火承受製程中的最高溫度,測試成功的電極才進入焊接階段,匹配最佳阻抗量測輸出功率,探討本研究提出的新式導出電極訊號方式是否導致輸出降低。 | zh_TW |
dc.description.abstract | With the advancement of science and technology, there are many electronic products and portable devices in the civilized life. Therefore, the energy demand is also increasing at the same time. Piezoelectric material is a material that can convert the strain into electrical energy. If the vibration of a relatively stable source of vibration can be applied, it is bound to be the way to get electricity for the development potential. This study is based on the micro piezoelectric energy harvester with mature process technology of our team. According to the past research of our team: soldering after polarization leads to a 44% drop in output voltage and a 69% drop in output power. Therefore, this study proposes a method of first soldering and then polarization to avoid depolarization. And after successfully soldering to the PCB, the output performance did not decrease due to soldering. The output voltage increased 18% and the output power increased 40% after soldering under normal pressure. The output voltage is 2.82V and the output power is 9.94μW. The output voltage increased 19% and the output power increased 42% after soldering under vacuum. The output voltage is 3.65V and the output power is 16.7μW. In order to achieve this goal, the top priority is to research the electrode layer, to break through the difficulty that stainless steel cannot be soldered. The main research context is first to find a solderable and stable electrode by changing the surface electrode layer. The way to confirm the mechanical strength is the pull-off test. According to the standard of Association Connecting Electronics Industries (ICP), the strength better than 200gw is adequate. The temperature resistance standard of the electrode layer is 520 degrees, which is the highest temperature in the actual annealing. Only the electrodes which have been successfully tested achieve the soldering. Then, match the optimal impedance to measure output power. It is discussed whether the new method of extending electrode signals proposed in this study leads to a decrease in output or not. | en |
dc.description.provenance | Made available in DSpace on 2023-03-20T00:14:32Z (GMT). No. of bitstreams: 1 U0001-2807202116145800.pdf: 1479195 bytes, checksum: 496853c2fe64fdd4c60787bbbd02f1c2 (MD5) Previous issue date: 2022 | en |
dc.description.tableofcontents | 目 錄 致謝 i 中文摘要 ii Abstract iii 目 錄 iv 圖目錄 vii 表目錄 x Chapter 1 緒論 1 1.1 研究動機 1 1.2 文獻回顧 4 1.3 論文目標 7 1.4 論文架構 7 Chapter 2 壓電效應介紹 9 2.1 壓電材料起源 9 2.2 壓電效應 9 2.3 壓電材料種類 10 2.4 壓電膜製程 11 2.4.1 溶膠凝膠法 (sol-gel method) 12 2.4.2 濺鍍法 (sputtering method) 12 2.4.3 水熱合成法 (Hydrothermal method) 13 2.4.4 網版印刷法 (Screen printing method) 14 2.4.5 氣膠沉積法 (Aerosol deposition method) 14 2.4.6 壓電膜沉積方式比較 15 Chapter 3 壓電能量擷取器製程 17 3.1 微機電製程 17 3.1.1 不鏽鋼機板前處理 19 3.1.2 壓電層光阻定義 19 3.1.3 沉積壓電層 19 3.1.4 電極層光阻定義 20 3.1.5 電極層沉積 20 3.1.6 蝕刻光阻定義 20 3.1.7 王水蝕刻 21 3.2 氣膠沉積法 21 3.3 壓電膜退火 22 3.4 極化 23 Chapter 4 不同電極層討論 25 4.1 上電極選用 26 4.1.1 鈦/白金(20nm/200nm) 26 4.1.2 鈦/白金/鈦/銅/鎳(20nm/200nm/20nm/500nm/200nm) 26 4.2 下電極選用 27 4.2.1 鈦/白金(20nm/200nm) 27 4.2.2 鈦/白金/鈦/銅/鎳(20nm/200nm/20nm/500nm/200nm) 27 Chapter 5 不同電極層拉力測試結果討論 29 5.1 上錫球方法 29 5.2 拉力測試架設 30 5.3 上電極拉力測試 31 5.3.1 鈦/白金(20nm/200nm)拉力測試 31 5.3.2 鈦/白金/鈦/銅/鎳(20nm/200nm/20nm/500nm/200nm)電極層拉力測試 32 5.4 下電極拉力測試 33 5.4.1 鈦/白金(20nm/200nm)拉力測試 33 5.4.2 鈦/白金/鈦/銅/鎳(20nm/200nm/20nm/500nm/200nm)電極層拉力測試 34 5.5 不同電極層比較 35 Chapter 6 元件測量與結果討論 37 6.1 焊接至PCB板 37 6.2 量測儀器架設圖 39 6.3 量測夾具 40 6.4 元件掃頻圖 42 6.5 元件最佳阻抗匹配 45 Chapter 7 結論及未來展望 50 7.1 結論 50 7.2 未來展望 50 參考文獻 52 | |
dc.language.iso | zh-TW | |
dc.title | 微型壓電能量擷取器封裝至PCB技術開發 | zh_TW |
dc.title | The Development of Micro Piezoelectric Energy Harvester Packaged to PCB | en |
dc.type | Thesis | |
dc.date.schoolyear | 110-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 謝志文(Chih-Wen Hsieh),李世光(Chih-Kung Lee),黃育熙(Yu-Hsi Huang) | |
dc.subject.keyword | 壓電能量擷取器,異質介面接合,不鏽鋼焊接,微機電製程,電極改善, | zh_TW |
dc.subject.keyword | Heterogeneous Bonding,MEMS,Stainless Steel,Energy harvester,Electrode improvement, | en |
dc.relation.page | 53 | |
dc.identifier.doi | 10.6342/NTU202101855 | |
dc.rights.note | 同意授權(全球公開) | |
dc.date.accepted | 2022-09-27 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 工程科學及海洋工程學研究所 | zh_TW |
dc.date.embargo-lift | 2022-09-30 | - |
顯示於系所單位: | 工程科學及海洋工程學系 |
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